• Bulletin of the Korean Chemical Society
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• v.35 no.8
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• pp.2443-2447
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• 2014

A kinetic study is reported on nucleophilic substitution reactions of 4-nitrophenyl nicotinate (7) and 4-nitrophenyl isonicotinate (8) with a series of cyclic secondary amines in $H_2O$ containing 20 mol % DMSO at $25.0^{\circ}C$. The Br${\o}$nsted-type plots for the reactions of 7 and 8 are linear with ${\beta}_{nuc}=0.90$ and 0.92, respectively, indicating that the reactions proceed through a stepwise mechanism with expulsion of the leaving group occurring in the rate-determining step. Comparison of the reactivity of 7 and 8 with that of 4-nitrophenyl benzoate (2a) and 4-nitrophenyl picolinate (6) has revealed that their reactivity toward the amines increases in the order 2a < 7 < 8 < 6, although the reactions of these substrates proceed through the same mechanism. Factors that control reactivity and reaction mechanism have been discussed in detail (e.g., inductive and field effects, H-bonding interaction, solvent effect, etc.).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.499-502
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal bar. Bonding mechanism between Cu and Ti was assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding was developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. Finite element analyses for extrusion of Cu-Ti bimetal bars were performed for various process conditions. The deformation history at the contact surface was traced and the proposed new bonding criterion was applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the extrusion of Cu-Ti bimetal bar is suggested.

• Transactions of Materials Processing
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• v.7 no.1
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• pp.66-71
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• 1998

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the bonding conditions as well as the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding the normal pressure and the contact surface expansion are selected as process parameters governing the bonding conditions, in this study the critical normal pressure required for the local extrusion-the protrusion of virgin surfaces by the surface expansion at the interface-is obtained using a slip line method and is then used as a criteron for the bonding. A rigid plastic finite element method is used to analyze the steady state extrusion process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-cent to interface surface. The contact surface area ration and the normal pressure along the interface are calculated and compared to the critical normal pressure to check bonding. It is found that the model predictions are generally in good agreement with the experimental observations. The compar-isons of the extrusion pressure and interface profile by the finite element with those by experi-ments are also given.

• Korean Journal of Materials Research
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• v.14 no.11
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• pp.780-785
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• 2004

The degradation mechanism of soft magnetic properties of $Fe-Hf-N/Cr/SiO_2$ thin films reacted with a bonding glass was investigated. When $Fe-Hf-N/Cr/SiO_2$ films were annealed under $600^{\circ}C$ without the bonding glass, the compositions and the soft magnetic properties of Fe-Hf-N layers were not changed. However, after reaction with the bonding glass at $550^{\circ}C$, the soft magnetic properties of the film were degraded. At $600^{\circ}C$, the saturation magnetization of the reacted film decreased to 13.5 kG, and its coercivity increased to 4 Oe, and its effective permeability decreased to 700. It was founded that O diffused from the glass into the Fe-Hf-N layers during the reaction and generated $HfO_2$ phases. It was considered that the soft magnetic properties of the $Fe-Hf-N/Cr/SiO_2$ films reacted with the bonding glass were primarily degraded by the formation of the Fe-Hf-O-N layer of which the Fe content was below 60 $at\%$, and secondarily degraded by the Fe-Hf-O-N layer above 70 $at\%$.

• Transactions of Materials Processing
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• v.18 no.4
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• pp.342-346
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• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1946-1949
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• 1996

We have performed silicon-to-silicon anodic bonding using glass layer deposited by electron beam evaporation. Wafers can be bonded at $135^{\circ}C$ with an applied voltage of $35V_{DC}$, which enables application of this technique to the vacuum packaging of microelectronic devices, because its bonding temperature and voltage are low. From the experimental results, we have found that the evaporated glass layer more than $1\;{\mu}$ m thick was suitable for anodic bonding. The role of sodium ions for anodic bonding was also investigated by theoretical bonding mechanism and experimental inspection.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.393-397
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• The Journal of Korean Academy of Prosthodontics
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• v.19 no.1
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• pp.61-73
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• 1981

The effects of the opaque porcelain firing temperature, the bonding agent and the degassing prior to the opaque firing On the bond strength were investigated by means of the tensile shear stIe$. The diffusional behaviours at the interface of the porcelain and the alloy, and .the microstructures of the ceramic and metal composite were studied for understanding the bonding mechanism. The results obtained in this experiment were summarizd as follow; 1. With no application of bonding agent, the tensile shear strength of the specimen firing at $1840^{\circ}F$ was higher than that of the specimen firing at $1760^{\circ}F$. 2. The highest bond strength was obtained by application of bonding agent without degassing prior to the opaque firing. 3. Application of bonding agent after the degassing showed the lowest bond strength. 4. The greater number of pores were observed at the firing temperature of $1840^{\circ}F$ than that of $1760^{\circ}F$ in the porcelain and the interface respectively.

• Korean Journal of Metals and Materials
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• v.47 no.4
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• pp.242-247
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• 2009

On the Transient Liquid Phase Bonding (TLPB) phenomenon with the MBF-50 insert metal at narrow gap (under 100), it takes long time for the bonding and the homogenizing. Typically, isothermal solidification is controlled by the diffusion of depressed element of B and Si. However, the amount of B and Si in the MBF-50 filler metal is large. This is reason of the long bonding time. Also, the MBF-50 filler metal did not contained Al and Ti which are ${\gamma}^{\prime}$ phases former. This is reason of the long homogenizing time. From the bonding phenomenon with the MBF-50 insert metal, we search main factors on the bonding mechanism and select several insert-metals for using the wide-gap TLPB. New insert-metals contained Al and Ti which are ${\gamma}^{\prime}$ phases former and decrease the B then the MBF-50. When the new insert-metal was used on the TLPB, the bonding time was decreased about 1/10 times and homogenizing heat treatment was no needed. In spite of the without homogenizing, the volume fraction of ${\gamma}^{\prime}$ phases in the boned interlayer was equal to homogenizing heat treated specimen which was TLPB with the MBF-50. Finally, the new insert metal named WG1 for the wide-gap TLPB is more efficient then the MBF-50 filler metal without decreasing the bonding characteristic.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.4
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• pp.331-339
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• 2018

The IEEE 1588, commonly known as a precision time protocol (PTP), is a standard for precise clock synchronization that maintains networked measurements and control systems. The best master clock (BMC) algorithm is currently used to establish the master-slave hierarchy for PTP. The BMC allows a slave clock to automatically take over the duties of the master when the slave is disconnected due to a link failure and loses its synchronization; the slave clock depends on a timer to compensate for the failure of the master. However, the BMC algorithm does not provide a fast recovery mechanism in the case of a master failure. In this paper, we propose a technique that combines the IEEE 1588 with network bonding to provide a faster recovery mechanism in the case of a master failure. This technique is implemented by utilizing a pre-existing library PTP daemon (Ptpd) in Linux system, with a specific profile of the IEEE 1588 and it's controlled through bonding modes. Network bonding is a process of combining or joining two or more network interfaces together into a single interface. Network bonding offers performance improvements and redundancy. If one link fails, the other link will work immediately. It can be used in situations where fault tolerance, redundancy, or load balancing networks are needed. The results show combining IEEE 1588 with network bonding enables an incredible shorter recovery time than simply just relying on the IEEE 1588 recovery method alone.