• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 춘계학술대회 논문집
• /
• pp.499-502
• /
• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal bar. Bonding mechanism between Cu and Ti was assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding was developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. Finite element analyses for extrusion of Cu-Ti bimetal bars were performed for various process conditions. The deformation history at the contact surface was traced and the proposed new bonding criterion was applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the extrusion of Cu-Ti bimetal bar is suggested.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2005년도 추계학술대회 논문집
• /
• pp.393-397
• /
• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 소성∙가공
• /
• 제13권7호
• /
• pp.623-628
• /
• 2004

This paper is concerned with pressure welding, which has been known as a main bonding mechanism during the cold and warm forming such as clad extrusion or bundle extrusion/drawing. Bonding characteristics between the Cu and Al plates by pressure welding are investigated focusing on the weak bonding. Experiments are performed at the cold and warm temperatures ranging from the room temperature to $200^{\circ}C$. The important factors examined in this work are the welding pressure, pressure holding time, surface roughness, and temperature. A bonding map, which can identify the bonding criterion with a weak bonding strength of IMPa , is proposed in terms of welding pressure and surface roughness fur the cold and warm temperature ranges.

• 한국주조공학회지
• /
• 제8권4호
• /
• pp.429-436
• /
• 1988

The influences of some casting conditions on bonding ratio and state at bonding zone of stainless steel-cast iron dual tube produced by centrifugal casting process were investigated to estimate fabrication technics. 1) Bonding ratio is increasing such as increasing of inner surface temperature of outer metal(stainless steel STS 304), if pouring temperature of inner metal (cast iron) is constant. 2) The more pouring temperature of inner metal (cast iron) increase, the more bonding ratio increase when inner surface temperature of outer metal (cast iron) is constant. 3) As the mold rotary speed is increase, the hatching area of bonding map (perfect bonding area) goes down to the low pouring temperature of inner metal. 4) In order to predict bonding state of two different metal, we are able to make and use the bonding map about casting conditions such as inner surface temperature of outer metal, pouring temperature of inner metal and mold rotary speed.

• 반도체디스플레이기술학회지
• /
• 제23권2호
• /
• pp.135-142
• /
• 2024

Cu-Cu bonding, one of the key technologies in advanced packaging, enhances semiconductor chip performance, miniaturization, and energy efficiency by facilitating rapid data transfer and low power consumption. However, the quality of the interface bonding can significantly impact overall bond quality, necessitating strategies to quickly detect and classify in-process defects. This study presents a methodology for detecting defects in wafer junction areas from Scanning Acoustic Microscopy images using a ResNet-50 based deep learning model. Additionally, the use of the defect map is proposed to rapidly inspect and categorize defects occurring during the Cu-Cu bonding process, thereby improving yield and productivity in semiconductor manufacturing.

• 한국정보통신학회:학술대회논문집
• /
• 한국해양정보통신학회 2007년도 춘계종합학술대회
• /
• pp.65-68
• /
• 2007

DOCSIS 3.0 MAC프로토콜은 MAP 메시지를 통하여 CM과 CMTS의 채널 전송 시간을 조정하므로 프로토콜 성능에 영향을 미치게 된다. 하지만 MAP의 구성요소와 용도에 대한 정의만 표준안에 언급이 되어 있고, MAP 메시지의 전송주기에 대한 정의는 언급되어 있지 않다. 본 논문에서는 DOCSIS 3.0에서 MAP 전송주기에 따른 프로토콜의 성능을 평가하고, 평가 결과를 바탕으로 최적의 MAP 전송주기를 제안하였다. 평가 결과로 MAP 전송주기는 0.05sec일 때 최적의 프로토콜 성능을 보임을 알 수 있었다. 본 연구의 결과는 DOCSIS 3.0 기반 케이블망의 구축을 위한 중요한 성능 요소로 사용될 수 있다.

• 소성∙가공
• /
• 제18권4호
• /
• pp.342-346
• /
• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 한국정보통신학회:학술대회논문집
• /
• 한국해양정보통신학회 2008년도 추계종합학술대회 B
• /
• pp.77-80
• /
• 2008

본 논문에서는 채널 결합 기법을 고려하여 DOCSIS 3.0 망에서 상향스트림 스케줄러를 설계하고 스케줄링 알고리즘을 제안하였다. 본 논문에서 제안하는 스케줄러는 Bonding Process Module, QoS Service Classifier, Upstream Scheduler, Framing Module 등으로 구성된다. 결합 채널에 대한 대역을 할당하기 위해 균등요구대역 할당알고리즘, 현재 요구대역할당을 고려한 요구대역 할당알고리즘, 이전 MAP의 대역 할당 정보를 고려한 요구대역 할당알고리즘을 제안하였다. 제안한 스케줄러 및 스케줄링 알고리즘의 성능을 비교평가하기 위해 OPNET 기반의 DOCSIS 3.0 시뮬레이션 모델을 개발하고, 시뮬레이션을 수행하였다. 성능평가 결과 CM에서 큐잉 지연과 CMTS에서 데이터 수신량 관점에서 균등요구할당 알고리즘이 우수한 성능을 나타냄을 확인할 수 있었다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2009년도 춘계학술대회 논문집
• /
• pp.641-642
• /
• 2009

• Bulletin of the Korean Chemical Society
• /
• 제25권2호
• /
• pp.198-202
• /
• 2004

Hydrogen bond is an important factor in the structures of carbohydrates. Because of great strength, short range, and strong angular dependence, hydrogen bonding is an important factor stabilizing the structure of carbohydrate. In this study, conformational properties and the hydrogen bonds in GlcNAc( ${\beta}$1,3)Gal(${\beta}$)OMe in DMSO are investigated through NMR spectroscopy and molecular dynamics simulation. Lowest energy structure in the adiabatic energy map was utilized as an initial structure for the molecular dynamics simulations in DMSO. NOEs, temperature coefficients, SIMPLE NMR data, and molecular dynamics simulations proved that there is a strong intramolecular hydrogen bond between O7' and HO3' in GlcNAc( ${\beta}$1,3)Gal(${\beta}$)OMe in DMSO. In aqueous solution, water molecule makes intermolecular hydrogen bonds with the disaccharides and there was no intramolecular hydrogen bonds in water. Since DMSO molecule is too big to be inserted deep into GlcNAc(${\beta}$1,3)Gal(${\beta}$)OMe, DMSO can not make strong intermolecular hydrogen bonding with carbohydrate and increases the ability of O7' in GlcNAc(${\beta}$1,3)Gal(${\beta}$)OMe to participate in intramolecular hydrogen bonding. Molecular dynamics simulation in conjunction with NMR experiments proves to be efficient way to investigate the intramolecular hydrogen bonding existed in carbohydrate.