• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 추계학술대회 논문집
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• pp.275-279
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• 1998

The influence of $WO_3$ (0.5-4.0mol%) on the microstructural and electrical properties of ZnO varistors was investigated. The major part of a tungsten segregated to the nodal point. SEM, EDAX, and XRD analysis revealed that three phase, such as W-rich phase, Bi-rich phase, and spinel phase, coexist at the nodal point. The average grain size increased in the range of 15.5-29.9pm with increasing $WO_3$ content. This may be probably attributed to liquid phase formed by $WO_3$, $WO_3$ acted as promotion additive of grain growth. As $WO_3$ content increase, the varistor voltage greatly decreased in the range 186.82-35.87V/mm due to the increase of grain growth. The barrier height decreased in the range 1.93-0.42eV with increasing $WO_3$content.

• 한국재료학회지
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• 제15권1호
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• pp.14-18
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• 2005

Ni-Cr-Sn-Bi alloys were prepared by air melting and sand casting method and their anti-galling behaviors were examined. Anti-galling properties were dominantly influenced by Bi-rich low temperature precipitates. Alloying effects on the anti-galling properties were investigated for several alloying elements to improve anti-galling properties of the alloy. An alloy with $1-3wt\%$ of Te showed markedly improved anti-galling properties. Metallographic and tribological tests were carried out to find out reasons for excellent properties. It was found that Te containing alloy has finely distributed precipitates of Bi-rich phase. The addition of Te changed the morphology of the Ni-rich primary phase from globular to fine dendritic. As a result, the anti-galling phase precipitated between dendrite arms with fine distribution showed excellent anti-galling properties.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.65-68
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• 1999

A well oriented Bi2212 superconductor thick films were fabricated by screen printing with a Cu-free Bi-Sr-Ca-O mixture powder on a copper plate and heat-treating at 820-88$0^{\circ}C$ for several minute in air. During the heat-treatment, the printing layer partially melted by reaction between the Cu-free precursor and CuO of the oxidizing copper plate. In the partial melting state, it is believed that the solid phase is Bi-free phase and Cu-rich phase and the composition of the liquid is around Bi : Sr : Ca : Cu = 2 : 2 : 0 : 1. Following the partial melting, the Bi2212 superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. With decreasing the Bi composition in the precursor powder, the critical temperature(T$_{c}$) of the fabricated Bi2212 thick film increased to about 79 K.K.

• 한국주조공학회지
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• 제32권2호
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• pp.91-97
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• 2012

The effects of Bi and Sb additions on the microstructures and casting properties in lead-free Cu-Zn-Sn broze were investigated. (1) When only Bi was added to the bronze, Bi was precipitated on the ${\delta}$ phase of ${\alpha}$ dendrite cell boundary. When Bi and Sb were added together, Bi was precipitated on the ${\delta}_A$ which was the Sb-rich area in the ${\delta}$ phase. (2) The addition of Sb accelerated the formation of ${\delta}$ phase, and when Sb, Bi and Pb were added, Bi and Pb were precipitated as mixed solution in the ${\delta}_A$ phase. (3) The combined addition of Sb and Bi resulted in the suppression of shrinkage due to the complementary effects of the mass feeding of ${\alpha}$-dendrite cluster covered with ${\delta}$ phase and sealing of micro-shrinkage in the ${\delta}$ phase by solidification expansion of Bi.

• 마이크로전자및패키징학회지
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• 제16권4호
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• pp.23-28
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• 2009

Si 기판의 캐비티 형성이 불필요한 웨이퍼-레벨 MEMS capping 공정을 연구하였다. 4인치 Si 웨이퍼에 Ni 캡을 전기도금으로 형성하고 Ni 캡 rim을 Si 하부기판의 Cu rim에 에폭시 본딩한 후, SnBi debonding 층을 이용하여 상부기판을 Ni 캡 구조물로부터 debonding 하였다. 진공증착법으로 형성한 SnBi debonding 층은 Bi와 Sn 사이의 심한 증기압 차이에 의해 Bi/Sn의 2층 구조로 이루어져 있었다. SnBi 증착 층을 $150^{\circ}C$에서 15초 이상 유지시에는 Sn과 Bi 사이의 상호 확산에 의해 eutectic 상과 Bi-rich $\beta$상으로 이루어진 SnBi 합금이 형성되었다. $150^{\circ}C$에서 유지시 SnBi의 용융에 의해 Si 기판과 Ni 캡 구조물 사이의 debonding이 가능하였다.

• 한국주조공학회지
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• 제26권4호
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• pp.191-196
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• 2006

The effects of Bi and Te on the anti-galling behaviors of Ni base alloy were investigated by SEM, galling test and wear test. Anti-galling characteristics depended on the structure of matrix and distribution of Bi-rich phase which was precipitated at grain boundary. The addition of 5 wt% Bi markably enhanced anti-galling properties. The addition of Te caused Bi-rich precipitates to disperse finely and casting structure to form equiaxed type. From the above tests, the concentration of 5 wt% Bi and 1 wt% Te was selected to optimize in this alloy.

