• Journal of Technologic Dentistry
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• v.27 no.1
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• pp.73-78
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• 2005

The surface-reacted layer of titanium castings greatly affects their mechanical properties. This study analyzed the interfacial zone of Ti-20%Zr-5%Cr alloy castings obtained from phosphate bonded investment and examined the relationship between the surface-reacted layer and hardness. The Vickers hardness of cast disks were tested at 20$\mu m$ intervals from the surface to 120$\mu m$ in depth. The cross-section was observed metallurgically, and line profile of the reacted layer was conducted under the EDX. The surface-reacted layer of Ti-20%Zr-5%Cr alloy is showed a similar tendency to Ti-6%Al-4%V alloy in thickness, and also Si diffusion in multiple reacted layer of Ti-20%Zr-5%Cr alloy is less than cp Ti and similar to Ti-6%Al-4%V alloy. The Vickers hardness in the surface layer was greater than in the inner part, and the Vickers hardness of Ti-20%Zr-5%Cr alloy ranged 650 to 390 and cp Ti ranged 810 to 160, Ti-6%Al-4%V alloy ranged 710 to 530 respectively.

• Proceedings of the Korea Concrete Institute Conference
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• 1997.04a
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• pp.635-642
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• 1997

This research focused on the development of concrete overlay and test, which was conducted at 88 Highway 105k, 2 lanes of 290 m. The field application test consists of 6 cm and 10 cm bonded concrete overlay and 25 cm unbonded concrete overlay, using the slag cement for opening lanes for traffic early. The overlay were placed in a day. The whole period of traffic closing wes 8 day and it was reopened to traffic after concrete overlay has cured for 3 day. 5 cracks were founded when the field test section was investigated after 1 month, but all these may not make significant problems to overlay because these initiated and growed at the same line of repair section. The rideability and skid resistance become much better like in the new pavement after overlay. The structural capacity against deflection was much. which were verified by FWD(Falling Weight Deflectometer). The field test section is being used in a good condition and the results of field application and pavement performance analysis are encouraging. This rehabilitation methods may be adopted in Korea after a more field performance verifications.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.12
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• pp.1221-1227
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• 2015

Diffusion bonding is the key manufacturing process for the micro-channel type heat exchangers. In this study, austenitic alloys such as Alloy 800HT, Alloy 690, and Alloy 600, were diffusion bonded at various temperatures and the tensile properties were measured up to $650^{\circ}C$. Tensile ductility of diffusion bonded Alloy 800HT was significantly lower than that of base metal at all test temperatures. While, for Alloy 690 and Alloy 600, tensile ductility of diffusion bonded specimens was comparable to that of base metals up to $500^{\circ}C$, above which the ductility became lower. The poor ductility of diffusion bonded specimen could have caused by the incomplete grain boundary migration and precipitates along the bond-line. Application of post-bond heat treatment (PBHT) improved the ductility close to that of base metals up to $550^{\circ}C$. Changes in tensile properties were discussed in view of the microstructure in the diffusion-bonded area.

• Journal of the Korean Society for Nondestructive Testing
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• v.29 no.6
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• pp.525-533
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• 2009

Emphasis in the paper is placed on describing guided wave successes and challenges for applications in aircraft and composite materials inspection. Guided wave imaging methods discussed includes line of sight, tomography, guided wave C-scan, phased array, and ultrasonic vibration methods. Applications outlined encircles lap splice, bonded repair patch, fuselage corrosion, water loaded structures, delamination, and ice detection and de-icing of various structures.

• Journal of Advanced Marine Engineering and Technology
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• v.30 no.2
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• pp.304-310
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• 2006

A typical honeycomb sandwich panel consists of two thin, high-strength facings bonded to a thick, light-weight core. Each component by itself is relatively weak and flexible, but when it combined in a sandwich panel they produce a structure that is stiff, strong, and lightweight. To prove the suitability the honeycomb sandwich structure with prepreg, the mechanical properties of the skin materials and honeycomb sandwich structure were evaluated with the static strength tests. Accordingly, the honeycomb sandwich structure made by autoclave process is available for a panel on LCD/PDP assembly line.

