• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.7-13
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• 2007

In the optical module for optical communications, the flip chip bonding is used fer the precise alignment of the optical fiber and optical device. In flip chip bonding, the optical device is aligned and welded while observing the alignment mark of substrate and chip by using flip chip bonder in order to bond the optical device at the exact position. In this research, optical passive alignment method of photodiode(PD) flip chip bonding is suggested for low cost optical subassembly. By using the visible He-Ne laser (633nm wavelength), photodiode is easily aligned with emitting spot on the optical fiber with the help of stereoscopic alignment system. We compensated wavelength dependent deviation about 4m to find out real alignment position of 1550nm input laser by ray tracing. The maximum optical coupling efficiency between the optical fiber and photodiode was about 23.3%.

• Journal of Korea Foundry Society
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• v.32 no.1
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• pp.50-56
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• 2012

Fusion bonding of cast iron and Al alloy is an effective way to improve the properties such as low inertia, high efficiency and corrosion resistance in machinery parts. In case of fusion bonding, intermetallic compound layers are formed at the interface between cast iron and Al alloy interface. It is important to control the intermetallic compound layers for improving bonding strength. The formation behavior of intermetallic compound layer by heat treatment has been investigated. Heat treatment was performed at temperature from $600^{\circ}C$ to $800^{\circ}C$ with $100^{\circ}C$ interval for an hour to investigate the phase transformation during heat treatment. Heat treated specimens were analyzed by using FE-SEM, EPMA and EDS. The EPMA/WDS results revealed that various phases were formed at the interface, which exhibited 4 distinct intermetallic compound layers such as ${\tau}_6-Al_{4.5}FeSi$, ${\tau}_2-Al_3FeSi$, ${\tau}_{11}-Al_5Fe_2Si $and ${\eta}-Al_5Fe_2$. Also, fine precipitation of ${\tau}_1-Al_2Fe_3Si_3$ phase was formed between ${\tau}_{11}$ and ${\eta}$ layer. The phase fraction in intermetallic compound layer was changed by heat treatment temperature. At $600^{\circ}C$, intermetallic compound layer of ${\tau}_6$ phase was mainly formed with increasing heat treatment time. With increasing heat treatment temperature to $800^{\circ}C$, however, ${\tau}_2$ phase was mainly distributed in intermetallic compound layer. ${\tau}_1$ phase was remarkably decreased with increasing heat treatment time and temperature.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.408-411
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• 2008

In an attempt to enhance luminance efficiency and to reduce discharge delays of test panels with aluminum fence-electrodes, various designs of the electrodes were prepared by chemically etching the aluminum foils bonded to soda-lime glass substrate via anodic bonding process. The effects of fence design on luminance and discharge characteristics were investigated and compared with conventional ac-PDPs. These results showed a possibility of using fence-type aluminum electrode at front plates of ac-PDDs without sacrificing its performance.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.62-65
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• 2003

VLM-ST process requires an additional human interaction due to the manual stacking and bonding. Hence, building time, building cost and the part quality are dependent on the skill of labor. In this present work, a novel rapid prototyping (RP) process, as an automatic VLM-ST (VLM-STA), has been proposed to improve building efficiency of VLM-ST process and reliability of products. The apparatus of VLM-STA is designed to embody the process. Several characteristics of the proposed process and the apparatus are discussed. In order to examine the efficiency and the applicability of the proposed process, various three-dimensional shapes, such as a piston and a human head shape, are fabricated on the apparatus.

• Bulletin of the Korean Chemical Society
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• v.27 no.1
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• pp.71-76
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• 2006

Porous polymer monolithic columns were prepared by the direct free radical copolymerization of methacrylic acid and ethylene glycol dimethacrylate within the confines of a chromatographic column in the presence of toluene-dodecanol as a porogenic solvent. The separation characteristics of the monolithic columns were tested by a homologous series of xanthine derivatives, theophylline and caffeine. The effects of the polymerization mixture composition and polymerization condition, mobile phase composition, flow rate and temperature on the retention times and separation efficiencies were investigated. The results showed that the selection of correct porogenic solvents and appropriate polymerization conditions are crucial for the preparation of the monolithic stationary phases. The separation efficiency was only extremely weakly dependent on flow rate and temperatures. Hydrogen-bonding interaction played an important role in the retention and separation. Compared with conventional particle columns, the monolithic column exhibited good stability, ease of regeneration, high separation efficiency and fast analysis.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.12
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• pp.1130-1135
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• 2015