• 한국세라믹학회지
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• 제35권5호
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• pp.499-504
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• 1998

Pechini 방법으로 98.0 mol% ZnO, 1.0mol% $Bi_2O_3$, 0.5mol% CaO, 그리고 0.5mol% $MnO_2$ 조성의 ZnO 바리스터를 제조하여 소결거동과 전기적 특성을 관찰하였다. Pechini 방법으로 제조된 ZnO 바리스터 분말은 평균 입자크기가 $1.5\mu$m 정도이며 좁은 입도 분포를 보였다. $1100^{\circ}C$의 소결온도에서 전형적인 액상소결 과정에서 나타나는 입자성장 거동을 보였으며, 균일한 입자크기와 입계를 따라 Bi가 풍부한 액상이 고르게 분포된ZnO 바리스터를 제조할 수 있었다. 본 실험에서 비직선계수는 40~60 정도의 비교적 높은 값을 보였으며, 항복전압의 역수는 입자크기에 거의 비례하였다. 이것은 Pechini 방법으로 제조한 ZnO 바리스터가 균일한 입자크기와 균일한 액상의 분포를 갖는 바람직한 미세구조를 갖는 것을 보여 주는 것으로, Pechini 방법을 이용함으로서 ZnO 바리스터의 미세구조를 효과적으로 조절할 수 있으므로, 그 전기적 특성의 제어가 가능할 것으로 사료된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.552-556
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• 2002

The microstructure and electrical characteristics of A~C's ZnO varistors fabricated according to variable sintering condition, which sintering temperature is $1130^{\circ}C$ and speeds of pusher are A: 2mm/min, B: 4mm/min, C: 6mm/min, respectively, were investigated. In the microstructure, A~C's ZnO varist-ors fabricated variable sintering condition was consisted of ZnO grain(ZnO), spinel phase$(Zn_{2.33}Sb_{0.67}O_4)$ Bi-rich $phase(Bi_{2}O_{3})$, wholly. Varistor voltage of A~C's ZnO varistors sintered at $1130^{\circ}C$ increased in order A < B < C's ZnO varistors. C's ZnO varistor exhibited good characteristics that nonlinear exponent is 31.70. Leakage current of A~C's ZnO varistors exhibited below 2mA at rated voltage. Lightning impulse residual voltage of A's ZnO varistor suited standard characteristics, which is 3.85kV at 2.5kA, 4.4kV at 5kA and 5.16kV at 10kA. After multi lightning impulse residual voltage test of A's ZnO varistor exhibited good discharge characteristics which ZnO varistor reveals no evidence of puncture, flashover, cracking in visual examination. After high current impulse test of A's ZnO varistor exhibited good discharge characteristics, which variation rate of residual voltage is 0.4% before and after test, and revealed no evidence.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.489-494
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• 2001

In this thesis, the microstructure and electrical properties of ZnO varistors were investigated according to ZnO varistors with various formulation. A∼E's ZnO varistor ceramics were exhibited good density, 95% of theory density and low porosity, 5%, wholly. The average grain size of A-E's ZnO varistor ceramics exhibited 11.89$\mu\textrm{m}$, 13.57$\mu\textrm{m}$, 15.44$\mu\textrm{m}$, 11.92$\mu\textrm{m}$, 12.47$\mu\textrm{m}$, respectively. Grain size of C's ZnO varistor is larger and grain size of A and D's are smaller than other varistors. In the microstructure, A∼E's ZnO varistor ceramics sintered at l130$^{\circ}C$ was consisted of ZnO grain(ZnO), spinel phase(Zn$\sub$2.33/Sb$\sub$0.67/O$_4$), Bi-rich Phase(Bi$_2$O$_3$) and inergranular phase, wholly. Reference voltage of A∼E's ZnO varistor sintered at 1130$^{\circ}C$ decreased in order D, E > A > B > C's ZnO varistors. Nonlinear exponent of varistors exhibited high characteristics, above 30, wholly. Consequently, C's ZnO varistor exhibited good nonlinear exponent, 68. Lightning impulse residual voltage of A, B, C and E's ZnO varistors suited standard characteristics, below 12kV at current of 5kA.

• 한국주조공학회지
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• 제21권4호
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• pp.239-245
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• 2001

Microstructure and mechanical properties of Sn-3.1 wt.%Ag-6.9 wt.%Bi system solders on Cu-substrate were studied. The Sn3.1 wt.%Ag-6.9 wt.%Bi alloy was designed by phase diagram and chemical properties and was prepared by melting in argon atmosphere. The mechanical properties of solder/Cu joints were examined by shear strength test, and also creep test. The microstructure of Sn-3.1 wt.%Ag-6.9 wt.%Bi alloy consists of Bi-rich phase and $Ag_3Sn$ precipitate in {\beta}-Sn$ matrix phase. The shear strength of the joint was decreased with aging treatment. Crack path under shear test was through the solder. Similar crack path change mode was observed at the creep test of solder/Cu joint. The creep behavior of Sn-3.1 wt.%Ag-6.9 wt.%Bi alloy represented the inverse primary creep behavior at all test condition. It is suggested that the inverse primary creep behavior is induced from Bi solute atoms in Sn-matrix. The creep resistance of Sn-3.1Ag-6.9Bi alloy is better than that of Sn-3.5 wt.%Ag alloy at all test conditions.