• Proceedings of the KWS Conference
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• 2009.11a
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• pp.217-220
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• 2009

Conductive adhesives have been investigated for use in microelectronics packaging as a lead-free solder substitute due to their advantages, such as low bonding temperature. However, high resistivity and poor mechanical behavior may be the limiting factors for the development of conductive adhesives. The metal fillers and the polymer resins provide electrical and mechanical interconnections between surface mount device components and a substrate. As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders and silver has poor electro-migration performance. So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, electrically conductive adhesives (ECAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. Especially the effect of silver coating on the electrical resistance just after curing and after aging was investigated. As a result, it was found that the electrical resistance of ECA with silver-coated copper filler was clearly lower and more stable than that of ECA with pure copper filler after curing process. And, during high temperature storage test, the degradation rate of electrical resistance for ECA with silver coated copper filler was quite slower than that for ECA with pure copper filler.

• Restorative Dentistry and Endodontics
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• v.36 no.5
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• pp.385-396
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• 2011

Objectives: This study evaluated the effects of adhesion variables such as the priming concepts of canal wall and the curing modes of adhesives on the sealing ability of a resin-based root canal filling system. Materials and Methods: Apical microleakage of the Resilon-RealSeal systems filled with 3 different combinations of adhesion variables was compared with the conventional gutta-percha filling using a dye penetration method. Experimental groups were SEDC, Resilon (Resilon Research LLC) filling with self-etch RealSeal (SybronEndo) primer and dual-cure RealSeal sealer; NELC, Resilon filling with no etching, Scotchbond Multi-Purpose (3M ESPE) primer application and light-curing adhesive; and TELC, Resilon filling with Scotchbond Multi-Purpose primer and adhesive used under total etch / wet bonding and lightcure protocols. GPCS, gutta-percha filling with conventional AH26 plus sealer, was the control group. Results: The median longitudinal dye penetration length of TELC was significantly shorter than those of GPCS and SEDC (Kruskal-Wallis test, p < 0.05). In the cross-sectional microleakage scores, TELC showed significant differences from other groups at 2 to 5 mm from the apical foramen (Kruskal-Wallis test, p < 0.05). Conclusions: When a resin-based root canal filling material was used, compared to the self-etching primer and the dual-cure sealer, the total etch/wet-bonding with primer and light-curing of adhesive showed improved apical sealing and was highly recommended.

• Composites Research
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• v.24 no.3
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• pp.39-45
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• 2011

Adhesive joints are widely used for structural joining applications in various fields and environmental conditions. Polyurethane (PU) and Epoxy adhesives are now being used for liquefied natural gas (LNG) carriers at cryogenic temperatures. This paper presents a comprehensive evaluation of epoxy and PU adhesive bonds between Triplex sheets at normal and cryogenic temperatures. The most significant result of this study is that for all adhesives tested, there is a significant decrease in peel strength at cryogenic temperatures. However, the reasons for the decrease in peel strength for epoxy and PU adhesives differ. Consequently, PU adhesives can be considered better suited for use in applications requiring high bonding performance at cryogenic conditions, such as in LNG carriers.

• Restorative Dentistry and Endodontics
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• v.43 no.2
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• pp.20.1-20.9
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• 2018

Objectives: The aim of this in vitro study was to evaluate the bond strength of 2 universal adhesives used in different application modes to bleached enamel. Materials and Methods: Extracted 160 sound human incisors were used for the study. Teeth were divided into 4 treatment groups: No treatment, 35% hydrogen peroxide, 16% carbamid peroxide, 7.5% carbamid peroxide. After bleaching treatments, groups were divided into subgroups according to the adhesive systems used and application modes (n = 10): 1) Single Bond Universal, etch and rinse mode; 2) Single Bond Universal, self-etch mode; 3) Gluma Universal, etch and rinse mode; 4) Gluma Universal, self-etch mode. After adhesive procedures nanohybrid composite resin cylinders were bonded to the enamel surfaces. All specimens were subjected to shear bond strength (SBS) test after thermocycling. Data were analyzed using a 3-way analysis of variance (ANOVA) and Tukey post hoc test. Results: No significant difference were found among bleaching groups (35% hydrogen peroxide, 16% carbamid peroxide, 7.5% carbamid peroxide, and no treatment groups) in the mean SBS values. There was also no difference in SBS values between Single Bond Universal and Gluma Universal at same application modes, whereas self-etch mode showed significantly lower SBS values than etch and rinse mode (p < 0.05). Conclusions: The bonding performance of the universal adhesives was enhanced with the etch and rinse mode application to bleached enamel and non-bleached enamel.

