• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.499-502
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal bar. Bonding mechanism between Cu and Ti was assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding was developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. Finite element analyses for extrusion of Cu-Ti bimetal bars were performed for various process conditions. The deformation history at the contact surface was traced and the proposed new bonding criterion was applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the extrusion of Cu-Ti bimetal bar is suggested.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.393-397
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• Transactions of Materials Processing
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• v.13 no.7
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• pp.623-628
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• 2004

This paper is concerned with pressure welding, which has been known as a main bonding mechanism during the cold and warm forming such as clad extrusion or bundle extrusion/drawing. Bonding characteristics between the Cu and Al plates by pressure welding are investigated focusing on the weak bonding. Experiments are performed at the cold and warm temperatures ranging from the room temperature to $200^{\circ}C$. The important factors examined in this work are the welding pressure, pressure holding time, surface roughness, and temperature. A bonding map, which can identify the bonding criterion with a weak bonding strength of IMPa , is proposed in terms of welding pressure and surface roughness fur the cold and warm temperature ranges.

• Journal of Korea Foundry Society
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• v.8 no.4
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• pp.429-436
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• 1988

The influences of some casting conditions on bonding ratio and state at bonding zone of stainless steel-cast iron dual tube produced by centrifugal casting process were investigated to estimate fabrication technics. 1) Bonding ratio is increasing such as increasing of inner surface temperature of outer metal(stainless steel STS 304), if pouring temperature of inner metal (cast iron) is constant. 2) The more pouring temperature of inner metal (cast iron) increase, the more bonding ratio increase when inner surface temperature of outer metal (cast iron) is constant. 3) As the mold rotary speed is increase, the hatching area of bonding map (perfect bonding area) goes down to the low pouring temperature of inner metal. 4) In order to predict bonding state of two different metal, we are able to make and use the bonding map about casting conditions such as inner surface temperature of outer metal, pouring temperature of inner metal and mold rotary speed.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.135-142
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• 2024

Cu-Cu bonding, one of the key technologies in advanced packaging, enhances semiconductor chip performance, miniaturization, and energy efficiency by facilitating rapid data transfer and low power consumption. However, the quality of the interface bonding can significantly impact overall bond quality, necessitating strategies to quickly detect and classify in-process defects. This study presents a methodology for detecting defects in wafer junction areas from Scanning Acoustic Microscopy images using a ResNet-50 based deep learning model. Additionally, the use of the defect map is proposed to rapidly inspect and categorize defects occurring during the Cu-Cu bonding process, thereby improving yield and productivity in semiconductor manufacturing.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2007.06a
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• pp.65-68
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• 2007

DOCSIS 3.0 MAC protocol regulate CM and CMTS Channel transfer times through MAP message. Standards does not include the details of MAP Inter-arrival Time affecting the performance of MAC protocols for DOCSIS 3.0. In this paper, we evaluationed the performance of protocol follow in MAP Inter-arrival Time on DOCSIS 3.0. Based on the evaluation results, we propose the optimal MAP Inter-arrival Time. We found that the protocol shows best performance when the MAP Inter-arrival Time is 0.05sec. The research results can apply to performance element which important for the construction of DOCSIS 3.0 base cable networks.

• Transactions of Materials Processing
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• v.18 no.4
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• pp.342-346
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• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.10a
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• pp.77-80
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• 2008

본 논문에서는 채널 결합 기법을 고려하여 DOCSIS 3.0 망에서 상향스트림 스케줄러를 설계하고 스케줄링 알고리즘을 제안하였다. 본 논문에서 제안하는 스케줄러는 Bonding Process Module, QoS Service Classifier, Upstream Scheduler, Framing Module 등으로 구성된다. 결합 채널에 대한 대역을 할당하기 위해 균등요구대역 할당알고리즘, 현재 요구대역할당을 고려한 요구대역 할당알고리즘, 이전 MAP의 대역 할당 정보를 고려한 요구대역 할당알고리즘을 제안하였다. 제안한 스케줄러 및 스케줄링 알고리즘의 성능을 비교평가하기 위해 OPNET 기반의 DOCSIS 3.0 시뮬레이션 모델을 개발하고, 시뮬레이션을 수행하였다. 성능평가 결과 CM에서 큐잉 지연과 CMTS에서 데이터 수신량 관점에서 균등요구할당 알고리즘이 우수한 성능을 나타냄을 확인할 수 있었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.641-642
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• 2009

• Bulletin of the Korean Chemical Society
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• v.25 no.2
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• pp.198-202
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• 2004

Hydrogen bond is an important factor in the structures of carbohydrates. Because of great strength, short range, and strong angular dependence, hydrogen bonding is an important factor stabilizing the structure of carbohydrate. In this study, conformational properties and the hydrogen bonds in GlcNAc( ${\beta}$1,3)Gal(${\beta}$)OMe in DMSO are investigated through NMR spectroscopy and molecular dynamics simulation. Lowest energy structure in the adiabatic energy map was utilized as an initial structure for the molecular dynamics simulations in DMSO. NOEs, temperature coefficients, SIMPLE NMR data, and molecular dynamics simulations proved that there is a strong intramolecular hydrogen bond between O7' and HO3' in GlcNAc( ${\beta}$1,3)Gal(${\beta}$)OMe in DMSO. In aqueous solution, water molecule makes intermolecular hydrogen bonds with the disaccharides and there was no intramolecular hydrogen bonds in water. Since DMSO molecule is too big to be inserted deep into GlcNAc(${\beta}$1,3)Gal(${\beta}$)OMe, DMSO can not make strong intermolecular hydrogen bonding with carbohydrate and increases the ability of O7' in GlcNAc(${\beta}$1,3)Gal(${\beta}$)OMe to participate in intramolecular hydrogen bonding. Molecular dynamics simulation in conjunction with NMR experiments proves to be efficient way to investigate the intramolecular hydrogen bonding existed in carbohydrate.