The bond pull test is the most widely used technique for the evaluation and control of wire bond quality. The wire being tested is pulled upward until the wire or bond to the die or substrate breaks. The inspector test strength of wire by manually and it takes around 3 minutes to perform the test. In this paper, we develop a 3D vision system to measure 3D position of wire. It gives 3D position data of wire to move a hook into wires. The 3D measurement method to use here is a confocal imaging system. The conventional confocal imaging system is a spot scanning method which has a high resolution and good illumination efficiency. However, a conventional confocal systems has a disadvantage to perform XY axis scanning in order to achieve 3D data in given FOV (Field of View) through spot scanning. We propose a method to improve a parallel mode confocal system using a micro-lens and pin-hole array to remove XY scan. 2D imaging system can detect 2D location of wire and it can reduce time to measure 3D position of wire. In the experimental results, the proposed system can measure 3D position of wire with reasonable accuracy.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.42 no.2
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• pp.41-45
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• 2010

This study was performed to evaluate the effect of paper property changes by internal addition of surface strength agent on printability. Advances in printing technique has required the development of paper qualities in many aspects. Basically paper structure is composed of hydrogen bonds which induce many problems in high speed printing machine because of weak bonding strength. One of the important printing problems is surface picking when mechanical pulp or recycled pulp are used. It was caused by the ink-stained blanket in printing process because accumulations of pollutant in white water and other elements which are bonded weakly or do not have hydrogen bonds. Debris at paper surface adheres to blanket which deteriorates printing efficiency and causes various problems. To complement these problems, Pennocel 5137 of polysaccharide structure was used as an agent to improve paper's surface property, strength and printability. Paper surface picking was analyzed by RI-1 test. As the dosage amount increased tensile strength, fiber bonding strength and ZDT strength were improved. Further more formation, smoothness and surface picking resistance were improved. It was confirmed that when adding polysaccharide structure polymers to improve surface strength such as surface picking resistance, it was also possible to improve tensile strength, fiber bonding strength, formation and smoothness.

• The Journal of Advanced Prosthodontics
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• v.4 no.3
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• pp.121-126
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• 2012

PURPOSE. The aim of the study was to evaluate the effect of 3 silicone primers and 3 surface characterization of acrylic resin surface on bond strength between silicone elastomer and acrylic resin. MATERIALS AND METHODS. 96 Cosmesil silicones bonded to heat-curing acrylic resin were fabricated with the dimension of $75{\times}10{\times}3$ mm. The 3 primers used in this study were G611 platinum primer, A-330 Gold platinum primer, and cyanoacrylates resin. Specimens without primer were used as control. The 3 types of surface characterization done were retentive holes with 1.5 mm in diameter and 0.5 mm deep, retentive beads of 0.6 mm diameter and the third type which was plain without any characterization. The specimens were then checked for bond strength by subjecting them to $180^{\circ}$ peel test on a universal testing machine. The obtained results were then subjected to statistical analysis using 2-way ANOVA and Scheff$\acute{e}$ multiple post hoc procedures. The statistical significance was set at 5% level of significance. RESULTS. The maximum bond strength was seen for samples in which A-330G primer was used followed by G611 primer. The control group showed the minimum bond strength. Surface characterization of retentive holes increased the bond strength considerably as compared to retentive beads and samples without any surface characterization. CONCLUSION. Within the limitations of the study, A-330G primer was more compatible with Cosmesil M511 silicone and has better bonding of Cosmesil to acrylic resin. Retentive holes made on acrylic surface increased the bond strength considerably than those without any surface characterization.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.3
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• pp.189-194
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• 2014

In this paper, PV modules using a low-temperature conductive film(LT-CF) as a bonding material between a cell and a solder free ribbon were produced and chracterized, which is more environmental-friendly, cost effective and high efficient. Mainly, filed electrical performance of PV modules using three different types of bonding material; a convetional solder ribbon(SR), a LT-CF and a light-capturing Ribbon(LCR) were compared to comfirm the feasibility of LT-CF as a bonding material. The filed test were conducted for 3 months and results were discussed in terms of amount of output energy production and efficiency.

• Computers and Concrete
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• v.12 no.5
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• pp.651-668
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• 2013

Concrete structures need repairing due to various reasons such as deteriorative effects, overloading, poor quality of workmanship and design failures. Cement based repair mortars are the most widely used solutions for concrete repair applications. Various factors may affect the bond strength between concrete substrate and repair mortars. In this paper, the effects of polymer additives, strength of the concrete substrate, surface roughness, surface wetness and aging on the bond between concrete substrate and repair mortar has been investigated. Full factorial experimental design is employed to investigate the main and interaction effects of these factors on the bond strength. Analysis of variance (ANOVA) under design of experiments (DOE) in Minitab 14 Statistical Software is used for the analysis. Results showed that the interaction bond strength is higher when the application surface is wet and strength of the concrete substrate is comparatively high. According to the results obtained from the analysis, the most effective repair mortar additive in terms of bonding efficiency was styrene butadiene rubber (SBR) within the investigated polymers and test conditions. This bonding ability improvement can be attributed to the self-flowing ability, high flexural strength and comparatively low air content of SBR modified repair mortars. On the other hand, styrene acrylate rubber (SAR) modified mortars was found incompatible with the concrete substrate.