• 제목/요약/키워드: Bond wire

검색결과 75건 처리시간 0.026초

A study on the compatibility between one-bottle dentin adhesives and composite resins using micro-shear bond strength

  • Song, Minju;Shin, Yooseok;Park, Jeong-Won;Roh, Byoung-Duck
    • Restorative Dentistry and Endodontics
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    • 제40권1호
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    • pp.30-36
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    • 2015
  • Objectives: This study was performed to determine whether the combined use of one-bottle self-etch adhesives and composite resins from same manufacturers have better bond strengths than combinations of adhesive and resins from different manufacturers. Materials and Methods: 25 experimental micro-shear bond test groups were made from combinations of five dentin adhesives and five composite resins with extracted human molars stored in saline for 24 hr. Testing was performed using the wire-loop method and a universal testing machine. Bond strength data was statistically analyzed using two way analysis of variance (ANOVA) and Tukey's post hoc test. Results: Two way ANOVA revealed significant differences for the factors of dentin adhesives and composite resins, and significant interaction effect (p < 0.001). All combinations with Xeno V (Dentsply De Trey) and Clearfil $S^3$ Bond (Kuraray Dental) adhesives showed no significant differences in micro-shear bond strength, but other adhesives showed significant differences depending on the composite resin (p < 0.05). Contrary to the other adhesives, Xeno V and BondForce (Tokuyama Dental) had higher bond strengths with the same manufacturer's composite resin than other manufacturer's composite resin. Conclusions: Not all combinations of adhesive and composite resin by same manufacturers failed to show significantly higher bond strengths than mixed manufacturer combinations.

열적 피로에 의한 전원코드의 발화 특성과 전기화재 분석에 관한 연구 (A Study on the Electrical-Fire Analysis and Firing Characteristics of Power Cord by Thermal Stress)

  • 최충석;송길목;김향곤;김동욱;김동우
    • 한국화재소방학회:학술대회논문집
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    • 한국화재소방학회 2003년도 춘계학술논문발표회논문집
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    • pp.164-170
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    • 2003
  • In this paper, we studied on the firing characteristics and electrical fire analysis of power cord deteriorated by thermal stress. The cross section of PVC insulating cord deteriorated by indirect flame decreased through heat convection. PVC insulating cord deteriorated by direct flame was bumpy shape. The exothermic peak of normal cord was shown at ($526.7^{\circ}C$), but the peaks or on(heat treatment temperature) ($150^{\circ}C$) cord was shown at ($299.6^{\circ}C$) and [$502.2^{\circ}C$]. The exothermic peaks according to high temperature were similar to those of amorphous carbon. In the FT-IR analysis, the absorption peak of normal cord indicated double bond of oxygen and carbon in benzene ring at 1720.0$cm^{1}$. As the HTT was high, the height of characteristic peak decreased and the peak of carbonyl group was shown at about 1625.7$cm^{-1}$. The characteristic peak of single bond(O-H) was shown at about 3479.2$cm^{-1}$. In case of the internal part of wire covering deteriorated by over current, the characteristic peak were shown at about 3417.3$cm^{-1}$ and 1600.2$cm^{-1}$. The above results show that we can distinguish the differences according to the fire pattern through the internalㆍexternal analysis of wire covering deteriorated by heat.

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Comparison of three different orthodontic wires for bonded lingual retainer fabrication