• Asian Journal of Atmospheric Environment
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• v.11 no.4
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• pp.283-299
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• 2017

An analytical method using high-performance liquid chromatography (HPLC) with fluorescence (FL) detection was developed for simultaneously analyzing 10 polycyclic aromatic hydrocarbons (PAHs) and 18 nitro-derivatives of PAHs (NPAHs). The two-dimensional HPLC system consists of an on-line clean-up and reduction for NPAHs in the 1st dimension, and separation of the PAHs and the reduced NPAHs and their FL detection in the 2nd dimension after column-switching. To identify an ideal clean-up column for removing sample matrix that may interfere with detection of the analytes, the characteristics of 8 reversed-phase columns were evaluated. The nitrophenylethyl (NPE)-bonded silica column was selected because of its shorter elution band and larger retention factors of the analytes due to strong dipole-dipole interactions. The amino-substituted PAHs (reduced NPAHs), PAHs and deuterated internal standards were separated on polymeric octadecyl-bonded silica (ODS) columns and by dual-channel detection within 120 min including clean-up and reduction steps. The limits of detection were 0.1-9.2 pg per injection for PAHs and 0.1-140 pg per injection for NPAHs. For validation, the method was applied to analyze crude extracts of fine particulate matter ($PM_{2.5}$) samples and achieved good analytical precision and accuracy. Moreover, the standard reference material (SRM1649b, urban dust) was analyzed by this method and the observed concentrations of PAHs and NPAHs were similar to those in previous reports. Thus, the method developed here-in has the potential to become a standard HPLC-based method, especially for NPAHs.

• Journal of Adhesion and Interface
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• v.5 no.2
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• pp.22-36
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• 2004

Several in-situ testing methods of adhesively bonded joints under static short-time tensile loading are critically analyzed in terms of experimental procedure and data evaluation. Due to its rather homogeneous stress state across the glue line, the tensile-shear test with thick single-lap specimens, according to ISO 11003-2, has become the most important test process for the determination of realistic materials parameters. This basic method, which was improved in both, the experimental part by stepped adherends and easily attachable extensometers and the evaluation procedure by numeric substrate deformation correction and test simulation based on the finite element method (FEM), is therefore demonstrated by application to several kinds of adhesives and metallic adherends. Multi-axial load decreases the strength of a joint. This effect, which is illustrated by an experimental comparison, impedes the derivation of realistic mechanical characteristics from measured force-displacement curves. It is shown by numeric modeling that tensile-shear tests with thin plate substrates according to ISO 4587, which are widely used for quick industrial quality assurance, reveal an inhomogeneous stress state, especially because of relatively large adherend deformation. Complete experimental determination of the elastic properties of bonded joints requires independent measurement of at least two characteristics. As the thick-adherend tensile-shear test directly yields the shear modulus, the tensile butt-joint test according to ISO 6922 represents the most obvious complement of the test programme. Thus, validity of analytical correction formulae proposed in literature for the derivation of realistic materials characteristics is verified by numeric simulation. Moreover, the influence of the substrate deformation is examined and a FEM correction method introduced.

• Korean Journal of Optics and Photonics
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• v.19 no.1
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• pp.15-19
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• 2008

A fiber-optic interferometric voltage sensor with high sensitivity is investigated. The fiber-optic voltage sensor is composed of an In-Line Michaelson interferometer bonded on a PZT. The In-Line Michaelson interferometer is a hollow optical fiber spliced to a single-mode fiber at one end and cleaved at the other end. The phase shift of the sensor output signal was induced by the applied AC voltage. The relation between the amplitude of the applied voltage and the phase shift of the sensor output signal was approximately linear and the sensitivity was $0.065{\pi}$ radian/V.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.129-133
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• 2001

In this paper, hermetic sealing was studied fur wafer level packaging of the MEMS devices. With the flip-chip bonding method, this B-stage epoxy sealing will be profit to MEMS device sealing and further more RF-MEMS device sealing. B-stage epoxy can be cured 2-step and hermetic sealing can be obtained. After defining $500{\mu}{\textrm}{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was then aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line were maintained during the sealing process. The height of the seal-line was controlled within $\pm0.6${\mu}{\textrm}{m}$ and the strength was measured to about 20MPa by pull test. The leak rate of the epoxy was about $10^7$ cc/sec from the leak test.