• Proceedings of the Korea Concrete Institute Conference
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• 2006.05a
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• pp.454-457
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• 2006

This study presents a strut-and-tie model for the development of headed bars in an exterior beam-column joint with transverse reinforcements. The tensile force of a headed bar is considered to be developed by head bearing together with bond along a bonded length as a partial embedment length. The model requires construction of struts with biaxially compressed nodal zones for head bearing and fan-shaped stress fields against neighboring nodal zones for bond stresses along the bonded length. Due to the existence of transverse reinforcements, the fan-shaped stress fields are divided into direct and indirect fan-shaped stress fields. A required development length and head size of a headed bar can be optimally designed by adjusting a proportion between a bond contribution and bearing contribution.

• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.171-176
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• 2021

Die-to-wafer (D2W) hybrid bonding in the multilayer semiconductor manufacturing process is one of wafer direct bonding, and various studies are being conducted around the world. A noteworthy point in the current die-to-wafer process is that a lot of voids occur on the bonding surface of the die during bonding. In this study, as a suggested method for removing voids generated during the D2W hybrid bonding process, a flexible mechanism for implementing convex for die bonding to be applied to the bond head is proposed. In addition, modeling of flexible mechanisms, analysis/design/control/evaluation of static/dynamics properties are performed. The proposed system was controlled by capacitive sensor (lion precision, CPL 290), piezo actuator (P-888,91), and dSpace. This flexure mechanism implemented a working range of 200 ㎛, resolution(3σ) of 7.276nm, Inposition(3σ) of 3.503nm, settling time(2%) of 500.133ms by applying a reverse bridge type mechanism and leaf spring guide, and at the same time realized a maximum step difference of 6 ㎛ between die edge and center. The results of this study are applied to the D2W hybrid bonding process and are expected to bring about an effect of increasing semiconductor yield through void removal. In addition, it is expected that it can be utilized as a system that meets the convex variable amount required for each device by adjusting the elongation amount of the piezo actuator coupled to the flexible mechanism in a precise unit.

• Journal of Photoscience
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• v.2 no.2
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• pp.95-98
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• 1995

The photodimers with cyclobutane rings and C$_2$ symmetry, derived from coumarin (syn, head to tail and anti, head to head) have been calculated by PM3-UHF-CI and Molecular Mechanics force field. The photocycloaddition to coumarin and 5,7-dimethoxycoumarin(DMC) dimers were deduced to be formed by their preferable frontier orbital interactions and via more stable cycloaddition by the C$_3$, C$_4$ bond. These results are consistent with the coumarin dimer model that the theoretical C$_4$-photocyclodimer of coumarin is predicted much more than the experimental C$_4$-photocyclodimer.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.521-527
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• 2002

This paper presents a dynamic modeling and a robust PID controller design process for the wire bonder head assembly. For the modeling elements, the system is divided into electrical system, magnetic system, and mechanical system. Each system is modeled by using the bond graph method. The PID controller is used for high speed/high accuracy position control of the wire bonder assembly. The Taguchi method is used to evaluate the more robust PID gain combinations than conventional one. This study makes use of an L18 array with three parameters varied on three levels. Computer simulations and experimental results show that the designed PID controller provides more improved signal to noise ratio and reduced sensitivity than the conventional PID controller.

• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.21-28
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• 2002

This paper presents a dynamic modeling and a robust PID controller design process for the wire bonder head assembly. For modeling elements, the system is divided into electrical part, magnetic part, and mechanical part. Each part is modeled using the bond graph method. The PID controller is used for high speed/high accuracy position control of the wire bonder assembly. The Taguchi method is used to obtain the more robust PID gain combinations than conventional one. This study makes use of an L18 array with three parameters varied on three levels. Results of simulations and experimental show that the designed PID controller provides a improved ratio of signal to noise and a reduced sensitivity improved to the conventional PID controller.

• Proceedings of the KSME Conference
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• 2001.06b
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• pp.747-753
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• 2001

This paper presents a dynamic modeling and a robust PID controller design process for the wire bonder head assembly. For the modeling elements, the system is divided into electrical system, magnetic system, and mechanical system. Each system is modeled by using the bond graph method. The PID controller is used for high speed/high accuracy position control of the wire bonder assembly. The Taguchi method is used to evaluate the more robust PID gain combinations. This study makes use of an L18 array with three parameters varied on three levels. Computer simulations and experimental results show that the designed PID controller provides more improved signal to noise ratio and reduced sensitivity than the conventional PID controller.