  • Baysal, Asli;Uysal, Tancan;Gul, Nisa;Alan, Melike Busra;Ramoglu, Sabri Ilhan
    • 대한치과교정학회지
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    • 제42권1호
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    • pp.39-46
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    • 2012
  • Objective: We evaluated the detachment force, amount of deformation, fracture mode, and pull-out force of 3 different wires used for bonded lingual retainer fabrication. Methods: We tested 0.0215-inch five-stranded wire (PentaOne, Masel; group I), $0.016{\times}0.022$-inch dead-soft eight-braided wire (Bond-A-Braid, Reliance; group II), and 0.0195-inch dead-soft coaxial wire (Respond, Ormco; group III). To test detachment force, deformation, and fracture mode, we embedded 94 lower incisor teeth in acrylic blocks in pairs. Retainer wires were bonded to the teeth and vertically directed force was applied to the wire. To test pull-out force, wires were embedded in composite that was placed in a hole at the center of an acrylic block. Tensile force was applied along the long axis of the wire. Results: Detachment force and mode of fracture were not different between groups. Deformation was significantly higher in groups II and III than in group I (p < 0.001). Mean pull-out force was significantly higher for group I compared to groups II and III (p < 0.001). Conclusions: Detachment force and fracture mode were similar for all wires, but greater deformations were seen in dead-soft wires. Wire pull-out force was significantly higher for five-stranded coaxial wire than for the other wires tested. Five-stranded coaxial wires are suggested for use in bonded lingual retainers.

부착 유지장치의 직, 간접 부착법에 따른 전단 접착력 비교 (Direct and indirect bonding of wire retainers to bovine enamel using three resin systems: shear bond strength comparisons)

  • 권태엽;;;박효상
    • 대한치과교정학회지
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    • 제41권6호
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    • pp.447-453
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    • 2011
  • Objective: We compared the shear bond strength (SBS) of lingual retainers bonded to bovine enamel with three different resins using direct and indirect methods. Methods: Both ends of pre-fabricated twisted ligature wires were bonded to bovine enamel surfaces using Light-Core, Tetric N-Flow, or Transbond XT. Phosphoric acid-etched enamel surfaces were primed with One-Step prior to bonding with Light-Core or Tetric N-Flow. Transbond XT primer was used prior to bonding with Transbond XT. After 24 hours in water at $37^{\circ}C$, we performed SBS tests on the samples. We also assigned adhesive remnant index (ARI) scores after debonding and predicted the clinical performance of materials and bonding techniques from Weibull analyses. Results: Direct bonding produced significantly higher SBS values than indirect bonding for all materials. The SBS for Light-Core was significantly higher than that for Tetric N-Flow, and there was no significant difference between the direct bonding SBS of Transbond XT and that of Light-Core. Weibull analysis indicated Light-Core performed better than other indirectly bonded resins. Conclusions: When the SBS of a wire retainer is of primary concern, direct bonding methods are superior to indirect bonding methods. Light-Core may perform better than Transbond XT or Tetric N-Flow when bonded indirectly.

S-parameter의 변화를 유도하는 임피던스 변화 감지를 통한 전자회로의 결함검출회로 (The defect detection circuit of an electronic circuit through impedance change detection that induces a change in S-parameter)

  • 서동환;강태엽;유진호;민준기;박창근
    • 전기전자학회논문지
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    • 제25권4호
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    • pp.689-696
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    • 2021
  • 본 논문에서는 고장예측진단 및 건전성 관리 기법(Prognostics and Health Management, PHM)을 적용하기 위해 해당 시스템 혹은 회로 내부에서 결함특성을 감지하고 예측할 수 있는 회로 구조를 제안하였다. 기존 연구에서 회로 결함의 진행에 따라, S-parameter 크기 최소값의 주파수가 변화하는 것을 확인하였다. 이러한 특성을 기존에는 네트워크 분석기(Network Analyzer)를 활용하여 측정하였으나, 본 연구에서는 같은 결함검출기법을 활용하더라도 큰 계측장비 없이 결함의 진행상황 및 잔여 수명, 결함발생 여부를 확인할 수 있는 소형화된 회로를 설계하였다. 본 연구에서는 S-parameter의 변화를 야기하는 임피던스의 변화를 감지할 수 있도록 회로를 설계하였으며, Bond-wire의 온도반복에 따른 S-parameter 변화 측정결과를 제안하는 회로에 적용하였다. 이를 통해 해당 회로가 Bond-wire의 결함을 감지할 수 있다는 것을 성공적으로 검증하였다.

