• The korean journal of orthodontics
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• v.41 no.1
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• pp.51-58
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• 2011

Objective: To evaluate the shear bond strength (SBS), fracture mode, wire pull out (WPO) resistance and microleakage between low-shrinking and conventional composites used as a lingual retainer adhesive. Methods: A total of 120 human mandibular incisor teeth, extracted for periodontal reasons, were collected. Sixty of them were separated into two groups. To determine the SBS, either Transbond-LR (3M-Unitek) or Silorane (3M-Espe) was applied to the lingual surface of the teeth by packing the material into standard cylindrical plastic matrices (Ultradent) to simulate the lingual retainer bonding area. To test WPO resistance, 20 samples were prepared for each composite where the wire was embedded in the composite materialand cured. Then tensile stress was applied until failure of the composite occurred. The remaining 60 teeth were divided into two groups and multi-stranded 0.0215-inch diameter wire was bonded with the same composites. Microleakage was evaluated by the dye penetration method. Statistical analyses were performed by Wilcoxon, Pearson chi-square, and Mann-Whitney-U tests at p < 0.05 level. Results: The SBS and WPO results were not statistically significant between the two groups. Significant differences were found between the groups in terms of fracture mode (p < 0.001). Greater percentages of the fractures showed mix type failure (85%) for Silorane and adhesive (60%) for Transbond-LR. Microleakage values were lower in low-shrinking composite than the control and this difference was found to be statistically significant (p < 0.001). Conclusions: Low-shrinking composite produced sufficient SBS, WPO and microleakage values on the etched enamel surfaces, when used as a lingual retainer composite.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.182-188
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• 2004

We demonstrate a $2.1\;{\times}\;1.0\;{\times}\;0.1cm^3$ sized compact transmitter using LTCC System-in-Package (SiP) technology for 60GHz-band wireless communication applications. For low-attenuation characteristics and resonance suppression of the SiP, we have proposed and demonstrated a coplanar double wire-bond transition and novel CPW-to-stripline transition integrating air-cavities as well as novel air-cavities embedded CPW line. The fabricated transmitter achieves an output of 13dBm at a RF frequency of 62GHz, an IF frequency of 2.4GHz, and a LO frequency of 59.6GHz. The up-conversion gain is 11dB, while the LO signal is suppressed with the image rejection mixer below -21.4dBc, and the image and spurious signals are also suppressed below -31dBc.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2005.11a
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• pp.111-114
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• 2005

The isolation performance of the S-band single-pole single-throw (SPST) monolithic microwave integrated circuit (MMIC) switch with two different RF-interconnection approaches, microstrip and grounded coplanar waveguide (GCPW) lines, are investigated. On-to-off isolation is improved by 5.8 dB with the GCPW design compared with the microstrip design and additional improvement of 6.9dB is obtained with the coplanar wire-bond interconnection (CWBI) at 3.4 GHz. The measured insertion loss and third-order inter-modulation distortion (IMD3) are less than 2.43 dB over 2.5 CHz $\sim$ 4 GHz and greater than 64 dBc.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.4
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• pp.487-490
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• 2014

This paper describes a design of an automotive radar frontend module with taking care of the routing of 77-GHz signals on a printed circuit board including wire-bond and waveguide transitions.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.439-442
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• 2006

We evaluated a-Si:H TFTs fabricated on polyimide substrate (PI) at the highest temperature of $160^{\circ}C$ with uniaxial and tensile strain to imitate flexible display. With tensile strain, the threshold voltage of a-Si:H TFTs have positive shift due to extra dangling bond formation in a-Si:H layer. However, no significant degradation of the subthreshold swing and effective mobility with tensile strain of a-Si:H TFTs indicates the similar level of band tail state. The metal wire with the width of $10\;{\mu}m$ for connection on flexible substrate can sustain with curvature radius 2.5 cm.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.7
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• pp.1302-1308
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• 2002

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) package are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed for several bending loads and temperatures. At the temperature higher than $100^{\circ}C$, the inelastic deformation in solder balls become more dominant, so that the bending of the molding compound decreases while temperature increases. The deformation caused by thermally induced bending is compared with that caused by mechanical bending. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.28-32
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• 2003

Thermo-mechanical behavior of a ceramic ball grid array(CBGA) package assembly and wire bond ball grid array(WB-PBGA) package assemblies are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed at various temperatures in a temperature cycle. Thermal-history dependent analyses of global and local deformations are presented, and bending deformation(warpage) of the package and shear strain in the rightmost solder ball are discussed. A significant non-linear global behavior is documented due to stress relaxation at high temperature. The locations of the critical solder ball in WB-PBGA package assemblies are documented.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.10a
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• pp.21-24
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• 2000

Traction motors driven by several type inverters have been subjected to increasing demands for higher operating temperature, more demands for duty cycles, higher starting current, frequent voltage transients and finally severe environmental exposure. For applications to inverter duty, traction motors needs a special insulation system, which has characteristics of increased bond strength, lower operating temperature and higher turn-to-tum insulation. Also it needs major contributors to insulation life and reliability of motors, which more considered by temperature, voltage, frequency, rise time, pulse configuration, wire thickness and insulation materials. In this paper, to evaluate of reliability and expected life, it is analyzed the several stresses and their degradation mechanism on insulation system of AC traction motor.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.714-719
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• 1996

For the fabrication of the circuits, contact or terminal areas are usually coated with nickel and gold. Usually, diluted palladium solution is applied to initiate electroless nickel plating on the copper circuits. However, the trace amounts of palladium remains on the resin and it causes the extraneous deposition. We confirmed that selectivity was greatly improved by the treatment with the strong reducing agents such as SBH or DMAB. Bondability was greatly influenced by the contents of phosphorus in the deposited nickel. Stabilizers in the electroless gold plating were also influenced the bonding strength. The baths containing cupferron or potassium nickel cyanide as a stabilizer showed superior bondability. The gold deposits having strong orientation with Au(220) and Au(311) showed good bond ability.

• Proceedings of the KSR Conference
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• 2009.05a
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• pp.433-441
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• 2009

We have studied a weird phenomenon on the High Voltage Impulse Track Circuit (HVITC). The biggest problem is that can not recognize the fault states, despite the fact the rail is broken. This study has shown that current HVITC systems can be operated even an ill-contact state of impedance bond lead wire. This study was carried out using various methods, such as measurements using an oscilloscope with voltage and current probes, simulations using PSCAD/EMTDC software tool, and analysis of measured data. Especially, we have simulated the fault state through bypass circuits using PSCAD/EMTDC software tool. We made a model of track circuit and simulated various types of fault states.