• Journal of the Korean Society for Precision Engineering
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• v.14 no.11
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• pp.93-101
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• 1997

Ever since the nonlinearity of machine tool dynamics was established, researchers attempted to make use of this fact to devise better monitoring, diagnostics and control system, which were hitherto based on linear models. Theory of chaos which explains many nonlinear phenomena comes handy for furthering the analysis using nonlinear model. In this study, measuring system will be constructed using multi-sensor (Tool Dynamometer, Acoustic Emission) in end milling process. Then, it will be verified that cutting force is low-dimensional chaos by calculating Lyapunov exponents. Fractal dimension, embedding dimension. And it will be investigated that the relation between characteristic parameter calculated from sensor signal and tool wear.

• Corrosion Science and Technology
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• v.4 no.1
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• pp.29-32
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• 2005

A various structural materials are used in construction projects such as a stone, concrete, steel materials. Between of them, concrete are used widely. The compressive strength of concrete is high, and its maintenance and management is comparatively easy. The R.C Building will be superannuated as time passes. This program is generated by propagation of cracks. In order to manage such cracks, time and efforts, expense, etc. are required. In this study, glass sensors were embedding in a model beam and column and leakage of fluorescence and adhesive material was investigated. Further, currents in glass pipe were observed to find the leakage of liquid in glass pipes. Progressive cracks generated by cause the fracture of glass pipes. Therefore, the liquid become to flow and electric current stops, and the cracked part of the member can be found easily. Moreover, the adhesive delays progressive cracking system that responds in air, and the life of a structure can be made to extend. The purpose of this research is to develop of low price sensors that can perform of self-diagnosis in addition to ability of concrete repair concrete to damage.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.3
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• pp.1-10
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• 1998

A new oscillator configuration is presented and tested for Josephson voltage standard operated at the cryogenic(4.2K) temperature. Features of active devices are investigated in aspects of 1/f noise, output power, and current collapse at low temperature. The output power of oscillator is optimized by a nonlinear design approach called Harmonic Two Signal Method(HTSM). The embedding newworks of the generalized six oscillators with tow loads are derived. A HEMT oscilliator is designed in X-Band for the Josephson voltage standard and tested at room and cryogenic(4.2K) temperatures. Oscillation frequency, output power, C/N ratio, and fequency stability are compared at room and low temperatures.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1502-1503
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• 2007

In this paper, inductive coupled LC balun has been desi gned and simulated for embedding into an organic packaging substrate. Inductive coupling method was applied to obtain wide band characteristics, and high dielectric film was utilized to reduce a size of the balun. The proposed balun has a novel scheme which consists of three embedded LC resonators with inductive coupling. This proposed balun has relatively small inductance and capacitance values which can be easily embedded into the organic packaging substrate. Furthermore, it has a good phase imbalance characteristic. The simulated results of proposed balun are an insertion loss of 1.2 dB, a return loss of 10 dB, a phase imbalance of 1 degree at frequency bandwidth of 750 MHz ranged from 1.8 GHz to 2.55 GHz, respectively. This balun has an area of $2mm{\tims}3.5mm{\times}0.66mm$ (height).

• Journal of Information Processing Systems
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• v.15 no.2
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• pp.261-270
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• 2019

In order to protect secret digital documents against vulnerabilities while communicating, steganography algorithms are applied. It protects a digital file from unauthorized access by hiding the entire content. Pixel-value-difference being a method from spatial domain steganography utilizes the difference gap between neighbor pixels to fulfill the same. The proposed approach is a block-wise embedding process where blocks of variable size are chosen from the cover image, therefore, a stream of secret digital contents is hidden. Least significant bit (LSB) substitution method is applied as an adaptive mechanism and optimal pixel adjustment process (OPAP) is used to minimize the error rate. The proposed application succeeds to maintain good hiding capacity and better signal-to-noise ratio when compared against other existing methods. Any means of digital communication specially e-Governance applications could be highly benefited from this approach.

• The Bulletin of The Korean Astronomical Society
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• v.43 no.2
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• pp.40.2-40.2
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• 2018

NGC 5024 and NGC 5053 are among the most metal-poor globular clusters in the Milky Way. Both globular clusters are considered to be accreted from dwarf galaxies (like Sagittarius dwarf galaxy or Magellanic clouds), and common stellar envelope and tidal tails between globular clusters are also detected. We present a search for extra-tidal cluster member candidates around these globular clusters from APOGEE survey data. Using 20 chemical elements (e.g., Fe, C, Mg, Al) and radial velocities, t-distributed stochastic neighbour embedding (t-SNE), which identifies an optimal mapping of a high-dimensional space into fewer dimensions, was explored, and we find that globular cluster stars are well separated from the field stars in 2-dimensional map from t-SNE. We also find that some stars selected in t-SNE map are placed outside of the tidal radius of the clusters. The proper motion of stars outside tidal radius is also comparable to that of globular clusters, which suggest that these stars are tidally decoupled from the globular clusters. We manually measure chemical abundances for the clusters and extra-tidal stars, and discuss the association of extra-tidal stars with the clusters.

• International conference on construction engineering and project management
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• 2005.10a
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• pp.515-519
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• 2005

Most information within a construction project roots in drawings and contract documents. Although several methodologies, such as A/E/C and 4D, have employed such a peculiarity to integrate project information, they failed to integrate information in terms of efficiency and consistency. In this research, a MD (Multi-Dimensional) CAD model is developed to improve the process of integrating information for construction projects. This research describes the processes of creating MD CAD objects and embedding information required throughout the project life cycle within MD CAD building components. In addition, a case study is presented to show the efficiency and effectiveness of using MDIIS (Multi-Dimensional Information Integration System) to integrate information for construction projects.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• Proceedings of the Korean Society For Composite Materials Conference
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• 1999.11a
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• pp.251-257
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• 1999

Smart structure that contains sensors, which are either embedded in a composite material or attached to a structure, is currently receiving considerable attention. Fiber Bragg grating sensor, one of the optical fiber sensors, has been widely used to sense strain and temperature for smart structures since both parameters change the resonant frequency of the grating. In this paper, according to the various heating and cooling conditions the thermal behavior of unidirectional composite material was monitored by embedding the fiber Bragg grating sensors in the longitudinal and transverse directions of unidirectional composites. The thermal behavior of unidirectional composite material was monitored for various heating and cooling rates and applied pressure. It was found that the thermal behavior was unaffected by pressure variations and heating and cooling rates applied to the composites. The thermal strains were measured by considering the shift in Bragg wavelength that was generated by the thermal expansion of composite specimen. The longitudinal and transverse C.T.E.'s were also obtained from the corresponding temperature-thermal strain curves.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.964-967
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• 2009

A new hybrid-type touch screen panel (TSP) has been developed based on a-Si:H TFT which can detect the change of both $C_{LC}$ and photo-current. This TSP can detect the difference of $C_{LC}$ between touch and no-touch states in unfavorable conditions such as dark ambient light and shadows. The hybrid TSP sensor consists of a detection area which includes one TFT for photo sensing and two TFTs for amplification. Compared to a single internal capacitive TSP or an optical sensing TSP, this new proposed hybrid-type TSP enables larger sensing margin due to embedding of both optical and capacitive sensors.