A fiber-optic magnetic sensor system for the detection of small ac magnetic field(200Hz-2 kHz) was constructed. Magnetic field sensing part was fabricated by bonding a section of optical fiber to amorphous metallic glass(2605SC) having large magnetostriction effect. And with the directional coupler, all fiber type Mach-Zehnder interferometer was constructed to measure the variation of the external magnetic field by translating it into the optical phase shift in the interferometer. The signal fading problem of the interferometer, which is due to random phase drifts originated from the environment, i.e., temperature fluctuation, vibrations, etc., was elliminated by feedback phase compensation. This allows the sensitivity to be maintained at the maximum by keeping the interferometer in quadrature phase condition. The frequency response of metallic glass was found to be nearly flat in the range of 90 Hz-2 kHz and dc bias field for the maximum ac response was 3.5 Oe. The interferometer output showed good linearity over the range $\pm$0.5 Oe. For 1 kHz ac magnetic field the scale factor S and the minimum detectable magnetic field were measured to be 8.0 rad/Oe and $3X10^{-6} Oe/\sqrt{Hz}$at 1 Hz detection bandwidth respectively.
Kim, Junmo;Kim, Boyeon;Jung, Cheong-Ha;Kim, Gu-sung;Kim, Taek-Soo
Journal of the Microelectronics and Packaging Society
/
v.29
no.3
/
pp.25-29
/
2022
Recently, the importance of electronic packaging technology has been attracting attention, and heterogeneous integration technology in which chips are stacked out-of-plane direction is being applied to the electronic packaging field. The 2.5D integration circuit is a technology for stacking chips using an interposer including TSV, and is widely used already. Therefore, it is necessary to make the interposer mechanically reliable in the packaging process that undergoes various thermal processes and mechanical loadings. Considering the structural characteristics of the interposer on which several thin films are deposited, thermal stress due to the difference in thermal expansion coefficients of materials can have a great effect on reliability. In this study, the mechanical reliability of the metal pad for wire bonding on the silicon interposer against thermal stress was evaluated. After heating the interposer to the solder reflow temperature, the delamination of the metal pad that occurred during cooling was observed and the mechanism was investigated. In addition, it was confirmed that the high cooling rate and the defect caused by handling promote delamination of the metal pads.
Journal of the Korean Recycled Construction Resources Institute
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v.10
no.3
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pp.314-320
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2022
The function of reinforcing fibers used in building materials is to maintain resistance to bending loads and to function for cracking caused by drying shrinkage. High-density fiber-cement composites are mainly used for linear plates and are used to increase bending resistance. Therefore, tensile properties, bonding strength with cement hydrate, alkali resistance, and the like are required. Recently, as the non-combustible performance has been strengthened, a function to minimize the occurrence of sparks during high-temperature heating has been added. Therefore, the use of organic fibers is limited. In this study, a study was conducted to replace polypropylene used as reinforcing fiber with hemp fiber with excellent heat resistance. Hemp fibers have excellent heat resistance, good affinity with cement, and excellent alkali resistance. Based on the total volume of polypropylene fibers used in the existing formulation, the non-combustible performance was compared and evaluated by using hemp fibers instead of the polypropylene fibers, and basic physical properties such as flexural strength were tested. As a result of conducting a non-combustibility and physical property test using hemp fibers with a fiber length of 7 mm using 2 % and 3 % by weight, it was found that there is no remaining time of the flame, and the flexural strength can be secured at 95 % level of the existing polypropylene fiber.
Hydrogenated amorphous carbon(a-C:H) films were deposited on p-type Si(100) by DC saddle-field plasma enhanced CVD to investigate the effect of substrate bias on optical properties and structural changes. They were deposited using pure methane gas at a wide range of substrate bias at room temperature and 90 mtorr. The substrate bias voltage ($V_s$) was employed from $V_s=0 V$ to $V_s=400 V$. The information of optical properties was investigated by photoluminescence and transmitance. Chemical bondings of a-C:H have been explored from FT-IR and Raman spectroscopy. The thickness and relative hydrogen content of the films were measured by Rutherford backscattering spectroscopy (RBS) and elastic recoil detection (ERD) technigue. The growth rate of a-C:H film was decreased with the increase of $V_s$, but the hydrogen content of the film was increased with the increase of $V_s$. The a-C:H films deposited at the lowest $V_s$ contain the smallest amount of hydrogen with most of C-H bonds in the of $CH_2$ configuration, whereas the films produced at higher $V_s$ reveal dominant the $CH_3$ bonding structure. The emission of white photoluminescence from the films were observed even with naked eyes at room temperature and the PL intensity of the film has the maximum value at $V_s$=200 V. With $V_s$ lower than 200 V, the PL intensity of the film increased with V, but for V, higher than 200 V, the PL intensity decreased with the increase of $V_s$. The peak energy of the PL spectra slightly shifted to the higher energy with the increase of $V_s$. The optical bandgap of the film, determined by optical transmittance, was increased from 1.5 eV at $V_s$=0V to 2.3 eV at $V_s$=400 V. But there were no obvious relations between the PL peak and the optical gap which were measured by Tauc process.
