• Title/Summary/Keyword: BeCu

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Facile Syntheses of Metal-organic Framework Cu3(BTC)2(H2O)3 under Ultrasound

  • Khan, Nazmul Abedin;Jhung, Sung-Hwa
    • Bulletin of the Korean Chemical Society
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    • v.30 no.12
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    • pp.2921-2926
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    • 2009
  • Cu-BTC[$Cu_3(BTC)_2(H_2O)_3$, BTC = 1,3,5-benzenetricarboxylate], one of the most well-known metal-organic framework materials (MOF), has been synthesized under atmospheric pressure and room temperature by using ultrasound. The Cu-BTC can be obtained in 1 min in the presence of DMF (N,N-dimethylformamide), suggesting the possibility of continuous production of Cu-BTC. Moreover, the surface area and pore volume show that the concentration of DMF is important for the synthesis of Cu-BTC having high porosity. The morphology and phase also depend on the concentration of DMF : Cu-BTC cannot be obtained at room temperature in the absence of DMF and aggregated Cu-BTC (with low surface area) is produced in the presence of high concentration of DMF. It seems that the deprotonation of benzenetricarboxylic acid by base (such as DMF) is inevitable for the room temperature syntheses.

Size-Controlled Cu2O Nanocubes by Pulse Electrodeposition

  • Song, You-Jung;Han, Sang-Beom;Lee, Hyun-Hwi;Park, Kyung-Won
    • Journal of the Korean Electrochemical Society
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    • v.13 no.1
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    • pp.40-44
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    • 2010
  • In this work, highly uniform size-controlled $Cu_2O$ nanocubes can be successfully formed by means of pulse electrodeposition. The size distribution, crystal structure, and chemical state of deposited $Cu_2O$ nanocubes are characterized using scanning electron microscopy, transmission electron microscopy, X-ray diffraction and X-ray photoelectron spectroscopy. The phase transition from $Cu_2O$ to Cu can be controlled by constant current electrodeposition as a function of deposition time. In particular, the size of the $Cu_2O$ nanocubes can be controlled using pulse electrodeposition as a function of applied current density.

Fabrication and Characterization of Cu-based Amorphous Coatings by Cold Spray Process (저온 분사를 이용한 Cu계 비정질 코팅층의 제조 및 특성 연구)

  • Jung, Dong-jin;Park, Dong-Yong;Lee, Jin Kyu;Kim, Hyung Jun;Lee, Kee-Ahn
    • Korean Journal of Metals and Materials
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    • v.46 no.5
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    • pp.321-327
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    • 2008
  • Cu based amorphous ($Cu_{54}Zr_{22}Ti_{18}Ni_6$) coating was produced by cold spraying as a new fabrication process. The microstructure and macroscopic properties of amorphous coating layer was investigated and compared with those of cold sprayed pure Cu coating. Amorphous powders were prepared by gas atomization and Al 6061 was used as the substrate plate. X-ray diffraction results showed that Cu based amorphous powder could be successfully deposited by cold spraying without any crystallization. The Cu based amorphous coating layer ($300{\sim}400{\mu}m$ thickness) contained 4.87% porosity. The hardness of Cu based amorphous coating represented $412.8H_v$, which was correspond to 68% of the hardness of injection casted bulk amorphous material. The wear resistance of Cu based amorphous coating was found to be three times higher than that of pure Cu coating. The 3-point bending test results showed that the adhesion strength of Cu based amorphous coating layer was higher than that pure Cu coating. It was also observed that hard Cu base amorphous particle could easily deform soft substrate by particle collisions and thus generated strong adhesion between coating and substrate. However, the amorphous coating layer unexpectedly represented lower corrosion resistance than pure Cu coating, which might be resulted from the higher content of porosity in the cold sprayed amorphous coating.

Pre-adaptation to Cu during Plant Tissue Culture Enhances Cu Tolerance and Accumulation in Begonia (Begonia evansiana Andr.)

