• Clean Technology
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• v.14 no.2
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• pp.103-109
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• 2008

In this study, in order to develop evaluation method of the cleaning efficiency of residual flux which remains on the surface after soldering with solder paste, a specially designed metal tool is used to reduce spread uncertainty of flux while soldering. Using this tool, the measurement of cleaning efficiency of flux after soldering for some typical alternative semi-aqueous cleaners and 1,1,1-TCE by weighing method was conducted. As the test result of cleaning efficiency for each cleaner at several different cleaning times, the precision of the data is confirmed to within about 4% relative standard deviation (RSD) range. So, it is considered that this would be a good evaluation method for evaluating the cleaning efficiency of the residual flux which remains after solder paste soldering in the alternative cleaning. The results of this test method shows that the cleaning efficiency of ST 100SX and Neozal 750H in the cleaning of residual flux was better than other semi-aqueous cleaners, but its cleaning efficiency was clearly inferior to 1,1,1-TCE.

• Clean Technology
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• v.18 no.1
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• pp.43-50
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• 2012

Cleaning procedure of solar silicon wafer, following ingot sawing process in solar cell production is studied. Types of solar silicon wafer can be divided into monocrystalline or multicrystalline, and slurry sawn wafer or diamond sawn wafer according to the ingot growing methods and the sawing methods, respectively. Wafer surface and contaminants can vary with these methods. The characterisitics of contaminants and wafer surface are investigated for each cleaning substrate, and appropriate cleaning agents are developed. Physical properties and cleaning ability of the cleaning agents are evaluated in order to verify the application in the industry. The wafers cleaned with the cleaning agents do not show any residual contaminants when analyzed by XPS and regular patterns are formed after texturization. Furthermore, the cleaning agents are applied in the production industry, which shows superior cleaning results compared to the existing cleaning agents.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.3
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• pp.1016-1022
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• 2010

An Experimental study of cleaning solution has been performed on a high capacity steam boiler burning heavy fuel oil to on-line cleaning of deposit. The deposit is mixture of soot, slag, ash, metal oxide and clinker. The traditional technology of deposit cleaning was carried hand-crafted. The conventional technology of boiler cleaning method is mechanical removal by the worker while the boiler shut down operation. In this experiment, the deposit of mixture of soot, slag, ash, metal oxide and clinker has been removed by the cleaning agents without shut down of boiler burning. This study found out the optimum cleaning solution composition. The best results have been obtained when the mixture of ammonium nitrate and $MgNO_3$ were used in cleaning solution. The various transition metal effect was investigated for optimum mixing condition. In this research, the metal compound additive of the clean solution compoition was obtained. The combustion efficiency was improved by on-line cleaning with derived clean solution compoition. On-line cleaning method prevents the fouling and corrosion in the boiler and heat exchanger.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.3 no.2
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• pp.74-79
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• 2002

In the a rapid changes of the semiconductor manufacturing technologies for early 21st century, it may be safely said that a kernel of terms is the size increase of Si wafer and the size decrease of semiconductor devices. As the size of Si wafers increases and semiconductor device is miniaturized, the units of cleaning processes increases. A present cleaning technology is based upon RCA cleaning which consumes vast chemicals and ultra pure water (UPW) and is the high temperature process. Therefore, this technology gives rise to the environmental issue. To resolve this matter, candidates of advanced cleaning processes has been studied. One of them is to apply the electrolyzed water. In this work, Compared with surface on Si wafer with electrolyzed water cleaning and various chemicals cleaning, and analyzed Si wafer surface condition treated with elecoolyzed water by cleaning temperature and cleaning time. Especially. concentrate upon the contact angle. finally, contact angle on surface treated with cathode water cleaning is 17.28, and anode water cleaning is 34.1.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.8
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• pp.195-201
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• 2014

In this paper, we developed a LGP(Light Guide Panel) dry cleaning system for particle cleaning using corona discharge and dry adhesive roll. Therefore, we design a cleaning mechanism that can be applied dry adhesive dust removal roll and ESD(electrostatic discharge) by using corona discharge. Also, we design and implementation of equipment, which can loading, unloading and transfer LGP automatically. The developed equipment is dust and particle cleaning experimental results to demonstrate its stability.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2012.11a
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• pp.185-187
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• 2012

Recently increasing high-rise building cleaning on the exterior walls of high-rise buildings, there has been increased interest. Building exterior cleaning is cleaned by a cleaning robot and how to clean the exterior walls of the building and exterior glass cleaned by personnel. Number of stories in the building increases, being carried out by personnel cleaning the outer wall as there is a limit order to overcome this method. therefor, this study is a new exterior wall cleaning device has been proposed.

• Journal of Welding and Joining
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• v.16 no.6
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• pp.77-85
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• 1998

Effects of non-cleaning and cleaning fluxes on the wetting properties and defects at flow soldered joints were investigated. Non-cleaning flux (R-type of 3.3% solid content) and cleaning flux (RMA-type of 15% solid content) were used. Wetting test was accomplished by wetting balance method with changing surface state of wetting specimen, CU. Sn-37%Pb solder was used for wetting test and flow soldering. As experimental results, the wetting time for vertical force from the surface tension being zero was mainly affected by surface state of the wetting specimen. Non-cleaning flux had a good wettability compared with cleaning flux. In case of non-cleaning flux, conveyor speed had a great affection to defects of bridge, icicle, and poor solder.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.11
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• pp.66-75
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• 2007

To prevent an insulator failure, an automatic cleaning and inspection robot was developed for suspension insulator strings. The robot autonomously moves along the insulator string using the clamps installed on its two moving frames. Especially, unlike the existing cleaning robots using jets of water, the robot system adopts a dry cleaning method using rotating brushes and a circular motion guide. In addition, a mechanized brush bristles and a voltage-balancing contactor are devised to increase cleaning efficiency and to prevent arc generation under live-line conditions, respectively. We confirmed its effectiveness through experiments.

• Proceedings of the IEEK Conference
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• 2009.05a
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• pp.153-155
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• 2009

Cleaning robot system consists of four parts; navigation system for moving of robot, cleaning system, power system, and main system with cleaning algorithm. Navigation system is the most expensive part because it has motors and sensors which is high price. Navigation system is also essential to service robot system, but user should buy two systems which are service robot system and cleaning robot system. If it is possible to share navigation system, user can save money. In this paper, we design the cleaning robot system based on modular architecture.

• Laser Solutions
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• v.12 no.4
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• pp.17-25
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• 2009

The surface cleaning method based on the laser-induced breakdown (LIB) of gas and subsequent plasma and shock wave generation can remove small particles from solid surfaces. In the laser shock cleaning (LSC) process, a high-power laser pulse induces optical breakdown of the ambient gas above the solid surface covered with contaminant particles. The subsequently created shock wave followed by a high-speed flow stream detaches the particles. In this work, a novel surface cleaning process using laser-induced breakdown of liquid is introduced and demonstrated. LIB of a micro liquid jet increases the shock wave intensity and thus removes smaller particle than the conventional LSC method. Experiments demonstrate that the cleaning force and cleaning efficiency are also increased significantly by this method.