• Journal of IKEEE
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• v.20 no.2
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• pp.163-166
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• 2016

It is important to operate the driving circuit under the optimal condition through precisely sensing the power consumption causing the temperature made mainly by the MOSFET (metal-oxide semiconductor field-effect transistor) when a BLDC (Brushless Direct Current) motor operates. In this letter, a Super-junction (SJ) power TMOSFET (trench metal-oxide semiconductor field-effect transistor) with an ultra-low specific on-resistance of $0.96m{\Omega}{\cdot}cm^2$ under the same break down voltage of 100 V is designed by using of the SILVACO TCAD 2D device simulator, Atlas, while the specific on-resistance of the traditional power MOSFET has tens of $m{\Omega}{\cdot}cm^2$, which makes the higher power consumption. The SPICE simulation for measuring the power distribution of 25 cells for a chip is carried out, in which a unit cell is a SJ Power TMOSFET with resistor arrays. In addition, the power consumption for each unit cell of SJ Power TMOSFET, considering the number, pattern and position of bonding, is computed and the power distribution for an ANSYS model is obtained, and the SJ Power TMOSFET is designed to make the power of the chip distributed uniformly to guarantee it's reliability.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.2
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• pp.1-8
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• 1999

The state of compatability of poly(vinyl alcohol)(PVA) and methyl cellulose(MC), prepared by an aqueous solution casting, were investigated over the entire compositions by dynamical mechanical analyzer(DMA) and differential scanning calorimetry(DSC). The glass transition temperatures of the blends, estimated by DMA, indicate that the blends of PVA and MC showed a definite degree of partial miscibility by showing two glass transition temperatures below 80 wt % MC contents in the blends and one glass transition temperature above 80 wt % of MC contents. The DSC results show a depression of melting point and crystallization temperature of PVA in the blends containing more than 80 wt % MC. This indicates that a considerable compatibility in the blend above 80 wt % MC contents may be attribute to the presence of interaction of hydroxyl groups of component polymers through hydrogen bonding. The DMA study of the effect of plasticizer on the polymers showed that water was a good plasticizer for PVA and PEG400 for MC. The addition of water and PEG400 in the blends showed a synergic plasticizing effect on these blends, which resulted in the large extent of the improvement of the compatibility. The elongation of PVA, MC and blonds was found to increase with addition of PEG400 in the blends, but the tensile strength to decrease with addition of plasticizer.

• Journal of Powder Materials
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• v.22 no.2
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• pp.111-115
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• 2015

This study investigates the microstructure and thermal shock properties of polycrystalline diamond compact (PDC) produced by the high-temperature, high-pressure (HPHT) process. The diamond used for the investigation features a $12{\sim}22{\mu}m$- and $8{\sim}16{\mu}m$-sized main particles, and $1{\sim}2{\mu}m$-sized filler particles. The filler particle ratio is adjusted up to 5~31% to produce a mixed particle, and then the tap density is measured. The measurement finds that as the filler particle ratio increases, the tap density value continuously increases, but at 23% or greater, it reduces by a small margin. The mixed particle described above undergoes an HPHT sintering process. Observation of PDC microstructures reveals that the filler particle ratio with high tap density value increases direct bonding among diamond particles, Co distribution becomes even, and the Co and W fraction also decreases. The produced PDC undergoes thermal shock tests with two temperature conditions of 820 and 830, and the results reveals that PDC with smaller filler particle ratio and low tap density value easily produces cracks, while PDC with high tap density value that contributes in increased direct bonding along with the higher diamond content results in improved thermal shock properties.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.1
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• pp.34-41
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• 2017

In this study, the effect on the zinc nuclei crystallization caused by changes preprocessing of the zinc crystalline glaze preparation has been studied. The mechanism of the nuclei formation in the crystalline glaze and development of the nuclei by studying the preprocessing step was explained. The preprocessing step was improved by altering mixing process of the materials prior to sintering: number of sieving dispersion process and ultra-sonication prove tests with various duration of sonication. According to the result, the sieving and sonication of the starting materials facilitated the interface reactions of $ZnO-SiO_2$ from $680^{\circ}C$ where low temperature willemite is formulated, and altered Si bonding for the easier bonding between Zn-Si. In other words, solely sieving was enough to accelerate the formation of willemite in low temperature. When the particles were distributed evenly by sonication, the willemite formation was even more significant.

• The Journal of Advanced Prosthodontics
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• v.6 no.4
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• pp.317-324
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• 2014

PURPOSE. This study was to evaluate the effect of grinding of the inner metal surface during the porcelain try-in stage on metal-porcelain bonding considering the maximum temperature and the vibration of samples. MATERIALS AND METHODS. Ninety-one square prism-shaped ($1{\times}1{\times}1.5mm$) nickel-chrome cast frameworks 0.3 mm thick were prepared. Porcelain was applied on two opposite outer axial surfaces of the frameworks. The grinding was performed from the opposite axial sides of the inner metal surfaces with a low-speed handpiece with two types of burs (diamond, tungsten-carbide) under three grinding forces (3.5 N, 7 N, 14 N) and at two durations (5 seconds, 10 seconds). The shear bond strength (SBS) test was performed with universal testing machine. Statistical analyzes were performed at 5% significance level. RESULTS. The samples subjected to grinding under 3.5 N showed higher SBS values than those exposed to grinding under 7 N and 14 N (P<.05). SBS values of none of the groups differed from those of the control group (P>.05). The types of bur (P=.965) and the duration (P=.679) did not affect the SBS values. On the other hand, type of bur, force applied, and duration of the grinding affected the maximum temperatures of the samples, whereas the maximum vibration was affected only by the type of bur (P<.05). CONCLUSION. Grinding the inner metal surface did not affect the metal-porcelain bond strength. Although the grinding affected the maximum temperature and the vibration values of the samples, these did not influence the bonding strength.

