• Proceedings of the KWS Conference
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• 2005.06a
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• pp.34-36
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• 2005

Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with $25{\mu}m$ copper wire on Au/Ni/Cu metallization of a PCB substrate was performed at ambient temperature. The central composite design of experiment (DOE) approach was applied to optimize the copper wire wedge bonding process parameters. After that, pull test of the wedge bond was performed to study the bond strength and to find the optimum bonding parameters. SEM was used to observe the cross section of the wedge bond. The pull test results show good performance of the wedge bond. Additionally, DOE results gave the optimized parameter for both the first bond and the second bond. Cross section analysis shows a continuous interconnection between the copper wire and Au/Ni/Cu metallization. The diffusion of Cu into the Au layer was also observed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.12
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• pp.1079-1083
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• 1998

In this study, ultrasonic power of Aluminum wire bonder, bond time and bond force are investigated and valued in order to minimize failure of bonding pad lift. We also tried to control those 3 factors properly. We got the conclusion that if we turn down the ability of ultrasonic power or bond time, we can get a pad lift from a boundary between bond pad ad wire because pad metal and wire joining is unstable, but it is best condition when it ultrasonic power is 100∼130unit, bond time is 15∼20msec and bond force is 4∼6gf.

• Journal of the Architectural Institute of Korea Structure & Construction
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• v.34 no.1
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• pp.41-51
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• 2018

In case of evaluating the bond stress of a void deck plate using a wire steel, there is no standard formula considering both the influence on the void and the type of the reinforcing bar. Therefore we proposed a model equation considered the bond characteristics of the void deck plate. A total of 46 specimens was carried out a direct pull-out test and the test variables were the presence of a void body, type of reinforcing bar, the inner cover thickness according to the location of reinforcing bars and bond region. As a result of the comparison between the steel bar and steel wire, the bond stress of the steel wire with the relative rib area of 0.071 is 4.5 ~ 28.58% lower than that of the steel bar with 0.092 and the bond stress reduction rate increases when the inner cover thickness is insufficient. In the case of the inner cover thickness of $1.7d_b$ and $2.7d_b$, the bond stress was reduced to 48.7 ~ 68.4%. In the inner cover thickness was $4.9d_b$ and $5.2d_b$, the bond stresses were equivalent to those of the solid specimens. It was confirmed that the average bond stress and strain were affected by the inner cover thickness. Therefore the predicted model for one module of the void deck plate is proposed and verified by considering the bond characteristics of the void deck plate.

• The korean journal of orthodontics
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• v.32 no.2 s.91
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• pp.143-153
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• 2002

The bonded orthodontic retainer constructed from composite and multistrand orthodontic wire provides an esthetic and efficient system for maintained retention. This study was designed to measure shear bond strength of bonded retainers and to suggest a optimal combination of a multistrand wire and bonding method used when bonded retainer was fabricated. 160 sound maxillary and mandibular premolars were used for 80 test samples. After Uniformizing bonding area, length of wire, and thickness of composite, multistrand wire was bonded to fabricated a bonded retainer by direct or indirect bonding method. Shear bond strength and extension length of each sample were measured by a universal testing machine. The results of this study were as follows : 1. In vitro shear bond testing found 6-stranded, 0.0155 inch wires to have the largest shear bond strength and 3-stranded, 0.0195 inch wires to have the least shear bond strength. But, These difference was not statistically significant(p<0.05). 2. In vitro extension testing found 3-stranded, 0.0155 inch wires to have the largest extension length and 3-stranded, 0.0195 inch wires to have the least extension length(p<0.05). The larger diameter wire was used, the larger extension length was shown. But, the strand of wire is not related to the extension length of wire. 3. In comparison with direct bonding method, larger shear bond strength and extension length was shown in indirect bonding method(p<0.05).

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.12
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• pp.1130-1135
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• 2015

The bond pull test is the most widely used technique for the evaluation and control of wire bond quality. The wire being tested is pulled upward until the wire or bond to the die or substrate breaks. The inspector test strength of wire by manually and it takes around 3 minutes to perform the test. In this paper, we develop a 3D vision system to measure 3D position of wire. It gives 3D position data of wire to move a hook into wires. The 3D measurement method to use here is a confocal imaging system. The conventional confocal imaging system is a spot scanning method which has a high resolution and good illumination efficiency. However, a conventional confocal systems has a disadvantage to perform XY axis scanning in order to achieve 3D data in given FOV (Field of View) through spot scanning. We propose a method to improve a parallel mode confocal system using a micro-lens and pin-hole array to remove XY scan. 2D imaging system can detect 2D location of wire and it can reduce time to measure 3D position of wire. In the experimental results, the proposed system can measure 3D position of wire with reasonable accuracy.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.61-73
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology.

• Smart Structures and Systems
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• v.1 no.1
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• pp.47-61
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• 2005

A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoceramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.

• Journal of IKEEE
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• v.26 no.4
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• pp.537-544
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• 2022

This paper analyzes the occurrence and cause of bond wires fusing used in the manufacture of pulsed high power amplifiers. Recently GaN HEMT has been spotlight in the fields of electronic warfare, radar, base station and satellite communication. In order to produce the maximum output power, which is the main performance of the high-power amplifier, optimal impedance matching is required. And the material, diameter and number of bond wires must be determined in consideration of not only the rated current but also the heat generated by the transient current. In particular, it was confirmed that compound semiconductor with a wide energy band gap such as GaN trigger fusing of the bond wire due to an increase in thermal resistance when the design efficiency is low or the heat dissipation is insufficient. This data has been simulated for exothermic conditions, and it is expected to be used as a reference for applications using GaN devices as verified through IR microscope.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.7-11
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• 2013

As thermosonic ball bonding is developed for more and more advanced applications in the electronic packaging industry, the control of process stresses induced on the integrated circuits becomes more important. If Cu bonding wire is used instead of Au wire, larger ultrasonic levels are common during bonding. For advanced microchips the use of Cu based wire is risky because the ultrasonic stresses can cause chip damage. This risk needs to be managed by e.g. the use of ultrasound during the impact stage of the ball on the pad ("pre-bleed") as it can reduce the strain hardening effect, which leads to a softer deformed ball that can be bonded with less ultrasound. To find the best profiles of ultrasound during impact, a numerical model is reported for ultrasonic bonding with capillary dynamics combined with a geometrical model describing ball deformation based on volume conservation and stress balance. This leads to an efficient procedure of ball bond modelling bypassing plasticity and contact pairs. The ultrasonic force and average stress at the bond zone are extracted from the numerical experiments for a $50{\mu}m$ diameter free air ball deformed by a capillary with a hole diameter of $35{\mu}m$ at the tip, a chamfer diameter of $51{\mu}m$, a chamfer angle of $90^{\circ}$, and a face angle of $1^{\circ}$. An upper limit of the ultrasonic amplitude during impact is derived below which the ultrasonic shear stress at the interface is not higher than 120 MPa, which can be recommended for low stress bonding.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.521-527
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• 2002

This paper presents a dynamic modeling and a robust PID controller design process for the wire bonder head assembly. For the modeling elements, the system is divided into electrical system, magnetic system, and mechanical system. Each system is modeled by using the bond graph method. The PID controller is used for high speed/high accuracy position control of the wire bonder assembly. The Taguchi method is used to evaluate the more robust PID gain combinations than conventional one. This study makes use of an L18 array with three parameters varied on three levels. Computer simulations and experimental results show that the designed PID controller provides more improved signal to noise ratio and reduced sensitivity than the conventional PID controller.