• Journal of the Korea Safety Management & Science
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• v.25 no.1
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• pp.23-29
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• 2023

Among the Additive Manufacturing (AM) technologies, the Binder-Jetting printing technology is a method of spraying an adhesive on the surface of powder and laminate layer by layer. Recently, this technique has become a major issue in the production of large casting products such as ship-building, custom vehicles and so on. In this study, we performed research to make actual mold castings and increase mechanical property by using special sand and water-based binders. For use as a mold, it has a strength of more than 3MPa and permeability. Various experiments were carried out to obtain suitable them. The major process parameters were binder jetting volume, binder types, layer thickness and heat treatment condition. As a result of this study, the binder drop quantity was measured to be about 60 pico-liter, layer thickness was 100㎛ and the heat treatment condition was measured about 1,000℃ and compressive strength were measured to be more than 5MPa. The optimum condition of this experiment was established through actual casting of aluminum. The equipment used in this study was a Freeforms T400 model (SFS Co., Ltd.), and the printing area of 420 * 300 * 250mm and resolution of 600dpi can be realized.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.11
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• pp.976-980
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• 2002

This paper repors on low temperature sealing process of PDP using binder and capping glass. The exhausting hole on rear glass of PDP was sealed by capping glass using screen-printed binder without exhausting glass tube. Based on the tubeless packaging process, out gassing problem could be reduced and vacuum conductance could be improved by eliminating exhaust tube.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1995.03a
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• pp.196-202
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• 1995

Drawbead formulation is the first process together with a binder wrap process in a sheet metal forming process. The purpose of a drawbead is to control the flow of the metal into the die in panel press forming. To simulate the drawbead formation process, an elasto-plastic finite element formulation is derived from the equilibrium equation an drelated boundary conditions considering the proper contact conditons. The developed finite element program is applied to drawbead formation in the plane strain condition. The simulation of drawbead formation produces the distribution fo stress and strain along the bead and the resultant elongation of the sheet in the cavity region with respect to various cavity dimensions of the sheet as well as the punch force of a drawbead and the amount of draw-in with respect to the stroke fo a drawbead. The numerical resutls provides the fundamental information as a boundary condition to analyze the complex binder wrap phenomena and panel press forming in simple way.

• Journal of the Korean Ceramic Society
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• v.53 no.5
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• pp.541-547
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• 2016

In developing high temperature molds with advantages of the sand and precision (investment) castings, mechanical properties of the mold were improved through homogeneous coating of starting powders with an inorganic binder and improvement of fabrication process. Beads with mullite composition were employed for properties of the mold under high temperature, which was compared with artificial sands. Precursors of silica and sodium oxide were used as starting materials for an inorganic binder to achieve homogeneous coating on the starting powders. Strength was enhanced by the glass phase converted from the inorganic binder through heat treatment process. Also, two kinds of process, wet and dry processes, were incorporated to prepare mold specimens. Consequently, fabrication process of the mold with superior strength and high temperature applicability, compared with the previous molds for sand casting, could be suggested through control of the starting material and enhancement of the vitrification efficiency.

• KIISE Transactions on Computing Practices
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• v.21 no.5
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• pp.359-364
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• 2015

As Internet of Things(IoT) has become one of the most rapidly growing market in the world, the number of embedded Android devices has increased. Therefore, it is necessary to set up an environment that connects and cooperates between the devices via network. The environment requires an ability not only to obtain information about other devices through a network but to control remote devices by invoking remote procedures. This paper suggests the Remote Binder, which is a method for remote procedure call between devices operating on Android platform. It invokes procedures of other Android devices without any revisions via network by extending the binder structure which is used for inter-process communication in Android.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1996.06a
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• pp.87-95
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• 1996

The stamping process consists of two stages : First, the blank is held by the blank holder and then it is further formed into the die cavity by punch stroke. In actual stamping process, the accurate prediction of binder wrap is an indispensable step in sheet metal forming analysis because the initial plastic buckling induced by improper die design is directly related with fatal defect at the final stage. In the present work, an approach including the gravity effect of blank material and proper consideration of contact and friction is proposed. Computations are carried out for some actual auto-body parts using 3D FEM code to investigate the validity of the proposed methodology. Comparisons with experimental results show that the suggested scheme can be effectively applied to the precise prediction of binder wrap for arbitrarily curved die faces in which gravity and contact effect must be taken into account.

• Journal of Powder Materials
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• v.12 no.4 s.51
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• pp.261-265
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• 2005

In order to fabricate complex-shaped polycrystalline ceramics by sintering, organic binders are usually pre-mixed with ceramic powders to enhance the formability during the shape forming process. These organic binders, however, must be eliminated before sintering so as to eliminate the possibilities of poor densification and unusual grain growth during sintering. The present work studies the effect of binder addition on grain growth behavior during sintering of $92(70Pb(Mg_{1/3}Nb_{2/3})O_3-30PbTiO_3))$-8PbO(mol%) piezoelectric ceramics. The microstructures of the sintered samples were examined for various heating profiles and debinding schedules of the binder removal process. Addition of Polyvinyl butyral(PVB) binder promoted abnormal grain growth especially in incompletely debinded regions. Residual carbon appears to change the grain shape from comer-rounded to faceted and enhance abnormal grain growth.

• Journal of the Korean Ceramic Society
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• v.36 no.6
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• pp.583-589
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• 1999

In the fabrication of ceramic chip couples for high frequency application such as the mobile communication equipment the formation of electrode lines and Ag diffusion were investigated with heat treatment conditions for removing organic binders. The deformation and densification of the electrode line greatly depended on the binder burnout process due to the overlapped temperature zone near 400$^{\circ}C$ of the binder dissociation and the solid phase sintering of the silver electrode. Ag ions were diffused into the glass ceramic substrate. The Ag diffusion was led by the glassy phase containing Pb ions rather than by the crystalline phase containing Ca ions. The fact suggests that the Ag diffusion could be controlled by managing the composition of the glass ceramic substrate.

• Analytical Science and Technology
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• v.6 no.2
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• pp.231-238
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• 1993

The thermal behavior of binder in multi-layer actuator has an effect on the properties of actuator. Binder burn-out process and thermal degradation mechanism of PNN-PZT/Acrylic binder were analyzed by FTIR, DSC, TGA. Binder was burnt out by two step. In oxygen atomsphere, thermal degradation was activated and final residue was minimized to 5%.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.16 no.5
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• pp.33-38
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• 2016

In Android platform, as applications invoke various service functions through IPC (Inter-Process Communication), IPC performance is critical to the responsiveness in Android. However, Android offers long IPC latency of hundreds of micro-seconds due to complicated software stacks between the kernel Binder and the user-level process Context Manager. This separation provides modularity and flexibility, but degrades the responsiveness of services owing to additional context switching and inefficient request handling. In this paper, we anatomize Android IPC mechanisms and observe that 55% of IPC latency comes from the communication overhead between Binder and Context Manager. Based on this observation, this paper proposes a kernel Binder cache that retains a popular subset of service function mappings, thereby reducing the requests transferred to the user-level daemon. The proposed Binder cache is implemented in Android 5.0 and experimental results with various benchmarks show that the proposed cache architecture improves performance by 52.9% on average.