• Journal of the Korean Society of Industry Convergence
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• v.15 no.2
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• pp.55-58
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• 2012

This study is concerned about the design and structural analysis of high integrated Chip Bonding Machine. Recently, many studies have been undergoing to reduce a working time in a field of Chip Bonding Machine. Chip Bonding Machine belongs to reduce a stand-by time by Chip Moving time. The developed system can save tool moving distance in small space than other machine. The analysis is carried out by SoldEdge & Ansys software.

• Journal of the Korean Society of Industry Convergence
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• v.15 no.1
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• pp.37-42
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• 2012

Trends in semiconductor equipment industry are to reduce the cost of producing semiconductor, semiconductor process development, facility development, and the minimum investment in terms of cost and quality. Semiconductor equipments are being considered to review and development is proceeding at the same time. In the first part of the semiconductor assembly process, in which the importance of die bonding process is emerging, a wide leadframe type die bonding machine is demanded for productivity. Die bonding machine was designed through experiments and by trial and error. It costs a lot of time and financial burden. The purpose of this study is to solve these problems by using the CAE tool 3G. By using finite element method, thermal analysis of die bonding machine to the various widths leadframe die bonder machine rail is performed for design.

• Journal of the Korean Society of Industry Convergence
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• v.17 no.4
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• pp.194-202
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• 2014

Bonding Machine is new concept of semi industry. In this study, bonding machine is designed with aximatic design, then manufactured based on it. Axiomatic design offers a scientific base for design in an efficient way. Many application of the independence axiom have been pulished, however, the information axiom has been mainly applied to FR - DP problems except for few case studies.

• Journal of Sensor Science and Technology
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• v.8 no.1
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• pp.89-94
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• 1999

In this study, a new technology to bond the PZT with connection board, which is a core technology for the fabrication of medical micro high frequency sensors, was developed. Two technologies were adopted. One is bonding of In using thermal heating, he other is bonding of Pb using a high frequency heating machine. In case of thermal eating, bonding was failed because of the contaminations of In surface. But, when using high frequency healing machine, we developed good bonding characteristics at various experimental conditions and thickness of the electrode material.

• The Journal of the Convergence on Culture Technology
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• v.4 no.3
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• pp.209-212
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• 2018

Anisotropic conductive film(ACF) bonding is widely used for making fine interconnections between two different materials where soldering is not easily applicable. There are three constraints for the successful implementation of ACF bonding. A bonding contact should be pressed by a hot head with the right pressure and temperature for a pre-defined curing time. In this paper, a method for ACF bonding based on machine vision system is proposed and verified through some experiments. The system calculates the position and orientation of printed circuit boards(PCBs) on a bonding table and estimates the optimal hitting point where the hot head should be applied. Experimental results show that the proposed system achieves better adhesive strength by providing head flatness over contact surfaces.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 1996.10b
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• pp.34-44
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• 1996

N-machine produces more than input energy at above 3000 rpm. any space energy is absorbed when the N-machine is rotating at a very high velocity. Laws of electromagnetics verify that normal conduction is due to that electrons moves from one three-dimensional crystallizing ${\pi}-bonding$ orbital to next. The ${\pi}-far$ infrared rays are generated from the resonance and rotation of the electrons on the orbitals of three-dimensional crystallizing ${\pi}-bonding$ atoms. Material in universe is composed of ${\pi}-rays$, which have alternative outward electric field. If the alternative outward electric fields of the ${\pi}-rays$ are resonant each other they make attraction force, which is the gravity. The collection of space energy is due to a attraction force between the radially alternating electric field and the ${\pi}-far$ infrared rays in the space. Electrons flow by absorbed density difference of ${\pi}-far$ infrared rays along a conduction wire, which also verifies that normal electron conduction is due to a flow from one three-dimensional crystallizing ${\pi}-bonding$ orbital to next.

• Journal of the Semiconductor & Display Technology
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• v.16 no.1
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• pp.29-33
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• 2017

This paper presents a development of vision aligner with three channels for the wafer and plate bonding machine in manufacturing of LED. The developed vision aligner consists of three cameras and performs wafer alignment of rotation and translation, flipped wafer detection, and UV Tape detection on the target wafer and plate. Normally the process step of wafer bonding is not defined by standards in semiconductor's manufacturing which steps are used depends on the wafer types so, a lot of processing steps has many unexpected problems by the workers and environment of manufacturing such as the above mentioned. For the mass production, the machine operation related to production time and worker's safety so the operation process should be operated at one time with considering of unexpected problem. The developed system solved the 4 kinds of unexpected problems and it will apply on the massproduction environment.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1994.10a
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• pp.571-576
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• 1994

In recent years, ultrasonic has been widely applied in measurement and industrial fields and its application range has been expanded as a result of continuous research and development. Wire Bonding Machine, an instrument fabricating semi-conductor, makes use of ultrasonic bonding method. In order to improve the currently used wire bonding machine using ultrasonic energy, technical accumulation is needed steadily through development of exciting device of ultrasonic composed of piezoelectic vibrator and horn. This study investigates the design conditions affecting the dynamic characteristics through the theoretical and experimental analysis of piezoelectric vibrator and horn, The study conducts separately the system identification of piezoelectric vibrator in time domain and the modal analysis of horn in frequency domain. In theoretical model, the integrated modeling is conducted via a combination of dynamic identification of piezoelectric vibrator and theoretical analysis of horn. Hence comparison is made for theoretical and experimental results of the dynamic characteristics of the ultrasonic transducer composed of piezoelectric vibrator and horn. Form the results of this study we develop the design technique of ultrasonic transducer using dynamic characteristic analysis and propose the possibility of ultrasonic welding considering the optimal condition of the natural frequency and vibration mode of horn.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.6
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• pp.2624-2630
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• 2013

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead flame to provide enough strength for the next process. During the process, inspection processes are very important to detect exact locations of dispensed epoxy dots and to determine bonding status of dies whether they are lies at exact positions with sufficient bonding strength. In this study, a useful machine vision based inspection system is proposed for the LED die bonder. In the proposed system, 2 cameras are used for epoxy dot position detection and 2 cameras are sued for die attaching status determination. New vision processing algorithm is proposed, and its efficiency is verified through required field experiments. Measured position error is less than $X:-29{\mu}m$, $Y:-32{\mu}m$ and rotation error:$3^{\circ}$ using proposed vision algorithm. It is concluded that the proposed machine vision based inspection system can be successfully implemented on the developed die bonding system.

• Journal of Welding and Joining
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• v.30 no.6
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• pp.113-119
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• 2012

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.