• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.40-50
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• 2023

Recently, the number of components of smartphones increases rapidly, while the PCB size continuously decreases. Therefore, 3D technology with a stacked PCB has been developed to improve component density in smartphone. For the s tacked PCB, it i s very important to obtain solder bonding quality between PCBs. We investigated the effects of the properties, thickness, and number of layers of interposer PCB and sub PCB on warpage of PCB through experimental and numerical analysis to improve the reliability of the stacked PCB. The warpage of the interposer PCB decreased as the thermal expansion coefficient (CTE) of the prepreg decreased, and decreased as the glass transition temperature (Tg) increased. However, if temperature is 240℃ or higher, the reduction of warpage is not large. As FR-5 was applied, the warpage decreased more compared to FR-4, and the higher the number and thickness of the prepreg, the lower the warpage. For sub PCB, the CTE was more important for warpage than Tg of the prepreg, and increase in prepreg thickness was more effective in reducing the warpage. The shear tests indicated that the dummy pad design increased bonding strength. The tumble tests indicated that crack occurrence rate was greatly reduced with the dummy pad.

• Journal of the Korean Wood Science and Technology
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• v.44 no.1
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• pp.40-47
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• 2016

Instead of metal connector generally used on the structural glued laminated timber rahmen joints, the GFRP reinforced laminated plates combining veneer and GFRP (Glass Fiber Reinforced Plastic) and bonded type GFRP rod were used as the connectors. As a result of moment resistance performance evaluation on the joint part applied with these connectors, the yield moment of specimen using the GFRP reinforced laminated plates and GFRP rod pin was measured 4 % lower in comparison to the specimen (Type-1) using the metal connectors, but the initial rotational stiffness was measured 29% higher. Also, the yield moment and rotational stiffness of the specimen using the GFRP-reinforced laminated plates and wood (Eucalyptus marginata) pin showed were measured 11% and 56% higher in comparison to the Type-1 specimen, showing the best performance. It was also confirmed through the failure shape and perfect elasto-plasticity analysis that it showed ductility behavior, not brittle fracture, from the shear resisting force by the pin and the bonding strength increased and the unification of member was carried out. On the other hand, in case of the specimen bonded with GFRP rod, it was impossible to measure the bonding performance or it was measured very low due to poor bonding.

• Restorative Dentistry and Endodontics
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• v.29 no.1
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• pp.30-35
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• 2004

치아 미백술은 치아의 심미성을 향상시키는 가장 보존적인 방법의 하나로 인식되어져 왔으며 최근의 심미치과에 대한 관심의 증가와 함께 그 빈도가 급격히 증가하고 있는 술식의 하나이다. 일반적으로 치아 미백술 후 바로 접착수복을 할 경우 결합력이 감소하는 것으로 알려져 있으며 이를 해소하기 위해 일정시간 경과 후 접착수복 술식을 시행할 것을 권장 하고 있다. 자가산부식형 (self-etching primer system) 접착제는 기존의 접착제와 다른 성분으로 인해 치아미백제에 의한 영향에 대해 잘 알려져 있지 않은 상태이다. 이에 본 실험에서는 미백술을 시행한 법랑질 상에서 서로 다른 세 가지의 접착 시스템을 이용하여 미백술 후의 지연 시간이 결합력에 미치는 영향을 비교하고자 하였다. 발거한 대구치 68개를 물기가 있는 상태에서 근원심으로 절단하고 치관부를 자가중합 레진에 식립하여 시편을 제작하였다. 세 가지 접착제로 $One-step^{\circledR}$, Clearfil SE Bond $primer^{\circledR}$, One-up Bond $F^{\circledR}$를 이용하였다. 각 접착제를 미백을 시행하지 않는 대조군과 미백 시행 후 바로 접착한 즉시 접착군, 그리고 2주간 생리식염수에 보관한 후에 접착한 지연군으로 나누어 총 9개의 실험군으로 나누었다. 접착제를 처리한 면에 Clearfil $AP-X^{\circledR}$ 복합레진을 2mm충전하고, 40초간 광중합을 시행하였다. 24시간 후 전단접착강도를 측정하였으며, 그 결과는 다음과 같이 나타났다. $One-step^{\circledR}$의 경우, 즉시 접착군에서 지연 접착군보다 유의성 있게 낮은 접착강도를 나타내었다. Clearfil SE $Bond^{\circledR}$의 경우, 즉시 접착군과 미백을 시행하지 않은 군간에는 접착 강도에 유의한 차가 없었으나,지연접착군에서는 낮은 강도를 나타내었다. One-Up Bond F$^{\circledR}$의 경우, 즉시 접착군에서 유의성 있게 낮은 전단접착강도를 나타내었고, 전반적인 접착 강도가 다른 두 접착제에 비해서 유의성 있게 낮은 값을 보였다. $One-step^{\circledR}$을 사용할 경우 지연접착을 하는 것이 추천되며, Clearfil SE Bond$^{\circledR}$의 경우에는 즉시 접착을 시행하더라도 영향을 적게 받는 것으로 나타났으며, One-Up Bond $F^{\circledR}$의 경우 미백술 후 접착수복 과정에 사용에 제한이 있는 것으로 나타났다.