• Journal of the Korean Wood Science and Technology
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• v.27 no.1
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• pp.72-78
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• 1999

To accelerate the curing and to improve the bonding properties of urea-melamine-formaldehyde (UMF) resin adhesives for plywood, the effects of resin compositions and additives on gelation time and bonding strength were discussed. The gelation time of UMF resin prepared by simultaneous reaction with urea(U), melamine(M) and formaldehyde(F) at M/U molar ratio 0.2 was shortened as the molar ratio of formaldehyde to urea was increased. However, at F/U molar ratios higher than 2.5, the amounts of free fomaldehyde of resin could not satisfy with KS standard, Therefore, it was difficult to increase the amount of formaldehyde in resin composition for the purpose of fast gelation time. With increasing the molar ratio of melamine to urea(M/U) from 0.3 to 0.6 at constant F/U molar ratio 3.4, the gelation time of UMF resin was slightly decreased, while gradually increased at M/U molar ratio higher than 0.6. The gelation properties of UMF resin and bonding strength of UMF-bonded plywood could be enhanced by using ammonium chloride and p-toluene sulfonic acid as a curing-agent together with wheat flour and corngluten powder as a extender.

• The Journal of Korean Academy of Prosthodontics
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• v.44 no.4
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• pp.383-393
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• 2006

Statement of problem : Limited research on flowable resin has been undertaken on its application directly on dentin associated with the adhesive systems. Purpose : This study was to evaluate the shear bond strengh and fracture aspect of flowable resin on human dentin with various types of dentin bonding adhesives with thermo cycling effect. Materials and methods: Filtek-Flow(3M ESPE, USA) was used as flowable resin and Eighty human molars were randomly divided into 4 groups : three dentin bonding adhesives (Scotchbond-Multipurpose : 3-step contentional system, One-Step : One-bottle system. Prompt L-Pop : All-in-one, self-etching primer) and 32% etching treatment without bonding adhesive as a control group. For evaluating their durability of bonding, each group was subdivided : storaging in the water at 37$^{\circ}C$(24 hours) and thermocycling (0$^{\circ}C$-55$^{\circ}C$, 30 seconds intervals, 1000 cycle). Shear bond strength tests were performed and resin-dentin interface and fracture mode were observed. Results were analysed by one-way ANOVA and Scheffe's multiple range test. Results and Conclusion : 1. At 0 cycle, the mean shear bond strength of One-Step exhibited the highest value of all groups(p<0.05), and there were no significant differences between Prompt L-Pop and Scotchbond-Multipurpose, Scotchbond-Multipurpose and control(p>0.05). After 1000 thermocycling, One-Step exhibited higher value than other groups(p<0.05), and there were no significant differences among other groups (p>0.05). 2. The shear bond strength of each group was significantly decreased after thermocycling except Scotchbond-Multipurpose (p>0.05). 3. The most common failure mode was adhesive type and mixed type, next in order.

• The korean journal of orthodontics
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• v.20 no.3 s.32
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• pp.583-591
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• 1990

If the bond strength is sufficient to resist orthodontic force, orthodontic brackets can be bonded to restorations. Orthodontic brackets were bonded to composite resin and glass ionomer cement restorations with no-mix adhesive or glass ionomer cement. The shear bond strength of adhesives bonded to restorations was studied in vitro. Orthodontic brackets were bonded to 10 extracted natural teeth, 40 composite resin restorations and 40 glass ionomer restorations. The surfaces of composite resin restorations were roughened or applied with bonding agent (Scothbond) after surface roughening. The surfaces of glass ionomer cement restorations were conditioned with acid etching or applied with Scotchbond to etched surface. The adhesive was no-mix resin or glass ionomer cement. The shear bond strength was measured. The results were as follows: 1. Orthodontic brackets could be bonded to composite resin restorations effectively as they could be bonded to acid etched enamel with no-mix adhesive. The shear bond strength was sufficient to resist orthodontic force and was not affected by bonding agent greatly. 2. The shear bond strength of no-mix adhesive bonded to acid etched glass ionomer cement restorations was sufficient to resist orthodontic force. However. the fracture risk of glass ionomer cement restorations was increased during debonding. The bonding agent couldn't increase the shear bond strength greatly. 3. The shear bond strength of glass ionomer cement bonded to glass ionomer cement restorations was lower than that of no-mix adhesive. The shear bond strength was sufficient to resist orthodontic force and was greatly decreased by bonding agent. 4. The shear bond strength of glass ionomer cement bonded to composite resin restorations was too low to resist orthodontic force.