• Journal of the Korean institute of surface engineering
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• v.48 no.6
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• pp.260-268
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• 2015

The thermal barrier coating (TBC) for inner wall of liquid-fuel rocket combustor consists of NiCrAlY as bonding layer and $ZrO_2$ as a top layer. In most case, the plasma spray coating is used for TBC process and this process has inherent possibility of cracking due to large difference in thermal expansion coefficients among bonding layer, top layer and metal substrate. In this paper, we suggest crack-free TBC process by using a precise electrodeposition technique. Electrodeposited Ni-P/Cr double layer has similar thermal expansion coefficient to the Cu alloy substrate resulting in superior thermal barrier performance and high temperature oxidation resistance. We studied the effects of phosphorous concentrations (2.12 wt%, 6.97 wt%, and 10.53 wt%) on the annealing behavior ($750^{\circ}C$) of Ni-P samples and Cr double layered electrodeposits. Annealing temperature was simulated by combustion test condition. Also, we conducted SEM/EDS and XRD analysis for Ni-P/Cr samples. The results showed that the band layers between Ni-P and Cr are Ni and Cr, and has no formed with heat treatment. These band layers were solid solution of Cr and Ni which is formed by interdiffusion of both alloy elements. In addition, the P was not found in it. The thickness of band layer was increased with increasing annealing time. We expected that the band layer can improve the adhesion between Cr and Ni-P.

• Transactions of Materials Processing
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• v.22 no.5
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• pp.264-268
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• 2013

Aluminum clad sheets for brazing materials in the automotive heat exchangers are required to exhibit both high strength and excellent erosion resistance. In this study, the effects of microstructural changes on the property of clad sheets due to thermomechanical treatment were investigated. The clad sheets were fabricated by roll bonding of twin-roll-cast AA3527 and AA4343 alloys followed by cold rolling down to a thickness of 0.22mm. Partial or full annealing was conducted at the final thickness in order to improved the erosion resistance while keeping the proper strength. Since full annealing was achieved for a temperature of $400^{\circ}C$, annealing treatments were performed at 360, 380, and $400^{\circ}C$, respectively. The tensile strength of 3527/4343 clad material was found to be inversely proportional to the annealing temperature before the brazing heat treatment. After this latter treatment, however, the tensile strength of the clad material was about 195~200MPa regardless of the annealing temperature. The erosion depth ratio of the clad annealed at $400^{\circ}C$ was 8.8% (the lowest), while that of the clad annealed at $380^{\circ}C$ was 17% (the highest). The effect of annealing temperature on the tensile and erosion properties of 3527/4343 aluminum clad sheets was elucidated by means of microstructural analyses.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.6
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• pp.634-641
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• 2001

Shape memory alloy has been used to improve the tensile strength of composite by the occurrence of compressive residual stress in matrix using its shape memory effect. In order to fabricate shape memory alloy composite, TiNi alloy and A16061 were used as reinforcing material and mix, respectively. In this study, TiNi/A16061 shape memory alloy composite was made by using hot press method. However, the specimen fabricated by this method had the bonding problem at the boundary between TiNi fiber and Al matrix when the load was applied to it. A cold rolling was imposed to the specimen to improve the bonding effect. It was found that tensile strength of specimen subjected to cold rolling was more increased than that of specimen which did not underwent cold rolling. In addition, acoustic emission technique was used to quantify the microscopic damage behavior of cold rolled TiNi/A16061 shape memory alloy composite at high temperature.

• Journal of Korean Society of Forest Science
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• v.60 no.1
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• pp.37-44
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• 1983

Thermoplastic aceton-formaldehyde resin adhesive was added as a modifier for urea-formaldehyde resin adhesive and its effects on plywood smear strength and wood failure were investigated. The results are summarized as follows: 1) The plywood shear strength and wood failure showed the highest values at $120^{\circ}C$ of hot plate temperature, but the values decreased according to the rise of addition ratio of aceton resin. 2) The variation of molar ratio of aceton resin had no effect on plywood shear strength and wood failure. 3) The plywood bonded by the addition of aceton resin showed lower values than those of urea resin bonding plywoods in shear strength and wood failure. Therefore, aceton resin was inadequate as a modifier of urea resin adhesive.

• Journal of the Korean Magnetics Society
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• v.11 no.5
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• pp.226-231
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• 2001

The effect of interface reaction between Mn-Zn ferrite single crystal and 61 SiO$_2$-23Pbo-6ZnO-8Na$_2$O-2K$_2$O (mol%) glass on the magnetic properties of the ferrite was investigated. After the reaction, the hump of Zn concentration appeared at the ferrite adjacent to the interface. The initial permeability of the ferrite bonded with the glass at 700 $^{\circ}C$ was 1766 at 100 KHz and reduced to 907 after reaction at 1000$^{\circ}C$. The permeability degradation with increasing reaction temperature was considered to be attributed not only to the sixe diminution of the ferrite due to the its dissolution into the glass but also to the residual stress due to the difference in expansion coefficient between the ferrite and the diffusion layer-the region of the hump of Zn concentration-adjacent to the interface.