• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2004년도 추계학술발표대회 논문집
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• pp.96-99
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• 2004

Silica fillers were coated by plasma polymer coatings of 1,3-diaminopropane, allylamine, pyrrole, 1,2-epoxy-5-hexene, allyl mercaptan and allyl alcohol using RF plasma (13.56 MHz). The coated fillers were then mixed with biphenyl epoxy, phenol novolac (curing agent) and/or triphenylphosphine (catalyst), and subjected to DSC analyses in order to elucidate the chemical reaction between functional moieties in the plasma polymer coatings and the epoxy resin. Only the samples with 1,3-diaminopropane and allylamine plasma polymer coated silica fillers showed heat of reaction peaks when they were mixed with biphenyl epoxy resin only, while these samples as well as the samples with 1,3-diaminopropane, allylamine and pyrrole plasma polymer coated silica fillers exhibited heat of reaction peaks when mixed with both biphenyl epoxy and phenol novolac (curing agent).

• 접착 및 계면
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• 제12권4호
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• pp.138-143
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• 2011

특수한 방향족 화합물인 biphenylene 성분이 도입된 novolac 유도체를 기본 골격으로 하는 에폭시 수지 경화물은 난연제의 도움 없이도 자기소화성을 발현하며, 최근에 친환경 EMC (Epoxy Molding Compound) 소재로 상용화되고 있다. 본 연구에서는 이들을 골격으로 하는 에폭시수지와 경화제로 이루어진 경화물을 제조하여 DSC, DMA, TMA, TGA로부터 phenol 유도체의 분자구조와 반응성, 열팽창성, 탄성율 및 열분해성 등을 검토하였다. 주제와 경화제의 골격구조로 biphenyl novolac 구조가 모두 함유할 때 저팽창성, 기계적 성능 및 연소지연성 등이 우수하게 나타났다.

• 반도체디스플레이기술학회지
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• 제13권4호
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• pp.27-32
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• 2014

The cure properties of self-extinguishing epoxy resin systems with different charge transfer type latent catalysts were investigated, which are composed of YX4000H as a biphenyl epoxy resin, MEH-7800SS as a hardener, and charge transfer type latent catalysts. We designed and used five kinds of charge transfer type latent catalyst and compared to epoxy resin systems with Triphenylphosphine-Benzoquinone(TPP-BQ) as reference system. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The epoxy resin systems with Triphenylphosphine-Quinhydrone(TPP-QH), Triphenylphosphine-Benzanthrone(TPP-BT) and Triphenylphosphine-Anthrone(TPP-AT) as a charge transfer type latent catalyst showed a cure conversion rate of equal or higher rate than those with TPP-BQ. These systems with TPP-QH and Triphenylphosphine-Tetracyanoethylene(TPP-TCE) showed a critical cure reaction conversion of equal or higher conversion than those with TPP-BQ. The increases of cure conversion rates could be explained by the decrease of the activation energy of these epoxy resin systems. It can be considered that the increases of critical cure reaction conversion would be dependent on the crystallinity of the biphenyl epoxy resin systems.

• Bulletin of the Korean Chemical Society
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• 제18권11호
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• pp.1199-1203
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• 1997

The investigation of cure kinetics of biphenyl epoxy (4,4-diglycidyloxy-3,3,5,5-tetramethyl biphenyl)-xylok resin system with four different catalysts was performed by differential scanning calorimeter using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy and rate constant were calculated and reported. The results indicate that the curing reaction of the formulations using triphenylphosphine (TPP) and 1-benzyl-2-methylimidazole (1B2MI) as a catalyst proceeds through a first order kinetic mechanism, whereas that of the formulations using diazabicyloundecene (DBU) and tetraphenyl phosphonium tetraphenyl borate (TPP-TPB) proceeds by an autocatalytic kinetic mechanism. To describe the cure reaction in the latter stage, we have used the semiempirical relationship proposed by Chern and Poehlein. By combining an nth order kinetic model or an autocatalytic model with a diffusion factor, it is possible to predict the cure kinetics of each catalytic system over the whole range of conversion.

• Korean Chemical Engineering Research
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• 제58권1호
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• pp.44-51
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• 2020

n-Methylimidazole, acetonitrile, benzylbromide 및 sodiumhexafluoroantimonate를 이용하여 염기성 촉매 1-benzyle-3-mehyl-imidazolium hexafluoroantimonate (BMH)를 합성하고, tetramethyl biphenol (TMBP)과 epichlorohydrine을 이용하여 결정성 바이페닐 에폭시를 합성하여 FT-IR과 ¹H-NMR으로 구조를 분석하였다. 합성한 촉매 BMH의 경화 거동을 고찰하기 위하여 0 ℃에서 250 ℃까지 5 ℃/min의 속도로 승온시키면서 에폭시 수지에 대하여 BMH의 질량비를 0.5, 1.0, 2.0 wt.%로 변화시켜 시차주사 열량계(differential scanning calorimeter, DSC)로 분석하였다. 그 결과, BMH 촉매는 비스페놀 A형 에폭시와 양이온 중합체의 단계적 가열과정에서 빠른 경화 특성을 보였다. 또한 합성한 바이페닐 에폭시는 일정한 온도에서 급격히 점도가 낮아지는 특성과 바이페놀의 강직한 골격구조를 가지는 특성을 가지고 있기 때문에 결정성 구조 및 고내열성을 요구하는 반도체용 봉지재료의 대표격인 epoxy molding compound (EMC)의 원료로서의 적용 가능성을 고찰하였다. 그 결과, 본 연구에서 개발한 바이페닐 에폭시는 결정성 구조로 이루어진 것을 확인하였으며, 경화제로 페놀 노볼락수지와 고온에서의 경화반응 시, BMH 촉매 존재 시에는 150 ℃ 근처에서 경화반응이 관찰되어 EMC의 원료로 사용될 수 있음을 확인하였다.