Journal of the Korea institute for structural maintenance and inspection
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v.19
no.1
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pp.139-146
/
2015
The amount of by-product from sulphur increases in domestic industrial facilities. However, the amount of its consumption is limited so that the amount of unused sulphur continues to increase. Therefore, in this study, the use sulfur polymer as the concrete surface protecting material was conducted. The compressive strength showed that as the substitution ratio of filler increased up to 40%, the compressive strength also increased. A high compressive strength was shown at the curing temperature of $40^{\circ}C$ (SS, FA) and $60^{\circ}C$ (OPC) according to the type of filler. The difference of compressive strength between air dry curing and water curing was insignificant so that there was no significant influence of moisture during curing process. The evaluation result of bond strength showed that the highest bond strength was shown at the air-dry condition of $40^{\circ}C$ regardless of type of filler. Bonding didn't occur properly during water curing in comparison to air dry curing. Also, in case of the specimen cured at $60^{\circ}C$, discoloration and hair cracks appeared due to the influence of temperature, and the highest bond strength was shown at the substitution ratio of 20% (SS, FA) and 30% (OPC) according to the type of filler. The releasing test result of harmful substance showed that no harmful substance was released, so there is no harmfulness in the surface protecting material using sulfur polymer. As a conclusion drawn in this study, it is most appropriate to substitute silica by approximately 20%, mix and cure at the air-dry condition of $40^{\circ}C$ in order to use sulfur polymer as the surface protecting material.
The equilibria of chemical reaction between [Cu(dl-trans-[14]-diene)]$^{2+}$ and L$^{n-}$(S$_2$O$_3^{2-}$, SCN$^-$, I$^-$, NO$_2^-$) ions were studied by the spectrophotometric method in the range of 15 to 35$^{\circ}C$ and 1 to 1500bar. The equilibrium constants(K) for L$^{n-}$ = S$_2$O$_3^{2-}$, SCN$^-$, I$^-$ and NO$_2^-$ ions at 25$^{\circ}C$ and 1500bar were 3.0, 1.9, 0.6 and 0.5, respectively. The values of K decreased with increasing pressure and temperature. From the temperature effect on equlibrium constant, the thermodynamic parameters(${\Delta}G^{\circ}$, ${\Delta}H^{\circ}$, ${\Delta}S^{\circ}$) of reaction were evaluated and the reactions of [Cu(dl-trans-[14]-diene)]2+ ion with S$_2$O$_3^{2-}$, SCN$^-$ and I$^-$ except NO$_2^-$ ion were exothermic. The volume changes of reaction(${\Delta}$V) had positive values for all the used anions. The values of ${\Delta}$V in cm$^3$/mole for S$_2$O$_3^{2-}$ ion at 1,500, 1,000 and 1,500bar were 26, 22, 19 and 16, and those for S$_2$O$_3^{2-}$, SCN$^-$, I$^-$ and NO$_2^-$ ions at atmospheric pressure 26, 30, 64 and 45, respectively. Bonding character between Cu(Ⅱ)-complex ion and L$^{n-}$ was discussed by comparing both the equlibrium constants experimentally determined and those calculated according to Fuoss's ion-pair equation in case of S$_2$O$_3^{2-}$ ion.
The agglomeration characteristics of coal and silica sand were investigated under various conditions using mixed samples consisting of coal, silica sand, and potassium hydroxide, which is an agglomeration accelerator. The samples were prepared by either physically mixing or using aqueous solutions. The experiments using the physically mixed powder samples were performed with a two hour reaction time. The results showed that the number of aggregates generated increased as the reaction temperature and the total potassium content increased. The experiments using aqueous solutions were performed at 880 ℃, which is the operating temperature of a fluidized bed boiler, and at 980 ℃, which assumes a local hot spot. The amount of agglomeration generated as the reaction time increased and the total potassium content increased was identified. In the experiment performed at 880 ℃, the amount of aggregate generated clearly increased with the reaction time, and in the experiment performed at 980 ℃, assuming a local hot spot, a large amount of aggregate was generated in a relatively short time. The aggregates became harder as the potassium content increased. When the total potassium content was less than 1.37 wt.%, the aggregates were weak at both temperatures and collapsed even with a slight impact. Additionally, the surface characteristics of the silica sand and ash aggregates were observed by SEM-EDS analysis. The analysis revealed a large amount of potassium at the bonding sites. This result indicates that there is a high possibility of aggregation in the form of a eutectic compound when the alkali component is increased.
