Interfacial fracture Energy between Electroless Plated Ni film and Polyimide for Flexible PCB Applications (Flexible PCB용 무전해 도금 Ni 박막/Polyimide 계면파괴에너지 평가)
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- Journal of the Microelectronics and Packaging Society
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- v.14 no.1
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- pp.39-47
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- 2007