• Journal of the Korean Crystal Growth and Crystal Technology
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• v.17 no.6
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• pp.245-250
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• 2007

This study was focused on the effect of sintering additive and particle size on the low temperature sintering of $0.85CaWO_4-0.15SmNbO_4$ ceramics. With an increase of $CaV_2O_6$ content, the sintering temperature of the specimens was reduced from $1150^{\circ}C\;to\;800^{\circ}C$. The dielectric constant (K) and Qf value were increased with $CaV_2O_6$ content. These results are due to the enhancement of the density by the liquid phase sintering. Temperature coefficient of resonant frequency (TCF) was slightly shifted to the positive value with $CaV_2O_6$ content. Typically, K of 12.64, Qf of 23,106 GHz, TCF of $-34ppm/^{\circ}C$ were obtained for the specimens with 7 wt.% $CaV_2O_6$ sintered at $900^{\circ}C$ for 3 h.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.71-72
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• 2006

플라스틱 기판 위에 유도 결합 플라즈마 화학적 기상 증착장치 (Inductively Coupled Plasma Chemicai Vapor Deposition, ICP-CVD) 를 사용하여 실리콘 산화막 ($SiO_2$)을 증착하고, 엑시머레이저 어널링 (Excimer Laser Annealing, ELA) 과 $N_{2}O$ 플라즈마 전처리를 통해, 전기용량-전압(Capacitance-Voltage, C-V) 특성과 항복 전압장 (Breakdown Voltage Field) 과 같은 전기적 특성을 개선시켰다. 에너지 밀도 $250\;mJ/cm^2$ 의 엑시머 레이저 어닐링은 실리콘 산화막의 평탄 전압 (Flat Band Voltage) 을 0V에 가까이 이동시키고, 유효 산화 전하밀도 (Effective Oxide Charge Density)를 크게 감소시킨다. $N_{2}O$ 플라즈마 전처리를 통해 항복 전압장은 6MV/cm 에서 9 MV/cm 으로 향상된다. 엑시머 레이저 어닐링과 $N_{2}O$ 플라즈마 전처리를 통해 평탄 전압은 -9V 에서 -1.8V 로 향상되고, 유효 전하 밀도 (Effective Charge Density) 는 $400^{\circ}C$에서 TEOS 실리콘 산화막을 증착하는 경우의 유효 전하 밀도 수준까지 감소한다.

• Journal of Environmental Science International
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• v.15 no.4
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• pp.333-340
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• 2006

A (5 wt.%)Mn-(1 wt.%)$V_{2}O_{5}/TiO_{2}$ catalyst were prepared by co-precipitation method and used for low-temperature selective catalytic reduction (SCR) of $NO_x$ with ammonia in the presence of oxygen. The properties of the catalysts were studied by X-ray diffraction (XRD), temperature programmed reduction (TPR) and scanning electron microscope-energy dispersive X-ray spectroscopy (SEM-EDS). The experimental results showed that (5 wt.%)Mn-(1 wt.%)$V_{2}O_{5}/TiO_{2}$ catalyst yielded 81% NO conversion at temperature as low as $150^{\circ}C$ and a space velocity of $2,400\;h^{-1}$. Crystalline phase of $Mn_{2}O_3$ was present at ${\ge}\;15%$ Mn on $V_{2}O_{5}/TiO_{2}$. XRD confirmed the presence of manganese oxide ($Mn_{2}O_{3}$) at $2{\theta}=32.978^{\circ}(222)$. The XRD patterns presented of (5 wt.%)Mn-(1 wt.%)$V_{2}O_{5}/TiO_{2}$ did not show intense or sharp peaks for manganese oxides and vanadia oxides. The TPR profiles of (5 wt.%)Mn-(1 wt.%)$V_{2}O_{5}/TiO_{2}$ catalyst showed main reduction peat of a maximum at $595^{\circ}C$.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.67-67
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• 2000