• Journal of the Korean Chemical Society
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• v.45 no.6
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• pp.555-561
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• 2001

Vinyl acetate usually used in PVA resin preparation was converted to PVAc by bulk polymerization using AIBN as a initiator and PVA was synthesized by changing the concentration of NaOH added for saponification subsequently. As a result of estimating molecular weight using GPC, molecular weight increased as the NaOH concentration increased to 2.5 N, 5.0 N, 7.5 N and 10.0 N and polydispersity had similar values of 2.1~2.3, however, showed slightly decreasing tendency. In addition, PVA saponificated by 10.0 N-NaOH showed high syndiotacticity in observation of tacticity using NMR spectroscopy. From this fact, the degree of tacticity was predicted to be high and it was in good agreement with the tendency of polydispersity by GPC. Also, from the result of FT-IR spectroscopy, it might be known that hydrolysis was more promoted in the PVA with 10.0 N-NaOH than other NaOH concentration. Intrinsic viscosity measured using Ubbelohde viscometer, which increased as the concentration of NaOH added for saponification increased. The change of shear strength with the change of shear rate was investigated using Brookfield viscometer, in consequence, viscosity of PVA synthesized decreased as shear rate increased. PVA solution confirmed to show the shear thining behavior by Casson plot and PVA with 10.0 N-NaOH had the largest yield value. DSC measurement was performed to know the thermal properties of PVA. Tp had nearly constant value of 214$^{\circ}C$ in all cases except for adding 2.5 N-NaOH and $\Delta$H was increased as the concentration of NaOH increased. From this properties, it was concluded that the degree of hydrogen bonding was proportional to the added concentration of NaOH and the increase of the degree of hydrogen bonding and hydrophobic interaction could affect the rheological and thermal properties of title compound.

• The Journal of Korean Academy of Prosthodontics
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• v.29 no.2
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• pp.245-265
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• 1991

The purpose of this study was to observe the changes of the elemental transmission and bond strength between the metal and porcelain according to various kinds of ion beam mixing method. ion beam mixing of $meta1/SiO_2$ (silica), $meta1/Al_2O_3$(alumina) interfaces causes reactions when the $Ar^+$ was implanted into bilayer thin films using a 100KeV accelerator which was designed and constructed for this study. A vacuum evaporator used in the $10^{-5}-10^{-6}$ Torr vacuum states for the evaporation. For this study, three kinds of porcelain metal selected, -precious, semiprecious, and non-precious. Silica and alumina were deposited to the metal by the vacuum evaporator, separately. One group was treated by two kinds of dose of the ion beam mixing $(1\times10^{16}ions/cm^2,\;5\times10^{15}ions/cm^2)$, and the other group was not mixed, and analyzed the effects of ion beam mixing. The analyses of bond strength, elemental transmissions were performed by the electron spectroscopy of chemical analysis (ESCA), light and scanning electron microscope, scratch test, and micro Vickers hardness tests. The finding led to the following conclusions. 1. In the scanning electron and light microscopic views, ion beam mixed specimens showed the ion beam mixed indentation. 2. In the micro Vickers hardness and scratch tests, ion beam mixed specimens showed higher strength than that of non mixed specimens, however, nonprecious metal showed a little change in the bond strength between mixed and non mixed specimens. 3. In the scratch test, ion beam mixed specimens showed higher shear strength than that of non treated specimens at the precious and semiprecious groups. 4. In the ESCA analysis, Au-O and Au-Si compounds were formed and transmission of the Au peak was found ion beam mixed $SiO_2/Au$ specimen, simultaneously, in the higher and lower bonded areas, and ion beam mixed $SiO_2/Ni-Cr$ specimen, oxygen, that was transmitted from $SiO_2\;to\;SiO_2/Ni-Cr$ interface combined with 12% of Ni at the interface.

