• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2000.05a
• /
• pp.743-746
• /
• 2000

The removal of contaminants of silicon wafers has been investigated by various methods. Laser cleaning is the new dry cleaning technique to replace wafer wet cleaning in the near future. A dry laser cleaning uses inert gas jet to remove contaminant particles lifted off by the action of a KrF excimer laser. A laser cleaning model is developed to simulate the cleaning process and analyze the influence of contaminant particles and experimental parameters on laser cleaning efficiency. The model demonstrates that various types of submicrometer-sized particles from the front sides of silicon wafer can be efficiently removed by laser cleaning. The laser cleaning is explained by a particle adhesion model. including van der Waals forces and hydrogen bonding, and a particle removal model involving rapid thermal expansion of the substrate due to the thermoelastic effect. In addition, the experiment of wafer laser cleaning using KrF excimer laser was conducted to remove various contaminant particles.

• International Journal of Precision Engineering and Manufacturing
• /
• v.1 no.2
• /
• pp.61-66
• /
• 2000

In this paper, we discuss the machining characteristics of HDD glass. Glass is now being used globally as a data storage device, Such glasses are usually machined by lapping by this technique requires a long machining time, resulting in low productivity, For this reason, we examine the possibility of EILD grinding in HDD glass workpieces, A move to ELID grinding may result in substantial cost reduction. Our purpose is to investigate the grinding characteristics of HDD glass in ELID grinding. The bonding materials for fixing the abrasives of cast iron, cobalt and bronze are applied, and grinding conditions such as rotation speed and feeding are varied. Results show that with the use of ELID, mirror surfaces can be achieved with high efficiency.

• Journal of Welding and Joining
• /
• v.32 no.3
• /
• pp.19-26
• /
• 2014

Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2002.08a
• /
• pp.533-535
• /
• 2002

Electrode formation methods such as a metal-taping, a electrolytic plating, and a metal-paste melt-bonding, are introduced for an external electrode fluorescent lamp. The characteristics of luminance and efficiency for various external electrode types have been investigated.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2004.10a
• /
• pp.325-328
• /
• 2004

This paper deals with void crushing behavior by ingot forging process which consists of sequential operations of upset forging and bloom forging. The predicted results of void crushing behavior by the simplified global-local method using F.E. analysis showed that the inherent void at the top region of the ingots remains incompletely crushed even after several forging operations. From the results of the hot upset forging test using the billets with drilled voids, it was found that the bonding efficiency of the void after forging process increases with an increase in deformation, and a decrease of initial diameter of voids.

• Journal of Korea Technical Association of The Pulp and Paper Industry
• /
• v.40 no.3
• /
• pp.1-8
• /
• 2008

The efficiency of retention systems including compozil-G, hydrocol, compozil-S, and micropolymer under highly closed papermaking system was evaluated using contaminated white waters prepared in the laboratory. Compozil-G and compozil-S performed better in retention than hydrocol and micropolymer systems. This suggested that stronger hydrogen bonding between fiber and guar gum or starch was formed to give stronger flocculation and better retention. Especially compozil-G outperformed compozil-S in retention, and this indicated the presence of stronger interaction between guar and cellulose fibers probably due to their similarity in chemical structure. Two compozil retention systems decreased the cationic demand and COD more effectively than hydrocol and microparticle systems. In particular, compozil-G that uses guar gum was highly effective in decreasing anionic trashes at low dosage.

• Journal of the Korean Wood Science and Technology
• /
• v.36 no.5
• /
• pp.11-23
• /
• 2008

The mechanical and physical properties of zinc borate (ZB)-modified oriented strandboard (OSB) from southern wood species were investigated in this study. OSB panels treated with ZB were not significantly weaker than the untreated samples in terms of specific modulus of elasticity (SMOE) and specific modulus of rupture (SMOR). ZB showed the negative effect on specific internal bond (SIB) strength, since some of ZB would persist as a powder state on the flake surfaces, thereby reducing the bonding efficiency of the adhesive. The ZB level did not show significant effect on thickness swelling (TS). ZB-modified OSB showed the suitable mechanical and physical properties for the structural wood composites.

• Journal of the Korean Applied Science and Technology
• /
• v.18 no.3
• /
• pp.180-185
• /
• 2001

Antibiotics polymer prepared by chemical bonding and simple blending of antibacterial into polymers have attracted much interest because of their long-lasting and antibacterial activity. Antibiotics polymer can significantly reduce losses associated with dissolution, photolytic decomposition and volatillization. Further more, increased efficiency safety and selectivity are additional benefits which may be realized. In this study, Antibiotics polymer was synthesized by chemical reaction of polyacrylic acid with sulfamethazine by N,N'-dicyclohexylcarbodiimide(DCC) method. Antibacterial susceptibility was determined against Streptococcus pyrogenes[gram(+)] and Esherichia coli.[gram(-)] using a standardized disc test. As a result, the synthetic antibiotics polymer exhibited the broad susceptibilty against Streptococcus pyrogenes and Esherichia coli. Especially, the antibiotic effect of antibacterial polymer against Gram negative(Esherichia coli) was much stronger than that against Gram positive(Streptococcus pyrogenes).

• Bulletin of the Korean Chemical Society
• /
• v.30 no.3
• /
• pp.589-594
• /
• 2009

We have performed DFT B3LYP/6-31G(d,p) calculations to investigate the complexation behaviors of the ethyl ester derivative of p-tert-butylcalix[6]arene (1) toward a variety of alkylammonium ions. We have studied the binding sites of these host-guest complexes focusing on the p-tert-butylcalix[6]arene pocket (endo) of 1. The smaller alkylammonium cations have the better complexation efficiency than the bulkier alkylammonium ions with the p-tert-butylcalix[6]aryl ester. The hydrogen-bonding of N-H$\ldots$O is one of the important factors for the complexation behavior of the p-tert-butylcalix[6]aryl ester, in addition to the NH-aromatic π, CH-aromatic π and electrostatic interactions, and the steric hindrance of alkylammonium cation. The hydrogen-bonded distances and angles of N-H$\ldots$O are reported for the complexes of the p-tert-butylcalix[6]aryl ester with various alkylammonium ions.

• Bulletin of the Korean Chemical Society
• /
• v.27 no.11
• /
• pp.1737-1740
• /
• 2006

The optimized structures and complexation energies of bis(18-crown-6-ether) analogue (2) of Trgers base (1) with a series of primary alkylbisammonium ions have been calculated by DFT B3LYP/6-31G(d,p) method. The calculated complexation efficiency (-142.84 kcal/mol) of 2 for butane-1,4-diylbisammonium guest is better than twice of the value (-61.40 kcal/mol) for butylammonium ion. The multiple hydrogen-bond abilities for the complexes are described as the function of the length of the alkyl substituents of the bisammonium guests with normal-alkyl chain [$-(CH_2)_{n-}$, n = 4-8]. The longer bisammonium guest shows the stronger hydrogen-bonding characterizations (the distance and the quasi-linear angle of the N-H…O) to the host 2 than the shorter bisammonium ions. These calculated results agree with the experimental data of the complexation of 2 with bisammonium salts ([$NH_3(CH_2)_nNH_3$] $Cl_2$).