신설 콘크리트 교면 덧씌우기를 위한 라텍스 개질 콘크리트의 강도발현 특성 (Strength Development Properties of Latex Modified Concrete For New Concrete Bridge Deck Overlay)

  • 윤경구;김기헌;이주형;홍창우;김동호
    • 한국도로학회논문집
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    • 제3권3호
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    • pp.135-146
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    • 2001
  • 기존의 교면포장공법의 근본적인 문제점으로 인해 새로운 교면포장 공법이 점차 부각되고 있는 실정이며, 새로운 교면포장 공법으로 연구되고 있는 것이 라텍스 개질 콘크리트를 이용하는 것이다. 따라서, 본 연구에서는 신설 콘크리트 교량 교면포장으로 덧씌우기된 LMC의 강도발현 특성과 덧씌우기 될 때의 기존콘크리트와의 부착특성을 파악하고자 하였다. 이런 연구를 위해 라텍스 혼입률에 따른 라텍스 개질 콘크리트의 압축강도와 휨강도, 그리고 기존콘크리트와의 부착강도를 측정하였다. 본 연구결과 라텍스 혼입량 증가로 폴리머 입자들의 볼베어링 작용, 연행된 공기 및 라텍스 안에 있는 계면활성제의 분산작용에 의하여 LMC의 작업성과 휨강도를 증가시킨다는 사실을 파악 할 수 있었고, LMC와 기존 콘크리트 슬래브와의 부착강도는 크게 증진함을 알 수 있었다.

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치아의 견인을 위한 버튼 접착시 오염이 인장강동에 미치는 영향 (TENSILE STRENGTHS OF PRE-LIGATURED BUTTON WITH SEVERAL TYPES OF CONTAMINATION IN DIRECT BONDING PROCEDURE WHICH CAN HAPPEN DURING THE SURGICAL EXPOSURE OF UNERUPTED TEETH)

  • 김성오;최병재;이제호;손흥규
    • 대한소아치과학회지
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    • 제25권2호
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    • pp.400-420
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    • 1998
  • We already know that it is very difficult to obtain an "isolated field" for direct bonding during the surgical exposure of unerupted teeth. The aim of this in-vitro study is to simulate the clinical situation of forced eruption and to evaluate the tensile strengths of preligatured button with several types of contamination which can happen during the surgical exposure of unerupted teeth. Four orthodontic direct bonding systems were used. ($Ortho-One^{TM}$, $Rely-a-Bond^{(R)}$, $Ortho-Two^{TM}$, Phase $II^{(R)}$) Each material was divided into four groups(n=20) : Group 1. (Control, no contamination), Group 2. (Rinse etching agent with saline instead of water), Group 3. (Blood contamination of etched surface for 30 seconds), Group 4. (Blood contamination of primed surface for 30 seconds) 320 bovine anterior permanent teeth were divided into the above mentioned 16 groups. Enamel surface was flattened and ground under water coolant. Pre-ligatured buttons were prepared to the same form. (Cut 0.25 ligature wire 10 cm in length. Twist the ligature wire 30 times clockwise. Mark the wire 15mm and 35mm points from button. Make a loop sticking two points together and twist the loop 6 times counterclockwise.) The bonded specimens were stored at $37^{\circ}C$ saline solution for 3 days. Then the tensile strength of each sample was measured with Instron universal testing machine, crosshead speed of 0.5mm/min. The following results were obtained: 1. As compared to control groups (Group 1) of each material, Rely-a-Bond had a significantly lower mean tensile strengths than other material. (p<0.01) 2. In Group 2. of Ortho-One and Rely-a-Bond, the mean tensile strengths decreased about 7.7% and 11.1%, respectively with statistical significances. (p<0.05) 3. In Group 2. of Ortho-Two and Phase II, the mean tensile strengths did not decrease. 4. In Group 3. of Ortho-One, Rely-a-Bond, Ortho-Two, and Phase II, the mean tensile strengths decreased about 60.8%, 56.1%, 60.2%, and 46.0%, respectively with statistical significances. (p<0.01) 5. In Group 4. of Ortho-One and Rely-a-Bond, the mean tensile strengths did not decrease. 6. In Group 4. of Ortho-Two and Phase II, the mean tensile strengths were decreased about 20.95% and 22.28%, respectively with statistical significances. (p<0.01) There were formations of a hump shaped mass from bonding resin under blood contamination which disturbed direct bonding procedure. According to Reynolds, the proper bond strength for clinical manipulation should be at least 45N or about 4.5Kg.F. According to these results, it can be concluded that Ortho-One could be used during surgical exposure of unerupted teeth. In any case, blood contamination of the etched surface should be avoided, but the blood contamination of primed surface of Ortho-One may not decrease bond strength. Just 'blowing-out' is enough to remove blood from primed surface of Ortho-One. You can verify the clean surface of the primer of Ortho-One after blowing out the blood contamination.