• Journal of the korean academy of Pediatric Dentistry
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• v.31 no.1
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• pp.66-78
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• 2004

The objective of this study was to apply the vibration technique to reduce the viscosity of bonding adhesives and thereby compare the bond strength and resin penetration in enamel and dentin achieved with those gained using the conventional technique and vibration technique. For enamel specimens, thirty teeth were sectioned mesio-distally. Sectioned two parts were assigned to same adhesive system but different treatment(vibration vs. non-vibration). Each specimen was embedded in 1-inch inner diameter PVC pipe with a acrylic resin. The buccal and lingual surfaces were placed so that the tooth and the embedding medium were at the same level. The samples were subsequently polished silicon carbide abrasive papers. Each adhesive system was applied according to its manufacture's instruction. Vibration groups were additionally vibrated for 15 seconds before curing. For dentin specimen, except removing the coronal part and placing occlusal surface at the mold level, the remaining procedures were same as enamel specimen. Resin composite(Z250. 3M. U.S.A.) was condensed on to the prepared surface in two increments using a mold kit(Ultradent Inc., U.S.A.). Each increments was light cured for 40 seconds. After 24 hours in tap water at room temperature, the specimens were thermocycled for 1000cycles. Shear bond strengths were measured with a universal testing machine(Instron 4465, England). To investigate infiltration patterns of adhesive materials, the surface of specimens was examined with scanning electron microscope. The results were as follows: 1. In enamel the mean values of shear bond strengths in vibration groups(group 2, 4, 6) were greater than those of non-vibration group(group 1, 3, 5). The differences were statistically significant except AQ bond group. 2. In dentin, the mean values of shear bond strengths in vibration groups(group 2, 4, 6) were greater than those of non-vibration groups(group 1, 3, 5). But the differences were not statistically significant except One-Up Bond F group. 3. The vibration group showed more mineral loss in enamel and longer resin tag and greater number of lateral branches in dentin under SEM examination.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Journal of Adhesion and Interface
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• v.16 no.2
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• pp.69-75
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• 2015

Stone board for the rock bed was needed to reduce weight using thin thickness and reinforced materials. In this work, stone/wood board for rock bed was studied. Stone and wood were attached to reduce total weight of stone for rock bed. For reinforcing wood heat treatment method was used to change surface and mechanical properties. Mechanical strength of heat treated wood increased more than neat condition. The optimum heat treatment condition was set on $100^{\circ}C$ under tensile, flexural loads whereas surface energy was also obtained by contact angle measurement. Optimum adhesive condition was to get the maximum adhesion between stone and wood. Lap shear test was performed for stone/wood board with different adhesives such as amine type epoxy, polyurethane, chloro-rubber and vinyl chloride acetate type. Fracture surface of lap shear test was shown at wood fracture part on stone using amine type epoxy adhesive. It was found that for high adhesion between stone and wood the optimum adhesive was epoxy type for the rock bed.

• Journal of the Korean Wood Science and Technology
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• v.38 no.4
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• pp.316-322
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• 2010

The research attempted to develop a wood adhesive based on waste cooking oil, using ozonification technology for the chemical structure modification. The waste cooking oil (WCO) was reacted with $O_3$ for different times; 1 h, 2 h, and 3 h. The chemical structure modifications of the ozonized WCOs were examined by Fourier transform Infrared (FT-IR) spectrum. The FT-IR spectrum of WCO had an absorbance peak at 3,010 $cm^{-1}$ that was the characteristic peak of the unsaturated double bonds. As ozone treatment time increased, the peak of the double bond was disappeared and carboxyl peak appeared at 1,700 $cm^{-1}$. Especially, the double bond of 3 hrs-ozonized WCO was vanished almost. In results of the dry bonding strengths of the 3 hrs-ozonized WCO mixed with polymeric methylene diphenyl diisocyanate (pMDI) were the strengths of weight ratio of 3hrs-ozonized WCO : pMDI, 1 : 0.5, 8.08 kgf/$cm^2$, 1 : 0.75, 9.53 kgf/$cm^2$ 1 : 1, 44.16 kgf/$cm^2$, 1 : 2, 58.08 kgf/$cm^2$, 1 : 3, 61.41 kgf/$cm^2$, and 1 : 4, 46.95 kgf/$cm^2$. Therefore, it was found that the optimum equivalent ratio was formed at the ratio of 1 : 2 or 1 : 3. Under wetting the bonding strength of 1 : 3 ratio was appeared higher than that of 1 : 2 ratio, while the results obtained from hot-water and cyclic boiling shear test were similar.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.41-48
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• 2010

To improve the pot life of one-part in-house anisotropic conductive paste (ACP) formulations, 2-methyl imidazole curing accelerator powders were encapsulated with five agents. Through measuring the melting point of the five agents using DSC, it was confirmed that a encapsulation process with liquid-state agents is possible. Viscosity of ACP formulations containing the encapsulated imidazole powders was measured as a function of storage time from viscosity measurements. As a result, pot life of the formulations containing imidazole powders encapsulated with stearic acid and carnauba wax was improved, and these formulations indicated similar curing behaviors to a basic formulation containing rare imidazole. However, the bondlines made of these formulations exhibited low average shear strength values of about 37% level in comparison with the basic formulation.