• 소성∙가공
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• 제18권4호
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• pp.342-346
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• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.393-397
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 소성∙가공
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• 제13권7호
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• pp.623-628
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• 2004

This paper is concerned with pressure welding, which has been known as a main bonding mechanism during the cold and warm forming such as clad extrusion or bundle extrusion/drawing. Bonding characteristics between the Cu and Al plates by pressure welding are investigated focusing on the weak bonding. Experiments are performed at the cold and warm temperatures ranging from the room temperature to $200^{\circ}C$. The important factors examined in this work are the welding pressure, pressure holding time, surface roughness, and temperature. A bonding map, which can identify the bonding criterion with a weak bonding strength of IMPa , is proposed in terms of welding pressure and surface roughness fur the cold and warm temperature ranges.

• 대한기계학회논문집B
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• 제40권11호
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• pp.755-759
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• 2016

전자 통신 분야에서 히트파이프를 활용한 방열기술은 점차 늘어나고 있다. 특히 전자 패키지 응용에서는 원형 단면 히트파이프에 비해 평판 형상의 얇은 히트파이프가 보다 더 적용하기에 용이하다. 압출 공정에 기반한 평판 히트파이프는 내벽에 사각 단면 그루브들로 이루어진 단순한 모세관 윅 구조를 갖는다. 그루브 윅이 내벽에 다수 개 설치가 된다고 하더라도 상대적으로 높은 모세관력을 달성하기는 어렵다. 본 연구에서는 그루브 윅의 모세관력 향상을 위해 와이어 다발을 적용한 평판 히트파이프의 제작 및 성능평가 실험을 수행하였다. 실험을 통해 와이어 다발을 윅으로 갖는 평판 히트파이프의 열저항 및 열전달률이 그루브 윅 평판 히트파이프에 비해 각각 3.4배와 3.8배 가량 우수한 것으로 나타났다. 본 연구를 통해 와이어 다발을 통한 모세관력 향상 효과를 실험적으로 확인하였으며, 향후 상용화를 위한 연구를 진행할 계획이다.

• Journal of Ceramic Processing Research
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• 제20권5호
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• pp.464-469
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• 2019

In this study, the electrical conductivity of multi-walled carbon nanotubes (MWCNTs) and polyethylene synthesized by an extrusion process was evaluated. The MWCNTs used exhibited differences in their dispersion characteristics depending on the type of catalyst or synthesis gas used. Thus, the choice of catalyst or synthesis gas significantly affect the physicochemical state of the final MWCNTs and MWCNT-based composites. In this investigation, the characteristics of MWCNTs were analyzed in four cases by introducing ethylene and propylene gas to each catalyst synthesized using deposition precipitation and spray drying methods. The MWCNT-based composites synthesized using the catalyst prepared by deposition precipitation and the ethylene synthesis gas showed the best electrical conductivity. In principle, the morphologies of the MWCNTs indicate that the smaller the aggregate size and bundle thickness, the better the electrical conductivity of the MWCNT composites. This implies that the network is well-formed.

• Macromolecular Research
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• 제9권4호
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• pp.238-246
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• 2001

Properties of ternary blends of nylon 6 (Ny6), a thermotropic liquid crystalline polymer (TLCP, poly(ester amide), 20 wt%) and a maleic anhydride grafted polypropylene (2 wt%) (MAPP) were studied under various processing conditions. TLCP was pre-blended with MAPP first and then the binary one blended again with Ny6. The processing temperature of the second mixing was varied. Thermal properties show the partial miscibility of the ternary blend. The morphology of the TLCP phase in the first blending shows mostly in the fibril bundle shape, but varies between droplets and oriented fibrils after the second processing. Some of TLCP phase lost the fibril morphology during the second processing stage. The morphology variation invokes the change in tensile properties. Low extrusion temperature (270$\^{C}$) provides more fibril shapes, which are associated with less deformation in the second stage. The processing temperature effect was more evident when the draw ratio was high. High drawing was applicable due to the stabilizing action of tile compatibilizer.