• Bulletin of the Korean Chemical Society
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• v.8 no.4
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• pp.298-300
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• 1987

The theoretical studies on the photocycloaddition reaction of 5,7-dimethoxycoumarin and 4',5'-dihydropsoralen with thymidine were carried out as a model for photosensitizing reaction of psoralen with DNA. The results are in reasonable agreement with experimental observations. The photoadducts between dimethoxycoumarin and thymidine were predicted to be $C_{4}$-cycloadducts through the cycloaddition of 3,4-pyrone double bond of dimethoxycoumarin to 5,6 double bond of thymidine. The major photoadduct of 4',5'-dihydropsoralen with thymidine has the anti head-to-head stereochemistry.

• Restorative Dentistry and Endodontics
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• v.23 no.1
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• pp.413-423
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• 1998

Dental ceramics exhibit excellent esthetic property, compressive strength, chemical durability, biocompatibility and translucency. This study evaluated the shear bond strength of composite resin to the new heat-pressed ceramic material (IPS-Empress System) depending on the surface treatments and bonding agents. The surface treatments were etching with 4.0% hydrofluoric acid, application of silane, and the combination of the two methods. Composite resin was bonded to ceramic with four kinds of dentin bonding agents(All-Bond 2, Heliobond, Scotch bond Multi-purpose and Tenure bonding agents). The ceramic specimen bonded with composite resin was mounted in the testing jig, and the universal testing machine(Zwick 020, Germany) was used to measure the shear bond strength with the cross head speed of 0.5 mm/min. The results obtained were as follows 1. The mean shear bond strength of the specimens of which the ceramic surface was treated with the combination of hydrofluoric acid and silane before bonding composite resin was significantly higher than those of the other surface treatment groups(p<0.05). 2. In the case of All-Bond 2 and Scotchbond Multi-purpose bonding agent group, the surface treatment methods did not influenced significantly on the shear bond(p>0.05). 3. Of the four bonding agents tested, the shear bond strength of Heliobond was significantly lower than those of other bonding agents regardless of the surface treatment methods(p<0.05). 4. The highest shear bond strength($12.55{\pm}1.92$ MPa) was obtained with Scotchbond Multipurpose preceded by the ceramic surface treatment with the combination of 4% hydrofluoric acid and silane.

• Restorative Dentistry and Endodontics
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• v.25 no.4
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• pp.550-560
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• 2000

In this study, shear bond strength of two bonding systems were measured and appearance of dentin surfaces were observed with SEM according to the storage time of eugenol on dentin surface, thus evaluated the effect of eugenol on bond strength of two dentin bonding systems. Control groups were directly bonded to dentin surface with One Step, Prime & Bond 2.1. Experimental groups were divided into experimental I and II according to dentin bonding agents. After eugenol application, dentin surfaces were bonded with One Step and Prime & Bond 2.1 according to the each storage time of immediately, 3min, 24hour, 48hour and 1week, and then control and experimental groups were filled with light cured composite resin(Z-100). After 24 hours water storage at $37^{\circ}C$, all samples were subjected to a shear load to fracture at a cross head 1.0mm/min with Instron universal testing machine(No. 4467). Etched dentin surface storaged for each time of immediately, 3min, 24hour, 48hour and 1 week after eugenol application were observed under Scanning Electron Microscope(Hitachi S-2300) at 20kvp. The data were evaluated statistically with two-way ANOVA and Tukey's HSD. The results were as follows; 1. Shear bond strengths were higher in control groups than in the experimental groups. 2. As storage time was increased after eugenol application, the shear bond strengths were decreased in experimental groups. 3. In experimental I, II the shear bond strengths were the lowest in which storage time was 1 week after eugenol application. 4. As storage time was increased after eugenol application, etched dentin surfaces showed obstructed dentinal tubule.

• Journal of Technologic Dentistry
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• v.33 no.3
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• pp.185-192
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• 2011

Purpose: This study was to evaluate the shear bond strength of the ceramic fused to Ni-Cr alloy(Bellabond plus) and Co-Cr alloy(Wirobond C) by heat treatment. Methods: Metal specimens were divided into 5 groups for each alloy according to heat treatment conditions prior to porcelain application. Fifteen specimens from each group were subjected to a shear load a universal testing machine using a 0.1mm/min cross-head speed and one specimen from each group was observed with EDX line profile. Results: The diffusion of metal oxide observed far in the specimen heat treated than no heat treated in the opaque layer. The shear bond strength measured highest to BP3(50.50MPa), WC2(50.49MPa) groups and measured lowest from BP1(35.1MPaa), WC1(39.66MPa) groups which were not treated with heat, and there was a significant difference (p<0.05). Conclusion: The shear bond strength of Ni-Cr alloy(Bellabond plus) and Co-Cr alloy(Wirobond C) measured similar 5 groups all.