• Journal of the Korean Wood Science and Technology
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• v.52 no.1
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• pp.58-69
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• 2024

To evaluate the adhesive characteristics of mixed cross-laminated timber (CLT) using domestic softwoods structural lumber proposed by KS F 3020 and yellow poplar, penetration depth of adhesive and thickness of bonding line were analyzed based on the results of boiling water soaking delamination. 3 Types of adhesives and 2 types of major layer were divided into a 5 ply CLT using yellow popular as minor layer. The bonding performance of the mixed CLT as structural members was evaluated based on the KS F 2081. The thickness of bonding line between layers of the mixed CLT was measured with a scanning electron microscope, and the adhesive penetration depth in the layer members was measured with an optical microscope. As a result of boiling water soaking delamination test of mixed CLT, the CLT specimens using PRF and PUR adhesives met the requirements of KS F 2081. It was verified that the penetration path of the adhesive in the layes was mainly through the tracheid cell in the case of Japanese larch and Korean red pine layers, and through the vessel and radial tissue in yellow popular layers. The penetration depth of the adhesive was the highest for the PRF adhesive under the same pressing time conditions, and the thickness of the bonding line was in inverse proportion to the penetration depth in the case of the PUR adhesive.

• Restorative Dentistry and Endodontics
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• v.35 no.5
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• pp.321-334
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• 2010

Objectives: The purpose of this study is to evaluate bonding efficacy by means of measuring the effect of remained solvent on Degree of conversion(DC) and ${\mu}TBS$ and FE-SEM examination. Materials and Methods: Two 2-step total etching adhesives and two single-step self etching adhesives were used in this study. First, volume weight loss of 4 dentin adhesives were measured using weighting machine in process of time in normal conditions and calculate degree of evaporation (DE). Reaction/reference intensity ratio were measured using micro-Raman spectroscopy and calculate DC according to DE. Then 2 experimental groups were prepared according to air-drying methods (under, over) and control group was prepared to manufacturer's instruction. Total 12 groups were evaluated by means of micro tensile bond strength and FE-SEM examination. Results: Degree of evaporation (DE) was increased as time elapsed but different features were observed according to the kind of solvents. Acetone based adhesive showed higher DE than ethanol and butanol based adhesive. Degree of conversion (DC) was increased according to DE except for $S^3$ bond. In ${\mu}TBS$ evaluation, bond strength was increased by additional air-drying. Large gaps and droplets were observed in acetone based adhesives by FE-SEM pictures. Conclusions: Additional air-drying is recommended for single-step self etching adhesive but careful consideration is required for 2-step total etching adhesive because of oxygen inhibition layer. Evaporation method is carefully chose and applied according to the solvent type.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.29 no.1
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• pp.73-83
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• 1997

Most of the materials used in various industrial fields and also in our daily life are multi-component materials or composite materials, and it is well known that there are many cases where adhesion between the constituents within the bonded systems plays an important role. There are various types of performance evaluation tests for the bonded materials, among which tests for evaluating the bond performance under various conditions may be regarded as the most interesting ones for those engaged in work related to adhesion. I have studied on the mechanism of adhesion form the rheological standpoint with my colleagues, including some students from Korea, and I am very happy to be able to have a talk on some of our research works. In Japan, the so-called "adhesives" are usually classified into two categories;adhesives and pressure sensitive adhesives (PSA). Adhesives are the materials which solidify after bonding and are after used as the structural adhesives because the adhesive strength is comparatively strong. On the other hand, the pressure sensitive adhesives never solidify and are used as PSA tapes, labels or decals. About the adhesives, we have examined the dependence of adhesive strength(shear, tensile, peel) upon both temperature and rate of deformation, and found out some empirical rules which are applicable to most of the adhesive systems. We have also developed a simplified theory of adhesion, which is deseribed in terms of mechanical equivalent mode1 and a few failure criteria. Although some of the common rules can be accounted for according to this theory, it must be pointed out that a fracture mechanical approach ms inevitable especially in the region where the meehanical relaxation time of the adhesive is extremely large [W. W. Lim and H. Mizumachi]. About the pressure sensitive adhesives, we have studied on the PSA performance (peel, tack, holding power) as a function of both the viscoelastic properties and surface chemical properties of the materials, and found out some rules, and again we have developed a theory which deseribes the mechanism. And in addition, we have studied on the miscibility between linear polymers and oligomers, because PSA is generally manufactured by blending gums and tackifier resins. Many phase diagrams have been found and some of them have been analyzed on thermodynamic basis, and it became evident that the miscibility is a very important factor in PSA [H. J. Kin and H. Mizumachi]. In this presentation, I want to emphasize the fact that the adhesion performance is closely related to the structure/property of the adhesives.adhesives.