• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• Composites Research
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• v.30 no.3
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• pp.215-222
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• 2017

The effect of a multi walled carbon nanotubes (MWNCT) on the adhesive properties and thermal properties of epoxy were studied by double lap-shear tests. Epoxy/MWCNT resins were prepared from a different amount of the MWCNT incorporated into the epoxy resins (araldite 2011). Steel plates and carbon fiber reinforced plastics (CFRP) were chosen as materials. Mechanical tests were performed by a universal testing machine (UTM). The analysis of thermal properties were conducted by a thermogravimetric analyzer (TGA) and a differential scanning calorimetry (DSC). The fracture surface morphology was examined using a scanning electron microscopy (SEM) and optical microscope. Compared to neat epoxy, it was found that the mechanical properties of epoxy/MWCNT resins are increased.

• Journal of Korean Society of Steel Construction
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• v.18 no.5
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• pp.633-642
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• 2006

Serviceability design is required to control the cracking at the joint of precast decks with longitudinal prestress in continuous composite bridges. Details of twin-girder bridges are especially complex not only due to their main reinforcements and transverse prestresses for the design of long-span concrete slabs, but also due to the shear pockets for obtaining the composite action. This paper suggests the design guidelines for the magnitude of the effective prestress and for the selection of filling materials and their requirements that would allow for the use of precast decks for twin-girder continuous composite bridges. The necessary initial prestress was also evaluated through long-term behavior analysis. From the analysis, existing design examples were revised and their effectiveness was estimated. When a filling material with a bonding strength higher than the requirement is used in the region of a high negative moment, a uniform configuration of the longitudinal prestressing steels along thewhole span length of continuous composite bridges can be achieved, which would result in the simplification of the details and the reduction of the construction costs.

• Composites Research
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• v.28 no.4
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• pp.239-243
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• 2015

Recent studies regarding the properties of carbon nanotubes (CNT) have made remarkable progress in CNT fibers research. However no CNT fibers showed the properties of CNTs because CNTs in fibers have weak interfacial bonding with low shear modulus in the pristine form. Thus, it is upmost interest to develop and employ post-production treatments to the CNT fibers that would potentially improve their properties. In this study, post-treatments resulted in improvement of strength of CNT fibers up to 40%.

• Korean Journal of Metals and Materials
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• v.49 no.5
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• pp.411-418
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• 2011

The current study investigates the electroplating characteristics of Sn-Cu eutectic micro-bumps electroplated on a Si chip for flip chip application. Under bump metallization (UBM) layers consisting of Cr, Cu, Ni and Au sequentially from bottom to top with the aim of achieving Sn-Cu bumps $10\times10\times6$ ${\mu}m$ in size, with 20${\mu}m$ pitch. In order to determine optimal plating parameters, the polarization curve, current density and plating time were analyzed. Experimental results showed the equilibrium potential from the Sn-Cu polarization curve is -0.465 V, which is attained when Sn-Cu electro-deposition occurred. The thickness of the electroplated bumps increased with rising current density and plating time up to 20 mA/$cm^2$ and 30 min respectively. The near eutectic composition of the Sn-0.72wt%Cu bump was obtained by plating at 10 mA/$cm^2$ for 20 min, and the bump size at these conditions was $10\times10\times6$ ${\mu}m$. The shear strength of the eutectic Sn-Cu bump was 9.0 gf when the shearing tip height was 50% of the bump height.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.23-29
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• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

• Journal of the korean academy of Pediatric Dentistry
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• v.34 no.1
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• pp.106-121
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• 2007

The purpose of this study was to examine the effects of suggested etching method on the performance of pits and fissures sealant. In the first part, seventy extracted sound human permanent third molars and premolars were used. The teeth were randomly divided and performed in three different groups as follows : conventional etching, enameloplasty, and testing group. Non-pumicing, dye-guidance vigorous brushing-start etching technique was applied on the occlusal of testing group. Then the pit and fissure sealant was applied on all of the specimens. After the thermocycling and immersing in 1% methylene blue, the resin embedded sections were made. The microleakage data on the section were then recorded under the stereoscope and statistic analysis was done. Additional experiments were also performed : direct fissure surface etched pattern experiment, replica study, and micro-shear bond strength testing observation. The second part included two groups. A paired study was designed to evaluate the influence the environment has on the performance of the sealant. After etching, half of each occlusal surface received one of the two following treatments in succession: sealing in laboratory and intraoral condition (group 1), sealing in intraoral condition with and without a single-bonding agent (group 2). The results of present study can be summarized as follows: - The microleakage of testing group was significant different with conventional method (P<.05) and was not different with the enameloplasty group (P>.05). - The quality and quantity of etched enamel were improved. - Microshear bond strength of testing group was higher than control group (p<.05). - The environmental condition was influenced on the performance of the sealant. The testing etching method modified the capacity of the etching agent to penetrate into the pits and fissures, and simultaneous enhance their efficiency in vitro condition.

