• Journal of Welding and Joining
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• v.32 no.1
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• pp.40-46
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• 2014

Bonding technology and bonding mechanism of metal to ceramic including brazing, diffusion bonding, friction welding and etc were reviewed in this study. Various factors should be considered from a bonding design step to acquire a good bonding joint because of a large difference between metal and ceramic in crystal lattice, coefficient of thermal expansion and various properties. In addition, metal and ceramic bonding technologies are constantly being developed according to precise components, multi-function and application to harsh environment. However, improvement of bonding properties and bonding reliability also should be accompanied. Bonding of ceramics, such as $ZrO_2$, $Ti_3AlC_2$ and SiC, to metals like Ti-alloy, TiAl and steel were described in this paper.

• 한국노년학
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• v.38 no.4
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• pp.999-1013
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• 2018

This study examined the effect of the perception of age-friendly environment on perceived social bonding. In particular, this study focused on the mediating effects of perception of age-integration between perception of age-friendly environment and perceived social bonding. The data were analyzed using the '2017 Ages Integration Survey' conducted by the Korea Research Foundation(SSK). A total of 997 adults from 20 to 86 ears of age were participated in this study. The perception of age-friendly environment was measured using the age-friendly city guidelines set out by WHO and perception of age-integration was measured using questions that asked about age flexibility and age diversity. Also, the social capital scale was used to measure perception of social bonding. In order to increase the reliability of the analysis results, age, gender, educational achievement and residential area were controlled. Structural Equation Modeling approach was employed to answer the research questions. The results are following. First, perception of age-friendly environment was significantly associated with perceived social bonding in a positive direction, controlling for age, gender, educational achievement and residential area. Second, perception of age-integration partially mediated the relationship between perception age-friendly environment and perceived social bonding controlling for covariates. Based on these findings, this study proposes political and practical intervention strategies to promote age-friendly environment and age-integration.

• The Journal of the Korean dental association
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• v.49 no.5
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• pp.265-278
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• 2011

The introduction of zirconia-based materials to the dental field broadened the design and application limits of, all-ceramic restorations. Most ceramic restorations are adhesively luted to the prepared tooth, however, resin bonding to zirconia components is less reliable than those to other dental ceramic systems. It is important for high retention, prevention of microleakage, and increased fracture resistance, that bonding techniques be improved for zirconia systems. Strong resin bonding relies on micromechanical interlocking and adhesive chemical bonding to the ceramic surface, requiring surface roughening for mechanical bonding and surface activation for chemical adhesion. In many cases, high strength ceramic restorations do not require adhesive bonding to tooth structure and can be placed using conventional cements which rely only on micromechanical retention. However, resin bonding is desirable in some clinical situations. In addition, it is likely that strong chemical adhesion would lead to enhanced long-term fracture and fatigue resistance in the oral environment.

• Journal of Radiation Industry
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• v.6 no.1
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• pp.89-94
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• 2012

Three-dimensional network hydrogels were prepared by ${\gamma}$-irradiation of aqueous solutions of poly(vinyl alcohol) (PVA) and glycerol (Gly). Oven-drying was used to measure the gel fraction (G), hydration (H) or swelling behavior (S) of the prepared hydrogels. This study made a hypothesis that hydrogen bonds due to addition of glycerol and change of dry states such as freeze-drying (FD), room-drying (RD) and oven-drying (OD) acts on the G, H, and S. Interesting results on the hydrogen bonding effect in the prepared hydrogels are monitored at different drying conditions. The FD samples have a higher G values with increase in glycerol content as compared with the OD and RD samples. The formation of strong hydrogen bonding network among Gly molecules and hydrogel matrix was considered as the main driving force, resulting in the changes in the G, H, and S of the hydrogels under different drying conditions.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.48 no.1
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• pp.61-66
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• 2016

In order to improve the bonding efficiency of starch adhesives and water resistance of corrugated board, mixing ratio of additives dosage was changed and its effects were analyzed. When the additives dosage was increased, bonding strength, vertical compression strength, bursting strength and water resistance were increased, because of hydroxyl groups or acetyl groups in starch adhesives and cellulose fibers of corrugated board were cross-linked by additives. When 1.0% glyoxal dosage was added, flat crush strength and vertical compression strength were increased. With 1.5% glyoxal, bonding strength and bursting strength were increased. However, 2.0% glyoxal dosage was added, most of strength except bursting strength were decreased. Thus, when the appropriate amount of additives are added during corrugated board production process, increased bonding efficiency of starch adhesives and higher water resistance of corrugated board can be achieved.

