• Journal of Welding and Joining
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• 제30권6호
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• pp.106-112
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• 2012

This study was carried out to investigate the effect of bonding temperature and holding time on microstructure and mechanical properties in brazing joints of Ni-base superalloy using MBF-30 (Ni-4.5Si-3.2B [wt.%]). The heating rate was $20^{\circ}C$/min to the bonding temperatures $1050^{\circ}C$, $1070^{\circ}C$, $1090^{\circ}C$ under high vacuum condition. The holding times were 100s, 400s, 900s and 1600s. $Ni_3B$ phases and proeutectic Ni were observed in the interlayer of Ni-201. Then, Ni3B and Ni3Si were found in the middle region of brazing joint. Cr-boride phase appeared in the interlayer of Inconel-625. Tensile strength and elongation were decreased at $1050^{\circ}C$-1600s, $1070^{\circ}C$-900s and $1090^{\circ}C$-400s. After observation the fracture specimens, There was Ni3B which is very brittle phase in the grain boundary of Ni201.

• 연구논문집
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• 통권24호
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• pp.63-79
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• 1994

This article reports a experimental study of the method to achieve a bond joint at lower temperature in a short time. DC magnetron sputtering of Sn, Sn/Pb, Sn/In and Sn/Cu on copper substrate was provided as an interlayer for Cu to Cu bonding under the air environment. Various examination was conducted and investigated on the effect of experimental parameters such as coating materials, coating time(or coating thickness), bonding temperature and bonding time etc. Bonding was performed at the temperature of $210^\circC-320^\circC$ for 0sec and interfacial reaction between the coated layer and copper substrate was examined using optical, scanning electron microscope and x-ray diffractometer. From the obtained results, it was found that intermetallic compounds layer consisted of $\eta-phase(Cu_6Sn_5)$ and $\beta-phase(Cu_3Sn)$ was formed at the joint interface for almost all coating materials. But the dominant phase formed in the preetched Cu substrate coated with Sn was $\beta-phase$. A characteristic morphology looks like a reaction ring, which was believed as the strong interconnecting regions between two substrates, was found to be formed on the reaction surface of copper substrates. The morphologies and compositions of the intermetallics, which depends on the regions of the reaction surface, was appeared as greatly different. Based on above results, the new bonding process to make the joint at lower temperature for short time can be admitted as a feasible process.

• Journal of Welding and Joining
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• 제10권3호
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• pp.63-72
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• 1992

The joining methods of ceramics to metals which can be expected to obtain high temperature strength are mainly classified into the solid-state diffusion bonding method and the active brazing method. Between these two, the solid-state diffusion bonding method is given attentions as substituting method for active brazing method due to being capable of obtaining higher bonding strength at high temperature and accurate bonding. In this paper, the solid-state diffusion bonding of $Al_{2}$O$_{3}$ ceramics to Ni-Cr-Mo alloy steel (SNCM21) using insert metal was carried out. The insert metal employed in this study was experimentally home-made, Ag-Cu-Ti alloy. Influence of several bonding parameters of $Al_{2}$O$_{3}$SNCM21 joint was quantitatively evaluated by bonding strength test, and microstructural analyses at the interlayer were performed by SEM/EDX. From above experiments, the optimum bonding condition of the solid-state diffusion bonding of $Al_{2}$O$_{3}$/SNCM21 using Ag-Cu-Ti insert metal was determined. Futhermore, high temperature strength and thermal-shock properties of $Al_{2}$O$_{3}$/SNCM21 joint were also examined. The results obtained are as follows. 1. The maximum bonding strength was obtained at the temperature of 95% melting point of insert metal. 2. The high temperature strength of $Al_{2}$O$_{3}$/SNCM21 joint appeared to bemaximum value at test temperature 500.deg.C and the bonding strength with increasingtemperature showed parabolic curve. 3. The strength of thermal-shocked specimens was far deteriorated than those of as-bonded specimens. Especially, water-quenched specimen after heated up to 600.deg. C was directly fractured in quenching.

• 한국진공학회지
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• 제8권4A호
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• pp.465-469
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• 1999

In this paper, spacer process for FED (Field Emission Display ) was developed with the glass to glass anodic bonding technology using Al film as an interlayer. Characteristics, current density-time curves and force of the anodic boding were measured on various thickness of Al film; 1000$\AA$, 2000$\AA$, 3000$\AA$, 4000$\AA$ and 500$\AA$. Holders for spacer were fabricated with photosensitive glass and (110) Si wafer by bulk micromachining. Spacers was formed on glass substrate by spacer glass to glass anodic bonding and an evacuated panel was fabricated to prove the potential of application for FED.

• 한국분말재료학회지
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• 제2권1호
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• pp.53-62
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• 1995

TLP(Transient-Liquid-Phase) bonding of Fe-base MA956 ODS alloy was performed. As insert metal a commercially available Ni-base alloy(MBF50) and an MA956 alloy with additive elements of 7wt% Si and 1wt% B were used. To confirm the idea that a concurrent use of MA956 powder with Insert metals can enhance the homogenization of constituent elements and thereby reduce the thickness of joint interface, MA956 powder was also inserted In a form of sheet. SEM observation and EDS analysis revealed that Cr-rich phase was formed in the bonded interface in initial stage of isothermal solidification during the bonding process, irrespective of kind of insert metals. Measurement of hardeness in the region of bonded interface and EDS analysis showed that a complete homogenization of composition could not be obtained especially in case of MBF50. Joints using either BSi insert metals only or BSi insert together with MA956 powder interlayer showed, however, a remarkable improvement in a compositional homogenization, even though a rapid grain growth in the bonded interface could not be hindered.