• The korean journal of orthodontics
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• v.40 no.5
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• pp.342-348
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• 2010

Objective: The aim of this study was to compare the shear bond strengths (SBS) of orthodontic brackets bonded to enamel with a self-etching primer after bleaching, desensitizer application and combined treatment. Methods: Forty-eight premolars were randomly divided into four groups, each with n = 12 premolar samples. The four groups were; Group1: 15% hydrogen-peroxide office bleaching agent (Illumin$\acute{e}$ Office-IO), Group 2: IO + BisBlock Oxalate Dentin-Desensitizer, Group 3: Bis Block Oxalate Dentin-Desensitizer, Group 4: No treatment (control). Twenty-four hours after bonding, the specimens were tested in SBS at a crosshead speed of 5 mm/min until the brackets debonded. The failure mode of the brackets was determined by a modified adhesive remnant index. Results: Bleaching, bleaching and desensitizer treatment, and desensitizer treatment alone all significantly reduced SBS of the orthodontic brackets ($p$ = 0.001). No statistically significant difference was found between Group 1, Group 2 and Group 3 (Group 1-Group 2, $p$ = 0.564; Group 1-Group 3, $p$ = 0.371; Group 2-Group 3, $p$ = 0.133). The predominant mode of failure for the treatment groups (Group1, Group 2 and Group 3) was at the enamel-adhesive interface leaving 100% of the adhesive on the bracket base. Conclusions: Bleaching and desensitizer treatment should be delayed until the completion of orthodontic treatment.

• Journal of the Korea Institute of Building Construction
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• v.19 no.3
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• pp.201-207
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• 2019

In this study, the direct tensile properties of amorphous metallic fiber-reinforced cement based composites according to the strain was evaluated. A thin plate-shape amorphous metallic fiber with 15mm and 30mm in length was used. And fiber-reinforced cement based composites were prepared with contents of 1.0, 1.5, 2.0%. The direct tensile test was conducted under the conditions of $10^{-6}/s(static)$ and $10^1/s(dynamic)$ strain rate. As a results, amorphous metallic fiber with a length of 15mm was observed in pull-out behavior from the cement matrix because of the short fiber length and large portion of mixed fiber. On the other hand, amorphous metallic fiber with a length of 30mm were not pulled out from matrix because the bonding force between the fiber and matrix was large due to rough surface and large specific surface area. However, fracture occurred because thin plate shape fibers were vulnerable to shear force. Tensile strength, strain capacity and toughness were improved due to the increase in the fiber length. The dynamic increase factor of L15 was larger that of L30 because the bonding performance of the fiber-matrix interface is significantly affected by the strain rate.

• Nuclear Engineering and Technology
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• v.55 no.6
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• pp.2139-2146
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• 2023

During reactor operation, the divertor must withstand unprecedented simultaneous high heat fluxes and high-energy neutron irradiation. The extremely severe service environment of the divertor imposes a huge challenge to the bonding quality of divertor joints, i.e., the joints must withstand thermal, mechanical and neutron loads, as well as cyclic mode of operation. In this paper, potassium-doped tungsten (KW) is selected as the plasma facing material (PFM), oxygen-free copper (OFC) as the interlayer, oxide dispersion strengthened copper (ODS-Cu) alloy as the heat sink material, and reduced activation ferritic/martensitic (RAFM) steel as the structural material. In this study, a vacuum brazing technology is proposed and optimized to bond Cu and ODS-Cu alloy with the silver-free brazing material CuSnTi. The most appropriate brazing parameters are a brazing temperature of 940 ℃ and a holding time of 15 min. High-quality bonding interfaces have been successfully obtained by vacuum brazing technology, and the average shear strength of the as-obtained KW/Cu and ODS-Cu alloy joints is ~268 MPa. And a fabrication route for manufacturing the flat-type divertor target based on brazing technology is set. For evaluating the reliability of the fabrication technologies under the reactor relevant condition, the high heat flux test at 20 MW/m² for the as-manufactured flat-type KW/Cu/ODS-Cu/RAFM mockup is carried out by using the Electron-beam Material testing Scenario (EMS-60) with water cooling. This paper reports the improved vacuum brazing technology to connect Cu to ODS-Cu alloy and summarizes the production route, high heat flux (HHF) test, the pre and post non-destructive examination, and the surface results of the flat-type KW/Cu/ODS-Cu/RAFM mockup after the HHF test. The test results demonstrate that the mockup manufactured according to the fabrication route still have structural and interfacial integrity under cyclic high heat loads.