• The Journal of the Acoustical Society of Korea
• /
• v.33 no.2
• /
• pp.102-110
• /
• 2014

The effect of a bonding layer on the performance of a quarter-wave (${\lambda}/4$) mode PVDF ultrasound transducer having not only a piezoelectric layer but also a non-piezoelectric layer between two electrodes was analyzed. The equivalent circuit of a transmission line model by Kikuchi et al.[Sound of IEICE, 55-A, 331-338 (1981)] was introduced for the analysis. The validity of the model was confirmed by comparison with a KLM model for three postulated adhesion cases of a $80{\mu}m$ thick piezoelectric PVDF film to a copper (Cu) backer. The pulse-echo responses of five PVDF transducers, each fabricated with a different thickness ($5{\mu}m{\sim}20{\mu}m$) of the bonding layer, were measured and the results were compared with those by simulation. The two results were in good agreement with each other and it was noted that the effect of the bonding layer on the performance of the transducer could be analyzed by the Kikuchi model. In detail, the $20{\mu}m$ bonding layer decreased the center frequency and the bandwidth by about 19.7 % and 25.0 %, respectively, and increased the insertion loss by 57.2 %.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.26 no.5
• /
• pp.343-352
• /
• 2006

In the present paper, the nondestructive test method was suggest to establish the bonding status of a motor case assembly composed of a steel motor case, adiabatic rubber layer and an ablative composite tube with strain data, AE(acoustic emission) signals and UT(ultrasonic test) data. And, finite element analysis was conducted to verify quantitatively the bonding status of motor case assembly under inner pressure loading. The bonding status could be judged whether the bonding status is perfect or contact condition by the data correlation study with AE signals and strain data measured from air pressure test. And, to classify the bonding status of motor case and rubber layer among bonding layers, UT method was also applied. From this study, the bonding status could be classified and detected into fourth types for all bonding layers as follows: (1) initial un-bonding, (2) perfect do-bonding during an air pressure test, (3) partially de-bonding during an air pressure test, and (4) perfect bonding.

• Journal of the Korean Wood Science and Technology
• /
• v.49 no.2
• /
• pp.107-121
• /
• 2021

The purpose of this study is to optimize the bonding method of the plywood suitable for cross-laminated timber (CLT) with plywood as a core by analyzing the flexural performance and failure mode according to the lamina species, the method of bonding plywood in the longitudinal direction, and whether or not adhesive is applied to the joint. In the case of the Douglas fir lamina layer, the modulus of elasticity decreased by about 11.5% due to longitudinal bonding, and the modulus of rupture increased or decreased according to the adhesive application and bonding method. The optimal conditions were derived as the butt joint without adhesive, half lap joint with adhesive, and butt joint. In the case of the larch lamina layer, the modulus of rupture and the modulus of elasticity decreased by about 15% and 40%, respectively. When using the half lab joint and tongue & groove joint, it is believed that it reduces the load transmitted to the middle layer by primarily preventing the failure on flexure at the joint of the plywood layer. From the results of this study, the larch lamina layer used in the manufacturing process of Ply-lam CLT did not show any difference based on the bonding method. Butt joint and half lap joint bonding method are determined to be suitable when using Douglas fir lamina layer.

• Journal of the korean academy of Pediatric Dentistry
• /
• v.30 no.4
• /
• pp.581-592
• /
• 2003

The aim of this study was to evaluate the effect of chemo-mechanical caries removal system($Carisolv^{TM}$, Medi Team, Sweden) for resin adhesion to carious primary and permanent dentin compared with conventional drilling method. The buccal surface of 92 primary molars and 92 permanent molars were used. Exposed dentins were occurred artificial caries. 32 tooth of primary molars and 32 tooth of permanent molars were prepared to observe treated dentin surface with $Carisolv^{TM}$ and conventional drilling method by SEM. Other tooth were prepared to measure resin-dentin shear bonding strength according to caries removal methods and dentin adhesive system. Two adhesive systems and a composite resin were used; single bonding agent(Scotchbond Multi-Purpose Plus, 3M) and self-etching bonding system(Prompt L-pop, 3M ESPE), and a composite resin (Z-250, 3M). The results were as follows : 1. The removal effect of carious dentin on $Carisolv^{TM}$ was stronger on the primary dentin than that to permanent dentin, and dentin surface became rougher with treated $Carisolv^{TM}$ than drilling method. 2. Acid-etched dentin surfaces were showed smoothening without smear layer. 3. In specimen applied single bonding system hybrid layer and adhesive layer were $2-4{\mu}m$ and $10-15{\mu}m$ in thickness, whereas self-etching bonding system were showed only thin hybrid layer($1-2{\mu}m$). 4. The shear bonding strength of group applied single bonding agent was higher than that applied self-etching priming system(P<0.05). 5. The shear bonding strength of group applied $Carisolv^{TM}$ and self-etching priming system were slightly higher than that applied conventional drilling method and self-etching priming system(P>0.05).