• Korean Journal of Materials Research
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• v.18 no.4
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• pp.204-210
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• 2008

$1.5\;{\mu}m$-thick copper films deposited on silicon wafers were successfully bonded at $415^{\circ}C$/25 kN for 40 minutes in a thermo-compression bonding method that did not involve a pre-cleaning or pre-annealing process. The original copper bonding interface disappeared and showed a homogeneous microstructure with few voids at the original bonding interface. Quantitative interfacial adhesion energies were greater than $10.4\;J/m^2$ as measured via a four-point bending test. Post-bonding annealing at a temperature that was less than $300^{\circ}C$ had only a slight effect on the bonding energy, whereas an oxygen environment significantly deteriorated the bonding energy over $400^{\circ}C$. This was most likely due to the fast growth of brittle interfacial oxides. Therefore, the annealing environment and temperature conditions greatly affect the interfacial bonding energy and reliability in Cu-Cu bonded wafer stacks.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.4
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• pp.275-280
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• 1999

The glass-to-glass electrostatic bonding process in vacuum environment was developed and the tubeless-packaged FED was fabricated based on the bonding process. The fabricated tubeless-packaged FED showed stable field emission characteristics and potential applicability to the FED tubeless packaging and vacuum in-line sealing.

• Journal of the Semiconductor & Display Technology
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• v.16 no.1
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• pp.29-33
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• 2017

This paper presents a development of vision aligner with three channels for the wafer and plate bonding machine in manufacturing of LED. The developed vision aligner consists of three cameras and performs wafer alignment of rotation and translation, flipped wafer detection, and UV Tape detection on the target wafer and plate. Normally the process step of wafer bonding is not defined by standards in semiconductor's manufacturing which steps are used depends on the wafer types so, a lot of processing steps has many unexpected problems by the workers and environment of manufacturing such as the above mentioned. For the mass production, the machine operation related to production time and worker's safety so the operation process should be operated at one time with considering of unexpected problem. The developed system solved the 4 kinds of unexpected problems and it will apply on the massproduction environment.

• Korean Institute of Interior Design Journal
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• v.22 no.5
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• pp.367-375
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• 2013

Using the 'New material' concept has recently been introduced into the natural characteristics. In the course of such a, Janine M. Benyus has proposed to mimic the characteristics of natural ecosystems to mention the concept of Biomimicry. Process made engineered using technical elements for representing the material properties of Biomimicry such will be acting importantly, This study intends to analyze how new materials applied to 'Biomimicry' characteristics are processed in space. The results were as follows : 1) Processing methods of new materials resulted as 'Forming', 'Surface treatment', 'Bonding', 'Inserting'. These four were divided and analyzed into 'Form', 'System', 'Adaptation'. As a result of this analysis, such significances were shown as 'Forming/Surface treatment/Bonding' in 'Form', 'Bonding' in 'System' and 'Adaptation'. 2) 'Bonding' applied to 'System' of new material can be recycled to be combined with other materials through the existing adhesive material, and present as a solution of 'Sustainable development'. 3) 'Bonding' applied to 'Adaptation' of new material is to impart the ability to react to the environment through the joint, but is characteristic, at this time, using digital and other field technology. It appeared primarily that it can be known to meet the social trends and convergence between fields. Thus, as the finish that are friendly to the environment from the interior design, the results of the study are expected to be utilized in the study of new materials guidelines.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.