• Journal of the Korea Institute of Information and Communication Engineering
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• v.23 no.8
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• pp.966-974
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• 2019

In this study, we propose a CMOS power amplifier (PA) using a bypass technique to enhance the efficiency in the low-power region. For the bypass structure, the common-gate (CG) transistor of the cascode structure of the driver stage is divided in two parallel branches. One of the CG transistors is designed to drive the power stage for high-power mode. The other CG transistor is designed to bypass the power stage for low-power mode. Owing to a turning-off of the power stage, the power consumption is decreased in low-power mode. The measured maximum output power is 20.35 dBm with a power added efficiency of 12.10%. At a measured output power of 11.52 dBm, the PAE is improved from 1.90% to 7.00% by bypassing the power stage. Based on the measurement results, we verified the functionality of the proposed bypass structure.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.10 no.2
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• pp.176-183
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• 2017

There is a problem of long erase and program times in testing large-density memories. Also, there is a need of testing the VT voltages of EEPROM cells at each step during the reliability test. In this paper, a cell verification module is designed for a 512kb EEPROM and a CG (control gate) driver is proposed for measuring the VT voltages of a split gate EEPROM having negative erase VT voltages. In the proposed cell verification module, asymmetric isolated HV (high-voltage) NMOS devices are used to apply negative voltages of -3V to 0V in measuring erase VT voltages. Since erasing and programming can be done in units of even pages, odd pages, or a chip in the test time reduction mode, test time can be reduced to 2ms in testing the chip from 4ms in testing the even and the odd pages.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.12 no.3
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• pp.312-320
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• 2019

In this paper, we design a 512Kb eFlash IP using 110nm eFlash cells. We proposed eFlash core circuit such as row driver circuit (CG/SL driver circuit), write BL driver circuit (write BL switch circuit and PBL switch select circuit), read BL switch circuit, and read BL S/A circuit which satisfy eFlash cell program, erase and read operation. In addition, instead of using a cross-coupled NMOS transistor as a conventional unit charge pump circuit, we propose a circuit boosting the gate of the 12V NMOS precharging transistor whose body is GND, so that the precharging node of the VPP unit charge pump is normally precharged to the voltage of VIN and thus the pumping current is increased in the VPP (boosted voltage) voltage generator circuit supplying the VPP voltage of 9.5V in the program mode and that of 11.5V in the erase mode. A 12V native NMOS pumping capacitor with a bigger pumping current and a smaller layout area than a PMOS pumping capacitor was used as the pumping capacitor. On the other hand, the layout area of the 512Kb eFlash memory IP designed based on the 110nm eFlash process is $933.22{\mu}m{\times}925{\mu}m(=0.8632mm^2)$.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.4
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• pp.913-920
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• 2011

In this paper, a logic process based 1-kbit EEPROM IP for RFID tag chips of 900MHz is designed. The cell array of the designed 1-kbit EEPROM IP is arranged in a form of four blocks of 16 rows x 16 columns, that is in a two-dimensional arrangement of one-word EEPROM phantom cells. We can reduce the IP size by making four memory blocks share CG (control gate) and TG (tunnel gate) driver circuits. We propose a TG switch circuit to supply respective TG bias voltages according to operational modes and to keep voltages between devices within 5.5V in terms of reliability in order to share the TG driver circuit. Also, we can reduce the power consumption in the read mode by using a partial activation method to activate just one of four memory blocks. Furthermore, we can reduce the access time by making BL (bit line) switching times faster in the read mode from reduced number of cells connected to each column. We design and compare two 1-kbit EEPROM IPs, two blocks of 32 rows ${\times}$ 16 columns and four blocks of 16 rows ${\times}$ 16 columns, which use Tower's $0.18{\mu}m$ CMOS process. The four-block IP is smaller by 11.9% in the layout size and by 51% in the power consumption in the read mode than the two-block counterpart.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.10 no.6
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• pp.558-569
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• 2017

In this paper, a 256Kb EEPROM IP aimed at battery applications using a single supply of 1.5V which is embedded into an MCU is designed. In the conventional cross-coupled VPP (boosted voltage) charge pump using a body-potential biasing circuit, cross-coupled PMOS devices of 5V in it can be broken by the junction or gate oxide breakdown due to a high voltage of 8.53V applied to them in exiting the program or erase mode. Since each pumping node is precharged to the input voltage of the pumping stage at the same time that the output node is precharged to VDD in the cross-coupled charge pump, a high voltage of above 5.5V is prevented from being applied to them and thus the breakdown does not occur. Also, all erase, even program, odd program, and all program modes are supported to reduce the times of erasing and programming 256 kilo bits of cells. Furthermore, disturbance test time is also reduced since disturbance is applied to all the 256 kilo bits of EEPROM cells at once in the cell disturb test modes to reduce the cell disturbance testing time. Lastly, a CG driver with a short disable time to meet the cycle time of 40ns in the erase-verify-read mode is newly proposed.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.11 no.1
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• pp.84-92
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• 2000

A GaAs MESFET MMIC transmitter for 2.4 GHz wireless local loop handset is designed and fabricated. The transmitter consists of a double balanced active mixer and a two stage driver amplifier with voltage negative feedback. In particular, a pair of CS-CG(common source-common gate) structure compensates the reduction in dynamic range caused by unbalanced complementary IF input signals. And to suppress the leakage local power at RF port, the mixer is designed by using phase characteristic between the ports of MESFET. At the bias condition of 2.7 V and 55.2 mA, the fabricated MMIC transmitter with chip dimensions of $0.75\times1.75 mm^2$ obtains a measured conversion gain of 38.6 dB, output $P_{idB}$ of 11.6 dBm, and IMD3 at -5 dBm RF output power of -31.3 dBc. This transmitter is well suited for WLL handset.

• Korean Journal of Applied Biomechanics
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• v.17 no.2
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• pp.31-40
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• 2007

Proper weight shifting is essential for a successful shot in golf swing and this could be described by means of the ground forces between the feet and ground. It is assumed that the ground forces would different according to the club used because the length and swing weight of each club is different. But, in present, it is not clear what changes are made by the change of clubs and this affect the swing motion. Therefore this study focused on the investigation of the changes of the ground forces and ground reaction forces (GRF) by the change of club length. The subjects were three professional male golfers. Four swings (driver, iron 3, iron 5, and iron 7) for each subject were taken by two high speed video cameras and two AMTI force platforms were used to measure the GRF simultaneously. Kwon GRF 2.0 and Mathcad 13 software were used to post processing the data. Changes of the three major component of GRF (Vertical, lateral, anterior-posterior force) at 10 predefined events were analyzed including the maximum. Major findings of this study were as follows. 1. Vertical forces; - There were no significant changes until the top of backswing. - Maximum was occurred at the club horizontal position in the downswing for both feet. The shorter club produced more maximum forces than longer ones in the left foot, but reverse were true for the right foot. - Maximum forces at impact shows the same patterns. 2. Lateral forces; Maximum was occurred at the club horizontal position for both feet, but there were no lateral forces because the direction of two forces was different. Maximum force pattern by different clubs was same as the vertical component. 3. Anterior-posterior forces; - This component made a counter-clock wise moment about a vertical axis located between two foot until the club vertical position was reached during the backswing, and reverse moment were produced when the club reached horizontal at the downswing. - Also this component made a forward moment about a horizontal axis located in the CG during the fore half of the downswing, and a reverse moment until the club reached vertical at the follow through phase. Maximum was occurred at the club vertical in the downswing for both feet. The longer club produced more maximum forces than shorter ones for both feet.