• Journal of Advanced Marine Engineering and Technology
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• 제17권1호
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• pp.66-72
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• 1993

The brazing of Al to Al using Al-Si alloy filler metal was performed under different bonding conditions such as ratio of lap length to plate thickness, surface roughness and joint clearance of the lap joint. The adopted thickness of the base metal in this experiments were two kinds of 4mm and 7mm which were most commonly used in various field. Influence of several bonding conditions of Al/Al joint was quantitavely evaluated by bonding strength test, and microstructural analysis at the interlayer were performed by optical microscope. From above experiments, the optimum bonding conditions of the brazing bonding of Al/Al using Al-Si alloy filler metal was determined. The major results obtained are as follows. 1) The fracture occurs at brazed joint in the conditions of that the ratio of lap length to plate thickness is less than 2 in case of 7mm plate thickness. 2) The ratio of lap length to plate thickness which the fracture occurs at base metal is decreased with the decreasing of the plate thickness. 3) The joint strength is not affected by the surface roughness and joint clearance of the brazed part. 4) The heat-treatment of the brazed joint contribute to eliminate the boundary between the base metal and filler metal. However, the joint strength is not affected by the heat-treatment.

• 한국전기전자재료학회논문지
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• 제21권4호
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• pp.354-361
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• 2008

The dielectric characteristics of low-k interlayer dielectric materials was fabricated by plasma enhanced chemical vapor deposition (PECVD). BTMSM precursor was evaporated and introduced with the flow rates from 16 sccm to 25 sccm by 1sccm step in the constant flow rate of 60 sccm $O_2$ in process chamber. Manufactured samples are analyzed components by measuring FT/IR absorption lines. Decomposition each Microscopic structures through two-dimensional correlation analysis about mechanisms for the formation of SiOCH in $SiOCH_3$, Si-O-Si and Si-$CH_3$ bonding group and analyzed correlation between the micro-structure of each group. It is a tendency that seems to be growing of Si-O-Ci(C) bonding group and narrowing of Si-O-$CH_3$ bonding group relative to the increasing flow-rate BTMSM. The order of changing sensitivity about changes of flow-rate in Si-O-Si(C) bonding group is cross link mode$(1050cm^{-1})$ $\rightarrow$ open link mode$(1100cm^{-1})\rightarrow$ cage link mode $(1140cm^{-1})$.

• 한국재료학회지
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• 제16권1호
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• pp.30-36
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• 2006

A novel method was proposed to grow an epitaxial $CoSi_2$ on (100)Si substrate. A $CoN_x$ interlayer was deposited by reactive sputtering of Co in an Ar+$N_2$ flow. From the Ti/Co/$CoN_x$/Si structure, a uniform and thin $CoSi_2$ layer was epitaxially grown on (100)Si by annealing above $700^{\circ}C$. Two amorphous layers were found at the $CoN_x$/Si interface, where the top layer has a silicon nitride (Si-N) bonding state with some Co content and the bottom layer has a Co-Si intermixing state. The SiNx amorphous layer seems to play a critical role of suppressing the diffusion of Co into Si substrate for the direct formation of epitaxial $CoSi_2$.

• Macromolecular Research
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• 제9권1호
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• pp.20-29
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• 2001

Interfacial adhesion and nondestructive behavior of electrodeposited (ED) carbon fiber rein-forced composites were evaluated using electro-micromechanical techniques and acoustic emission (AE). The interfacial shear strength (IFSS) of the ED carbon fiber/epoxy composites was higher than that of the untreated fiber. This might be expected because of the possibility of chemical or hydrogen bonding in an electrically adsorbed polymeric interlayer. The logarithmic electrical resistivity of the untreated single-carbon fiber composite increased suddenly to infinity when fiber fracture occurred, whereas that of the ED composite increased relatively gradually to infinity. This behavior may arise from the retarded fracture time due to enhanced IFSS. In single- and ten-carbon fiber composites, the number of AE signals coming from interlayer failure of the ED carbon fiber composite was much larger than that of the untreated composite. As the number of the each first fiber fractures increased in the ten-carbon fiber composite, the electrical resistivity increased stepwise, and the slope of the logarithmic electrical resistance increased.

• Structural Engineering and Mechanics
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• 제6권5호
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• pp.485-496
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• 1998

Standard finite element wave propagation codes are useful for determining stresses caused by the impact of one body with another; however, their applicability to a laminated system such as architectural laminated glass is limited because the important interlayer delamination process caused by impact loading is difficult to model. This paper presents a method that allows traditional wave propagation codes to model the interlayer debonding of laminated architectural glass subject to low velocity, small missile impact such as that which occurs in severe windstorms. The method can be extended to any multilayered medium with adhesive bonding between the layers. Computational results of concern to architectural glazing designers are presented.