  • Ahn, Yeh-Jin;Park, Jong-Moon
    • Journal of Ecology and Environment
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    • v.30 no.3
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    • pp.271-276
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    • 2007
  • A simple and efficient protocol was developed for culturing Cu-tolerant and Cu-accumulating plants via pre-adaptation to Cu during plant tissue culture. We induced multiple shoots from begonia (Begonia evansiana Andr.) leaf explants on MS medium supplemented with naphtaieneacetic acid and benzyladenine. After 3 months, small plantlets were transferred to MS medium supplemented with $100{\mu}M\;CuCl_2$ for pre-adaptation to Cu and cultured for 5 months. Then, these plantlets were individually planted in pots containing artificial soil. An additional 500 mg of Cu dissolved in 1/4 strength MS solution was applied to each pot during irrigation over the course of 2 months. We planted pre-adapted and control begonias in soil from the II-Kwang Mine, an abandoned Cu mine in Pusan, Korea, to examine their ability to tolerate and accumulate Cu for phytore-mediation. Pre-adapted begonias accumulated $1,200{\mu}g$ Cu/g dry root tissue over the course of 45 days. On the other hand, non-Cu-adapted controls accumulated only $85{\mu}g$ Cu/g dry root tissue. To enhance Cu extraction, chelating agents, ethylenediamine tetraacetic acid (EDTA)-dipotassiun and pyridine-2,6-dicarboxylic acid (PDA), were applied. While the chelating agents did not enhance accumulation of Cu in the roots of control begonias, EDTA application increased the level of Cu in the roots of pre-adapted begonias twofold (to $2,500{\mu}g$ Cu/g dry root tissue). Because pre-adapted begonias accumulated a large amount of Cu, mainly in their roots, they could be used for phytostabilization of Cu-contaminated soils. In addition, as a flowering plant, begonias can be used to create aesthetically pleasing remediation sites.

Densification of Cu-50%Cr Powder Compacts and Properties of the Sintered Compacts (Cu-50%Cr 분말성형체의 치밀화 및 소결체 물성)

  • 김미진;정재필;도정만;박종구;홍경태
    • Journal of Powder Materials
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    • v.7 no.4
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    • pp.218-227
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    • 2000
  • It is well known that the Cu-Cr alloys are very difficult to be made by conventional sintering methods. This difficulty originates both from limited solubility of Cr in the Cu matrix and from limited sintering temperature due to high vapor pressures of Cr and Cu components at the high temperature. Densification of Cu-50%Cr Powder compacts by conventional Powder metallurgy Process has been studied. Three kinds of sintering methods were tested in order to obtain high-density sintered compacts. Completely densified Cu-Cr compacts could be obtained neither by solid state sintering method nor by liquid phase sintering method. Both low degree of shrinkage and evolution of large pores in the Cu matrix during the solid state sintering are attributed to the anchoring effect of large Cr particles, which inhibits homogeneous densification of Cu matrix and induces pore generation in the Cu matrix. In addition, the effect of undiffusible gas coming from the reduction of Cu-oxide and Cr-oxide was observed during liquid phase sintering. A two-step sintering method, solid state sintering followed by liquid phase sintering, was proved to have beneficial effect on the fabrication of high-dendsity Cu-Cr sintered compacts. The sintered compacts have properties similar to those of commercial products.

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A Study on Solderability of Sn-Ag-Cu Solder with Plated Layers in ʼn-BGA (ʼn-BGA에서 Sn-Ag-Cu 솔더의 도금층에 따른 솔더링성 연구)

  • 신규식;정석원;정재필
    • Journal of Welding and Joining
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    • v.20 no.6
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    • pp.59-59
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    • 2002
  • Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

A Study on Solderability of Sn-Ag-Cu Solder with Plated Layers in $\mu-BGA$ ($\mu-BGA$에서 Sn-Ag-Cu 솔더의 도금층에 따른 솔더링성 연구)

  • 신규식;정석원;정재필
    • Journal of Welding and Joining
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    • v.20 no.6
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    • pp.783-788
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    • 2002
  • Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp.:$250^{\circ}C$and conveyer speed:0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was $250^{\circ}C$. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn ($5\mu\textrm{m}$), Cu/Ni ($5\mu\textrm{m}$), and Cu/Ni/Au ($5\mu\textrm{m}/500{\AA}$) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

Fabrication of Porous Cu by Freeze-drying Process of Camphene Slurry with CuO-coated Cu Powders (CuO가 코팅된 Cu 분말을 혼합한 Camphene 슬러리의 동결건조에 의한 Cu 다공체 제조)