CeO2는 cubic 구조의 일종인 CaR2 구조를 가지고 있으며 격자상수가 Si의 격장상수와 매우 비슷하여 Si 기판위에 에피텍셜하게 성장할 수 있는 가능성이 매우 크다. 따라서 SOI(silicon-on-insulator)구조의 실현을 위하여 Si 기판위에 CeO2 박막을 에피텍셜하게 성장시키려는 많은 노력이 있어왔다. 또한 metal-ferroelectric-semiconductor field effect transistor)에서 ferroelectric 박막과 Si 기판사이의 완충층으로 사용된다. 이러한 CeO2의 응용을 위해서는 Si 기판 위에 성장된 CeO2 박막의 방위성 및 CeO2/Si 구조의 전기적 특성을 알아보는 것이 매우 중요하다. 본 연구에서는 Si(100) 기판위에 CeO2(200)방향으로 성장하는 박막과 EcO2(111) 방향으로 성장하는 박막을 rf magnetron sputtering 방법으로 증착하여 각각의 구조적, 전기적 특성을 분석하였다. RCA 방법으로 세정한 P-type Si(100)기판위에 Ce target과 O2를 사용하여 CeO2(200) 및 CeO2(111)박막을 증착하였다. 증착후 RTA(rapid thermal annealing)방법으로 95$0^{\circ}C$, O2 분위기에서 5분간 열처리를 하였다 이렇게 제작된 CeO2 박막의 구조적 특성을 XRD(x-ray diffraction)방법으로 분석하였고, Al/CeO2/Si의 MIS(metal-insulator-semiconductor)구조를 제작하여 C-V (capacitance-voltage), I-V (current-voltage) 특성을 분석하였으며 TEM(transmission electron microscopy)으로 증착된 CeO2막과 Si 기판과의 계면 특성을 연구하였다. C-V특성에 있어서 CeO2(111)/Si은 CeO2(111)의 두께가 증가함에 따라 hysteresis windows가 증가한 방면 CeO2(200)/Si은 hysteresis windows가 아주 작을뿐만 아니라 CeO2(200)의 두께가 증가하더라도 hysteresis windos가 증가하지 않았다. CeO2(111)/Si과 CeO2(200)/Si의 C-V 특성의 차이는 CeO2(111)과 CeO2(200)이 Si 기판에 의해 받은 stress의 차이와 이에 따른 defect형성의 차이에 의한 것으로 사료된다.

• Journal of Korean Vacuum Science & Technology
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• v.4 no.1
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• pp.6-10
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• 2000

Ferroelectric YMnO$_3$ thin films were deposited on $Y_2$O$_3$/si(100) substrates by metalorganic chemical vapor deposition. The YMnO$_3$ thin films annealed in vacuum ambient (100 mTorr) above 75$0^{\circ}C$ show hexagonal structured YMnO$_3$. However, the film annealed in oxygen ambient shows poor crystallinity, and the second phase as $Y_2$O$_3$ and orthorhombic-YMnO$_3$ were shown. The annealing ambient and pressure on the crystallinity of YMnO$_3$ thin films is very important. The C-V characteristics have a hysteresis curve with a clockwise rotation, which indicates ferroelectric polarization switching behavior. When the gate voltage sweeps from +5 to 5 V, the memory window of the Pt/YMnO$_3$/Y$_2$O$_3$/Si gate capacitor annealed at 85$0^{\circ}C$ is 1.8 V. The typical leakage current densities of the films annealed in oxygen and vacuum ambient are about 10$^{-3}$ and 10$^{-7}$ A/cm$^2$ at applied voltage of 5 V.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.188-188
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• 2011

MgO는 암염구조의 이온결합성 화합물로 7.8 eV의 높은 띠 틈과 약 95%의 탁월한 투과도를 갖는다. 또한, ${\gamma}$ process에 의한 이차 전자 방출이 높고 이온 스퍼터링에 의한 표면 손상이 적어 면 방전 AC-PDP의 보호막으로 이용된다. 따라서 MgO 보호막에 관한 연구는 이차 전자 방출 계수를 높여 방전 전압을 감소시키고 높은 유전율과 투과도를 유지시키기 위한 목적으로 전개되어지고 있다. 본 연구는 이온 스퍼터링에 의한 MgO 보호막의 표면 특성의 변화를 알아보기 위해 이루어졌다. MgO 박막은 electron beam evaporation의 방법을 통해 챔버 내에 O 기체를 주입하고 P type Si 기판을 300$^{\circ}C$ 가열하여 40 nm 두께로 제작되었다. 박막 시료는 표면분석 전 초고진공챔버 내에서 표면에 산화된 불순물 제거를 위해 550$^{\circ}C$의 열처리가 되어졌다. 그리고 250 eV의 He 이온으로 박막 표면을 스퍼터링 하여 XPS, REELS, UPS를 이용하여 전자 및 광학적 특성을 연구하였다. XPS 분석을 통해 MgO 박막은 He 이온 스퍼터링에 의해 표면의 화학적 조성이 변하지 않는다는 것을 확인했다. MgO 박막에 이온 스퍼터링을 하면 표준 시료와 비교하여 Ep=1,500 eV일 때 7.54 eV에서 7.63 eV로 높아지는 경향이 있다. 일함수는 He 이온 스퍼터링 한 결과 3.85 eV로부터 4.09 eV로 약간 높아졌다. 또한, QUEELS simulation으로 얻은 가시광 투과도는 91~92%로 분석되었다.