• Journal of Powder Materials
• /
• v.14 no.1 s.60
• /
• pp.44-49
• /
• 2007

In the fabrication of dye-sensitized solar cells (DSSCs), carbon counter electrode has been tested for replacing the platinum counter electrode which has two drawbacks: limited surface area and high material cost. Poor mechanical stability of carbon layer due to weak bonding strength to electrically conductive TCO (transparent conducting oxide) glass substrate is a crucial barrier for practical application of carbon counter electrode. In the present study a carbon counter electrode with high conversion efficiency, comparable to Pt counter electrode, could be fabricated by adaption of a bonding layer between particulate carbon material and TCO substrate.

• Corrosion Science and Technology
• /
• v.18 no.5
• /
• pp.175-181
• /
• 2019

A failed spent fuel rod with 53,000 MWd/tU from a nuclear power plant was characterized, and the fission products and oxygen layer in the pellet-clad mechanical interaction region were observed using an EPMA (Electron Probe Micro-Analyzer). A sound fuel rod burned under similar conditions was used to compare and analyze, the results of the failed fuel rod. In the failed fuel rod, the oxide layer represented $10{\mu}m$ of the boundary of the cladding, and $35{\mu}m$ of the region outside the cladding. By comparison, in the sound fuel rod, the oxide layer was $8{\mu}m$, observed in the cladding boundary region. The cladding inner surface corrosion and the resulting fuel-cladding bonding were investigated using an EPMA. Zirconium existed in the bonding layer of the (U, Zr)O compound beyond the pellet cladding interaction gap of $20{\mu}m$, and composition of UZr2O3 was observed in the failed fuel rod. This paper presents the results of the EPMA examination of a spent fuel specimen, and a technique to analyze fission products in the pellet-clad mechanical interaction region.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.27-34
• /
• 2017

Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

• Korean Journal of Materials Research
• /
• v.14 no.11
• /
• pp.780-785
• /
• 2004

The degradation mechanism of soft magnetic properties of $Fe-Hf-N/Cr/SiO_2$ thin films reacted with a bonding glass was investigated. When $Fe-Hf-N/Cr/SiO_2$ films were annealed under $600^{\circ}C$ without the bonding glass, the compositions and the soft magnetic properties of Fe-Hf-N layers were not changed. However, after reaction with the bonding glass at $550^{\circ}C$, the soft magnetic properties of the film were degraded. At $600^{\circ}C$, the saturation magnetization of the reacted film decreased to 13.5 kG, and its coercivity increased to 4 Oe, and its effective permeability decreased to 700. It was founded that O diffused from the glass into the Fe-Hf-N layers during the reaction and generated $HfO_2$ phases. It was considered that the soft magnetic properties of the $Fe-Hf-N/Cr/SiO_2$ films reacted with the bonding glass were primarily degraded by the formation of the Fe-Hf-O-N layer of which the Fe content was below 60 $at\%$, and secondarily degraded by the Fe-Hf-O-N layer above 70 $at\%$.

• 연구논문집
• /
• s.24
• /
• pp.63-79
• /
• 1994

This article reports a experimental study of the method to achieve a bond joint at lower temperature in a short time. DC magnetron sputtering of Sn, Sn/Pb, Sn/In and Sn/Cu on copper substrate was provided as an interlayer for Cu to Cu bonding under the air environment. Various examination was conducted and investigated on the effect of experimental parameters such as coating materials, coating time(or coating thickness), bonding temperature and bonding time etc. Bonding was performed at the temperature of $210^\circC-320^\circC$ for 0sec and interfacial reaction between the coated layer and copper substrate was examined using optical, scanning electron microscope and x-ray diffractometer. From the obtained results, it was found that intermetallic compounds layer consisted of $\eta-phase(Cu_6Sn_5)$ and $\beta-phase(Cu_3Sn)$ was formed at the joint interface for almost all coating materials. But the dominant phase formed in the preetched Cu substrate coated with Sn was $\beta-phase$. A characteristic morphology looks like a reaction ring, which was believed as the strong interconnecting regions between two substrates, was found to be formed on the reaction surface of copper substrates. The morphologies and compositions of the intermetallics, which depends on the regions of the reaction surface, was appeared as greatly different. Based on above results, the new bonding process to make the joint at lower temperature for short time can be admitted as a feasible process.

• Journal of Advanced Marine Engineering and Technology
• /
• v.24 no.1
• /
• pp.59-66
• /
• 2000

To investigate the optimum brazing condition, variation of bonded structure and mechanical properties of novel brazed pure Al with bonding condition (brazing temperature, time and Si/flux ratio) was studied. A basic study of the bonding mechanism was also examined. The optimum brazing condition was obtained at $590^{\circ}$ for 2 minutes and the bonded structure showed that it is composed of almost entirely eutectic Al-Si with near eutectic composition. At higher brazing temperature $630^{\circ}$, hypoeutectic Al-Si structure was observed in the bonded area and resulted in erosion of base metal. The thickness of eutectic layer formed in optimum brazing temperature increased linearly with the square root of time, showing a general diffusion controlled process. The ultimate tensile strength of bonded joint brazed at an optimum brazing condition was about 60% of base metal and its fracture surface showed a brittle mode.