  • Bang, Su-Ryong;Oh, Sung-Tag
    • Journal of Powder Materials
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    • v.21 no.3
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    • pp.191-195
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    • 2014
  • This study reports a simple way of fabricating the porous Cu with unidirectional pore channels by freeze drying camphene slurry with Cu oxide coated Cu powders. The coated powders were prepared by calcination of ball-milled powder mixture of Cu and Cu-nitrate. Improved dispersion stability of camphene slurry could be achieved using the Cu oxide coated Cu powders instead of pure Cu powders. Pores in the frozen specimen at $-25^{\circ}C$ were generated by sublimation of the camphene during drying in air, and the green bodies were sintered at $750^{\circ}C$ for 1 h in $H_2$ atmosphere. XRD analysis revealed that the coated layer of Cu oxide was completely converted to Cu phase without any reaction phases by hydrogen heat treatment. The porous Cu specimen prepared from pure Cu powders showed partly large pores with unidirectional pore channels, but most of pores were randomly distributed. In contrast, large and aligned parallel pores to the camphene growth direction were clearly observed in the sample using Cu oxide coated Cu powders. Pore formation behavior depending on the initial powders was discussed based on the degree of powder rearrangement and dispersion stability in slurry.

Biopharmaceutical studies on copper(II) chelates of sulfanilamide derivatives (Sulfanilamide유도체의 동(II)착화합물에 대한 생물약제학적 연구)

  • 김재백
    • YAKHAK HOEJI
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    • v.15 no.2
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    • pp.41-52
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    • 1971
  • Cu(II) chelates of several sulfanilamide derivatives (Sulfa-Cu) were prepared and their effects on solubility, absorptivity in intestinal lumen, biding tendency with serum protein and erythrocytes, concentration in rabbit blood, and acetylation rate were studied in comparison with their free ligand forms. For solubility concerned, the partition coefficients of Sulfa-Cu are decreased as following order: Sulfadimethoxine Copper chelate (SDM-Cu), Sulfamethoxypyridazine Copper chelate (SD-Cu), Sulfamerazine Copper chelate (SM-Cu), Sulfaisoxazole Copper chelate (SIX-Cu). The partition coefficients of SDM-Cu and ST-Cu were much greater than those of ligands. this phenomenone acounts for the rapid absorption of SDM-Cu and ST-Cu in the rat small intestine (in situ). The Sulfa-Cu were absorbed at the intestinal lumen of a rat in the rate of first order and there was no difference between long acting sulfa drugs and their Cu0chelates in biological half lives. In binding experiments, sulfa-Cu binded with serum protein in lower ratio than their ligands except SIX-Cu. On other hand, acetylation rates of sulfa-Cu were higher than those of free sulfa drugs and the acetylation rate were higher than those of free sulfa drugs and powder. In a experiment on Sulfa-Cu concentration in rabbit blood, the half lives of SD-Cu, SIX-cu, ST-Cu, and SM-Cu were longer than those of their ligands. Above all, the half life of SD-Cu appeared to be approximately 3.5 times logner than that of corresponding ligand, SD. When absorption of sulfa drugs or sulfa-Cu at the small intestinal lumen of a rat and the concentration in rabbit blood after absorption were compared, it was found that there was not always conrrelated.

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GMR and Magnetization Study of Sputtered Permalloy/Cu Multilayer: The Influence of Temperature, Thickness and Number of Magnetic Layer

  • Lucinski, T.;Stobiecki, F.;Urbaniak, M.
    • Journal of Magnetics
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    • v.4 no.1
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    • pp.17-21
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    • 1999
  • The GMR ($d_Cu$) oscillatory behaviour as well as the widths of first and the second antiferromagnetically coupled ranges of the Permalloy ($Py=Ni_{83}Fe_{17}$)/Cu multilayers have been found to be strongly affected not only by the presence of the superparamagnetic/paramagnetic entitles located at the Py/Cu interfaces but mainly by the existence of the magnetic bridges between Py layers. The effectiveness of the magnetic bridges has been found to be temperature dependent, leading to the temperature dependence of the remnant to saturation magnetization ratio ($M_R/M_S$). We have found that for Py/Cu multilayers with equal Py and Cu layer thicknesses a high field sensitivity of the GMR effect (0.4%/Oe) and negligible hysteresis can be achieved when the number of Py layers decreases from 100 to 6. Sensitivity can be further improved by increasing the Py layers thickness, but the hysterstic effect becomes more pronounced then.

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