• Bulletin of the Korean Chemical Society
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• v.25 no.11
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• pp.1645-1647
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• 2004

Potential energy surfaces for the reaction Al + $O_2{\to}$AlO + O have been calculated with the multireference configuration interaction (MRCI) method using molecular orbitals derived from the complete active space selfconsistent field (CASSCF) calculations. The end-on geometry is the most favourable for the reaction to take place. The small reaction barrier in the present calculation (0.11 eV) is probably an artefact related to the ionicneutral avoided crossing. The charge analysis implies that the title oxidation reaction occurs through a harpooning mechanism. Along the potential energy surface of the reaction, there are two stable intermediates of $AlO_2(C_{{\infty}v}$ and $C_{2v}$) at least 2.74 eV below the energy of reactants. The calculated enthalpy of the reaction (-0.07 eV) is in excellent agreement with the experimental value (-0.155 eV) in part due to the fortuitous cancellation of errors in AlO and $O_2$ calculations.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.9
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• pp.776-782
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• 2002

The microstructure, V-Ι characteristics, and stability of ZnO-P $r_{6}$ $O_{11}$ CoO-C $r_2$ $O_3$- $Y_2$ $O_3$-based varistor ceramics were investigated with cooling rate in the range of 2~8$^{\circ}C$/min. The cooling rate relatively weakly affected the microstructure, the varistor voltage, and the leakage current in the V-Ι characteristics. But the nonlinear exponent relatively strongly affected by cooling rate. The cooling rate also greatly affected the stability of V-Ιand dielectric characteristics for DC accelerated aging stress. On the whole, the varistors cooled with 4$^{\circ}C$/fin exhibited the highest performance in the densification, nonlinearity, and stability. Especially, they exhibited a high stability, in which the variation rate of the varistor voltage( $V_{1㎃}$), the nonlinear exponent($\alpha$), and the dissipation factor(tan $\delta$) is -1.4%, -4.9%, and ＋60.0%, respectively, under DC accelerated aging stress such as 0.95 $V_{1㎃}$15$0^{\circ}C$/12 h)

• Journal of the Korean Ceramic Society
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• v.22 no.3
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• pp.53-59
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• 1985

Nucleation and crystallization of $\beta$-eucryptite in a glass of molecular percentage composition Li2O.Al2O3.2SiO2 are studied. The glasses are made by quenching of the melts from 143$0^{\circ}C$ to room temperature. Heat-treatment for nucleation and crystal growth are caried out at various temperature in the range between 50$0^{\circ}C$ and 80$0^{\circ}C$ with different duration of time. The amounts of crystallization are estimated by the method of x-ray powder diffraction. As the results a time-temperature-transformation relation for crystallization is derived. The maximum rate of crystallization is observed at about 75$0^{\circ}C$ from the T-T-T-curve while the crystallization temperature is detected at 67$0^{\circ}C$ by DTA measurement. The crystallization temperature moved to 62$0^{\circ}C$ by adding 5 weight percents of TiO2 and it moved to 78$0^{\circ}C$ by adding 2 weight percents of V2O5. The crystallization temperature moved to 62$0^{\circ}C$ by adding 5 weight percent of TiO2 it moved to 78$0^{\circ}C$ by adding 2 weight percents of V2O5 The activation energy for crystallization from the pure glass is calculated as 68 Kcal/mol and it varied to 53 Kcal/mol and 110Kcal/mol when 5 weight percents of TiO2 and weight percents of V2O5 are added respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.8
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• pp.652-657
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• 2001

Vanadate glasses containing 10~20mol% glass former, P$_2$O$_{5}$ were prepared by melting the batch in platinum crucible and quenching on the copper plate. Li$_2$O-P$_2$O$_{5}$-V$_2$O$_{5}$ glass-ceramics having LiV$_3$O$_{8}$ were obtained by heat-treatment of this glass in crystallization temperature. The glass-ceramics showed singnificantly good capacity and long cycles life according to heating condition. In this paper, we described electrochemical properties during crystallization process and found the best crystallizaton condition of Li$_2$O-P$_2$O$_{5}$-V$_2$O$_{5}$ glass as cathode material. Li$_2$O-P$_2$O$_{5}$-V$_2$O$_{5}$ glass-ceramics heat-treated at 233$^{\circ}C$ for 3 hors showed good rechargeable capacity of 220mAh/g in the cycling range between 2.0 and 3.9V.en 2.0 and 3.9V.