• Journal of Welding and Joining
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• v.19 no.2
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• pp.191-199
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• 2001

The oxidation and recrystallization behaviors of Ni-base single crystal superalloy, CMSX-2 were investigated to determine the condition of the preparation for transient liquid phase (TLP) bonding operations. The faying surfaces of CMSX-2 were worked by the shot peening, fine cutting and mechanical polishing treatments and the degree of working of treated surfaces was evaluated by the hardness test and X-ray diffraction method CMSX-2 was heat-treated at 1,173∼1.589k for 3.6ks in vacuum of 4mPa. The mechanically polished surface was slightly oxidized after heat treatment even in the vacuum atmosphere of 4mPa. The thickness of an oxide film increased with increasing the heating temperature and the surface roughness of the faying surface. Recrystallization occurred at the surface after heat treatment at above 1,423K when the hardness was increased more than Hv600 by the shot peening treatment while the mechanically polished or fine cut surfaces didn't recrystallized. Based on these results, it was clearfied that the mechanically polishing with fine abrasive grit could be used for the preparation of faying surface of CMSX-2 before bonding operation.

• Journal of Welding and Joining
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• v.19 no.3
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• pp.325-333
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• 2001

The effect of base metal grain size on isothermal solidification behavior of Ni-base superalloy, CMSX-2 during transient liquid phase (TLP) bonding was investigated employing MBF-80 insert metal. TLP-bonding of single crystal. coarse-grained and fine-grained CMSX-2 was carried out at 1373∼1548k for various holding time in vacuum. The eutectic width diminished linearly with the square root of holding time during isothermal solidification process for single crystal, coarse-grained and fine-grained base metals. The completion time for isothermal solidification decreased in the order ; single crystal, coarse-grained and fine-grained base metals. The difference of isothermal solidification rates produced when bonding the different base metals could be explained quantitatively by the effect of base metal grain boundaries on the apparent average diffusion coefficient of boron in CMSX-2.

• Proceedings of the KWS Conference
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• 1997.05a
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• pp.201-202
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• 1997

• Proceedings of the KWS Conference
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• 1998.10a
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• pp.213-215
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• 1998

• Journal of Welding and Joining
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• v.19 no.1
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• pp.75-81
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• 2001

The metallurgical study of microconstituents in transient liquid phase bonded joints of Ni-base single crystal superalloys, CMSX-2 and CMSX-4 was investigated employing MBF-80 insert metal. TLP bonding of specimens was carried out at 1,373~1,523K for 0~19.6ks in vacuum. Three types of microconstituents ; needle-like constituent, dot-like constituent and abnormal shape constituent were formed in the bonded interlayer during TLP bonding operation. All these microconstituents were identified as boride. Microconstituents contain a large percentage of Cr in the early stage of bonding. As increasing the holding time, the amount of Cr was decreased and the amount of W, Co and Re were increased. From the analysis results of electron diffraction pattern by TEM, composition of elements in microconstituents were into MBlongrightarrowM$_{5}$B$_3$longrightarrowM$_2$B type with the increased in holding time. It can be explained by the fact that the relative amount of boron in microconstituents was decreased when the holding time was increased.d.

• Journal of Welding and Joining
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• v.19 no.1
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• pp.82-87
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• 2001

The creep-rupture and low cycle fatigue properties of transient liquid phase bonded joints of Ni-base single crystal superalloy, CMSX-2 was investigated using MBF-80 insert metal. The (100) orientation of bonded specimen was aligned perpendicular to the joint interface. CMSX-2 was bonded at 1523K for 1.8ks in vacuum, optimum bonding condition. The creep rupture strength and rupture lives of the joints were the almost identical to ones of the base metal. SEM observation of the fracture surfaces of joints after creep rupture test revealed that the fracture surfaces classified three types of region, ductile fracture surface, cleavage fracture surface and interfacial fracture surface. The low cycle fatigue properties of the joints were also the same level as those of base metal. The elongation and reduction of area values of joints were comparable to those of base metal while fell down on creep rupture condition of high temperature.

• Resources Recycling
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• v.19 no.5
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• pp.25-30
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• 2010

Leaching of CMSX-4 superalloy was done in hydrochloric acid solutions. The leaching behaviors of main alloy components, such as Ni, Co, Cr, Al, was investigated by controlling acid concentration, temperature, leaching time and pulp density. Increasing acid concentration enhanced the leaching rate till the rate decreased over 3 M acid concentration. Raising temperature increased the leaching amount of the metal components. After the leaching for 60 minutes at $90^{\circ}C$ and 10 g/L pulp density in 4 M acid solution, 93.2% nickel, 89.9% aluminum, 80.4% cobalt, and 79.1% chromium were leached. Nickel and aluminum were preferentially leached out, while the leaching rate of cobalt and chromium were relatively high only after 60 minutes, Increasing pulp density lowered the leaching rate and especially serious on cobalt and chromium, The optimum leaching condition for CMSX-4 was obtained at $90^{\circ}C$, 120 minutes, and less than 125 g/L in 4 M hydrochloric acid solution.

• Journal of Welding and Joining
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• v.18 no.3
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• pp.106-113
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• 2000

Single crystallization behavior ad high temperature tensile properties of TLP bonded joints of Ni-base single crystal superalloy, CMSX-2 were investigated using MBF-80 and F-24 insert metals. CMSX-2 was bonded at 1523~1548K for 1.5~1.8ks in vacuum. The (100) orientation of bonded specimen was aligned perpendicular to the joint interface. Crystallographic orientation analyzed points over the bonded region possessed the almost same orientation across the joint interface and misorientation $\Delta^{\theta}$ was negligibly small in as-bonded and post-bond heat-treated situations. It was confirmed that single crystallization could be readily achieved during TLP bonding. The tensile strengths of all joints at elevated temperatures were equal to or greater than those of base metal the range of testing temperature between 923K and 1173K. The elongation and reduction of area in values were almost the same as those of base metal. SEM observation of the fracture surfaces of joints after tensile test revealed that the fracture surface indicated the similar morphologies each other, and that the fracture of joints occurred in the base metal in any cases.

• 연구논문집
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• s.23
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• pp.15-27
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• 1993

The single crystal specimens were solidified by modified Bridgeman method. The surface recrystallized single crystal specimens were prepared by shot peening followed by heat treatment. The surface recrystallization begins at the dendrite cores on the surface. The recrystallized grains grew into the inner side of the specimen. The growth of recrystallized grains was inhibited by the pores and eutectic phases. The primary $\gamma'$ phases were dissolved at the recrystallized grain boundaries during the grain growth. The grain growth of recrystallized grains was similar to the cellular type transformation. No orientation relationships were found bewteen the recrystallized grains and the parent phase.

• Proceedings of the Materials Research Society of Korea Conference
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• 2008.11a
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• pp.37.2-37.2
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• 2008