• Transactions of Materials Processing
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• v.18 no.4
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• pp.342-346
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• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.393-397
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• Transactions of Materials Processing
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• v.13 no.7
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• pp.623-628
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• 2004

This paper is concerned with pressure welding, which has been known as a main bonding mechanism during the cold and warm forming such as clad extrusion or bundle extrusion/drawing. Bonding characteristics between the Cu and Al plates by pressure welding are investigated focusing on the weak bonding. Experiments are performed at the cold and warm temperatures ranging from the room temperature to $200^{\circ}C$. The important factors examined in this work are the welding pressure, pressure holding time, surface roughness, and temperature. A bonding map, which can identify the bonding criterion with a weak bonding strength of IMPa , is proposed in terms of welding pressure and surface roughness fur the cold and warm temperature ranges.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.11
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• pp.755-759
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• 2016

The use of heat pipes in the electronic telecommunication field is increasing. Among the various types of heat pipes, the thin flat heat pipe has relatively high applicability compared with the circular heat pipe in the electronic packaging application. The thin flat heat pipe based on extrusion fabrication has a simple capillary wick structure consisting of rectangular cross sectional grooves on the inner wall of the pipe. Although the groove serves as a simple capillary wick, and many such grooves are provided on the inner wall, it is difficult for the grooves to realize a sufficiently high capillary force. In the present study, a thin flat heat pipe with a wire bundle was developed to overcome the drawback of poor capillary force in the thin flat heat pipe with grooves, and was evaluated by conducting tests. In the performance test, the thin flat heat pipe with the wire bundle showed a lower thermal resistance of approximately 3.4 times, and a higher heat transfer rate of approximately 3.8 times with respect to the thin flat heat pipe with grooves as the capillary wick respectively. The possibility of using the wire bundle as a capillary wick in the heat pipe was validated in the present study; further study for commercializing this concept will be taken up in the future.

• Journal of Ceramic Processing Research
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• v.20 no.5
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• pp.464-469
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• 2019

In this study, the electrical conductivity of multi-walled carbon nanotubes (MWCNTs) and polyethylene synthesized by an extrusion process was evaluated. The MWCNTs used exhibited differences in their dispersion characteristics depending on the type of catalyst or synthesis gas used. Thus, the choice of catalyst or synthesis gas significantly affect the physicochemical state of the final MWCNTs and MWCNT-based composites. In this investigation, the characteristics of MWCNTs were analyzed in four cases by introducing ethylene and propylene gas to each catalyst synthesized using deposition precipitation and spray drying methods. The MWCNT-based composites synthesized using the catalyst prepared by deposition precipitation and the ethylene synthesis gas showed the best electrical conductivity. In principle, the morphologies of the MWCNTs indicate that the smaller the aggregate size and bundle thickness, the better the electrical conductivity of the MWCNT composites. This implies that the network is well-formed.

• Macromolecular Research
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• v.9 no.4
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• pp.238-246
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• 2001

Properties of ternary blends of nylon 6 (Ny6), a thermotropic liquid crystalline polymer (TLCP, poly(ester amide), 20 wt%) and a maleic anhydride grafted polypropylene (2 wt%) (MAPP) were studied under various processing conditions. TLCP was pre-blended with MAPP first and then the binary one blended again with Ny6. The processing temperature of the second mixing was varied. Thermal properties show the partial miscibility of the ternary blend. The morphology of the TLCP phase in the first blending shows mostly in the fibril bundle shape, but varies between droplets and oriented fibrils after the second processing. Some of TLCP phase lost the fibril morphology during the second processing stage. The morphology variation invokes the change in tensile properties. Low extrusion temperature (270$\^{C}$) provides more fibril shapes, which are associated with less deformation in the second stage. The processing temperature effect was more evident when the draw ratio was high. High drawing was applicable due to the stabilizing action of tile compatibilizer.