Objectives: The purpose of this study was to evaluate the effect of various application methods of one-step self-etch adhesives to microtensile resin-dentin bond strength. Materials and Methods: Thirty-six extracted human molars were used. The teeth were assigned randomly to twelve groups (n = 15), according to the three different adhesive systems (Clearfil Tri-S Bond, Adper Prompt L-Pop, G-Bond) and application methods. The adhesive systems were applied on the dentin as follows: 1) The single coating, 2) The double coating, 3) Manual agitation, 4) Ultrasonic agitation. Following the adhesive application, light-cure composite resin was constructed. The restored teeth were stored in distilled water at room temperature for 24 hours, and prepared 15 specimens per groups. Then microtensile bond strength was measured and the failure mode was examined. Results: Manual agitation and ultrasonic agitation of adhesive significantly increased the microtensile bond strength than single coating and double coating did. Double coating of adhesive significantly increased the microtensile bond strength than single coating did and there was no significant difference between the manual agitation and ultrasonic agitation group. There was significant difference in microtensile bonding strength among all adhesives and Clearfil Tri-S Bond showed the highest bond strength. Conclusions: In one-step self-etching adhesives, there was significant difference according to application methods and type of adhesives. No matter of the material, the manual or ultrasonic agitation of the adhesive showed significantly higher microtensile bond strength.
On the basis of the previous study[1], miscibility were investigated and intermolecular interaction strength for the miscibility were relatively compared for the blends poly{2,2-(m-phenylene)-5,5'-bibenzimidazole}(PBI) with two aromatic polyimides (PIs) synthesized by another dianhydride. Aromatic PAAs were prepared by the reaction of condensation of two diamines, 4,4'-methylene dianiline(4,4'-MDA) and 4,4'-oxydianiline(4,4'-ODA) with 3,3',4,4'-diphenylsulfone tetracarboxylic dianhydride(DSDA) using DMAc, and then converted into PIs after curing. PBI/PAA blends were prepared by solution blending. Cast films or precipitated powders of the PBI/PAA blends were cared at a high temperature to transform into PBI/PIs blends. Miscibility and specific intermolecular interaction for miscibility in the blends were investigated, and compared with previous polyimide structures of PBI/PIs blends [1]. Two blends, PBI/DSDA+4,4'-MDA(Blend-V) and PBI/DSDA+4,4'-ODA(Blend-VI), were found miscible : the evidences were optically clear films, synergistic single composition dependent $T_g{\prime}s$, and frequency shifts of N-H stretching band as much as $39{\sim}40cm^{-1}$, and of C=O stretching band near 1730 and $1780cm^{-1}$, 5~6 and $3{\sim}4cm^{-1}$, respectively. The specific intermolecular interactions existing between PBI and PIs were relatively analyzed with the area(A) formed between the $T_g{\prime}s$ of the measured and that of the calculated by the Fox equation at all compositions, the ${\kappa}$ values in Gordon-Taylor equation obtained from the measured $T_g{\prime}s$, and differences of the frequency shifts in the functional N-H and carbonyl stretching band. From the results, the area(A) and the ${\kappa}$ values for Blend-V and VI were smaller than those for Blend-III and IV used in previous study[1]. Differences of the frequency shifts in the functional groups(N-H and C=O) also showed similar tendency. Thus, specific intermolecular interaction strength in terms of hydrogen bonding of PBI/PI blends is dependent upon chemical structures of PIs, that is, PIs it seems that $SO_2$ group in dianhydride(DSDA) has weaker hydrogen bond strength than those of C=O in BTDA. In other words, it implies that the former occupied bulk space than the latter due to the sterric effect.
This study was designed to develop a process for the immobilization of xylose isomerase(D-xylose ketol isomerase, EC 5.3.1.5) from Streptomyces griseolus previously isolated by the authors and its application on a pilot plant scale for the production of high fructose corn syrup. The biomass which has endo-excreted xylose isomerase was homogenized under a pressure of $500kg/cm^2$ and 90.8% of the enzyme recovery of the native activity was obtained as compared to 54.7% recovery by the lysozyme treatment. Ionic bonding method was adopted for the enzyme immobilization due to its many reported merits. It was found that the porous resins such as Diaion HP 20, Duolite A-7, Amberlite IRA 93 and 94 were effective in immobilizing the enzyme. In addition, it was disclosed that the regeneration form of $BO_4--$ is effective for Amberlite IRA 93 and $HCO_3-$ for Diaion HP 20. Optimal immobilization condition for Amberlite IRA 93 was pH 8.0 and $55^{\circ}C$ yielding 80.6% of immobilization. Activity decay test showed half life of the immobilized enzyme with Amberlite IRA 93 was more than 24 days at $65^{\circ}C$. The carrier was evaluated to be resuable and its result showed the relative immobilization yields were 98.2, 93.3, 90.7 and 87.5%, respectively at second, third, forth and fifth rebinding test of the enzyme on Amberlite IRA 93. Optimal temperature of the immobilized enzyme was slightly lowered and the range widened to $60\sim70^{\circ}C$, while optimal pH moved toward $8.0\sim8.3$ in its isomerization reaction. The trial production result of high fructose corn syrup in pilot scale immobilization showed that one liter of immobilized xylose isomerase (350 IXIU/ml-R) is capable producing about 293l high fructose corn syrup(75% dry substance) in 30 days.
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