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H-induced Magnetism at Stepped Si (100) Surface

  • Lee, Jun-Ho;Cho, Jun-Hyung
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.211-211
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    • 2012
  • Using spin-polarized density-functional theory calculations, we find that the existence of either Peierls instability or antiferromagnetic spin ordering is sensitive to hydrogen passivation near the step. As hydrogens are covered on the terrace, the dangling bond electrons are localized at the step, leading to step-induced states. We investigate the competition between charge and spin orderings in dangling-bond (DB) wires of increasing lengths fabricated on an H-terminated vicinal Si(001) surface. We find antiferromagnetic (AF) ordering to be energetically much more favorable than charge ordering. The energy preference of AF ordering shrinks in an oscillatory way as the wire length increases. This oscillatory behavior can be interpreted in terms of quantum size effects as the DB electrons fill discrete quantum levels.

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고속/정밀 위치제어시스템의 모델인 및 제어에 관한 연구 (A Study on the Modeling and Control of High-Speed/High-Accuracy Position Control System)

  • 박민규;한창수
    • 제어로봇시스템학회논문지
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    • 제7권5호
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    • pp.399-406
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    • 2001
  • This paper presents a dynamic modeling and a sliding mode controller for the high-speed/high-accuracy position control system. The selected target system is the wire bonder assembly which is used in the semiconductor assembly process. This system is a reciprocating one around the pivot point that consists of VCM(voice coil motor) as an actuator and transducer horn as a bonding tool. For the modeling elements, the sys-tem is divided into electrical circuit, magnetic circuit and mechanical system. Each system is modeled using the bond graph method and united into the full system. Two major aims are considered in the design of the controller. The first one is that the horn must track the given reference trajectory. The second one is that the controller must be realizable by using the DSP board. Computer simulation and experimental results show that the designed sliding mode controller provides better performance than the PID controller.

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고속/정밀 위치제어시스템의 모델링 및 제어에 관한 연구 (A Study on the Modeling and Control of High-Speed/High-Accuracy Position Control System)

  • 신호준;박민규;윤석찬;한창수
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2000년도 추계학술대회논문집 - 한국공작기계학회
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    • pp.83-89
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    • 2000
  • This paper presents a dynamic modeling and a sliding mode controller for the high-speed / high-accuracy position control system. Selected target system is the wire bonder head assembly which is used in semiconductor assembly process. This system is a reciprocating one around the pivot point that consists of VCM(voice coil motor) as a actuator and transducer horn as a bonding tool. For the modeling elements, the system is divided into electrical circuit, magnetic circuit and mechanical system. Each system is modeled by using the bond graph method and united into the full system. Two major aims are considered in the design of the controller. The first one is that the horn must track the given reference trajectory. The second one is that the controller must be realizable by using the DSP board. Computer simulation and experimental results show that the designed sliding mode controller provides better performance than the PID controller.

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