• Proceedings of the SAREK Conference
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• 2006.11a
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• pp.30-30
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• 2006

• Proceedings of the SAREK Conference
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• 2007.06a
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• pp.129-129
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• 2007

• Proceedings of the SAREK Conference
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• 2007.06a
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• pp.130-130
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• 2007

• Aerospace Engineering and Technology
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• v.4 no.1
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• pp.150-161
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• 2005

A test was performed to collect the data to validate an analytic method for vent hole sizing on the nose fairing of a launch vehicle. The bake-out chamber at KARI was used to simulate the ambient pressure drop, and pressure difference data were collected for a model with various kinds of vent holes which was installed in the chamber. The characteristics of the test facility and measurement equipments were evaluated for the measurement of the transient behaviors. The measured data were processed in consideration of the characteristics of the facility and equipments, and the effects of vent hole size and configuration on the pressure variation in the model were analyzed based on the data.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.40-40
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• 2010

사중극 질량 분석기(Quadrupole Mass Spectrometer, QMS)는 높은 정확도와 사용이 쉬운 장점으로 인해 반도체 및 디스플레이 산업 등의 진공공정에서 잔류가스를 측정하고 분석하는 기기로써 반도체 및 디스플레이 소자제조를 위한 공정 진단에서 많이 사용되고 있다. 특히 고진공으로 내려가면서 리크 디텍션(leak detection)과 미세 량의 잔류기체 감지가 더욱더 요구되며 특히 $H_2$ 및 CO의 경우 측정에 많은 어려움이 있다. 따라서 $H_2$ 및 CO의 미세 량을 감지하기 위하여 QMS의 성능을 평가할 수 있는 parameter 중 하나가 될 수 있는 minimum detectable partial pressure(MDPP)를 측정하였다. 실제 고진공에 도달하여 MDPP를 계산하기 위해서는 bake out이 필요하며 또한 가스가 주입되지 않은 상태에서 잔류기체의 조성을 정확히 알 수 없기 때문에 정량적 분석이 어렵다는 단점이 있다. 본 실험에서는 측정하고자 하는 물질의 소량 포함된 표준가스를 사용하여 부피확장방법으로 가스 챔버로 희석하여 이동시키고 핀홀에서 가스유량을 더 줄여서 QMS가 기체를 감지하는 압력범위를 유지하면서 가스를 인가하여 주어 그때의 MDPP를 계산하였다. 또한 tuning을 통해 이온전류를 증폭시켜 더 향상된 MDPP를 측정하였다. 이 방법을 사용하면 bake out을 통한 고진공에 도달하지 않고서도 MDPP를 측정할 수 있으며, 정확한 조성 및 부분압을 알 수 있고 또한 희석된 가스를 사용하여 MDPP를 더욱 더 향상시킬 수 있다.

• Advances in materials Research
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• v.4 no.1
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• pp.1-12
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• 2015

Low carbon steel of composition 0.05C - 0.18 Mn - 0.012 Si is intercritically annealed at temperatures $750^{\circ}C$, $775^{\circ}C$ and $800^{\circ}C$. The equilibrated alloys of different amounts of austenite with varying carbon contents are quenched in iced water. The same alloys are subcritically annealed at $675^{\circ}C$ and $700^{\circ}C$ for varying periods of times; the subcritically annealed alloy samples are quenched in iced water. Optical, scanning electron and transmission electron microscopy are carried out for all the samples. The dislocation structure, its distribution and density present in the above prepared duplex ferrite martensite steels are studied. The martensites are found to be highly dislocated due to lattice invariant deformation. At the same time ferrite adjoining the martensite areas also exhibits quite a high dislocation density. The high dislocation density is favorable for strain ageing and hence bakes hardenability. EDS analyses were carried out for both martensite and ferrite phases; it is found that the degree of supersaturation in ferrite together with carbon content in martensite varies with the process parameters. The microhardness test results show that the hardness values of different phases differ appreciably with process parameters. The microstructures and the corresponding microanalyses reveal that differently processed steels contain phases of varying compositions and different distribution.

• Journal of the Semiconductor & Display Technology
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• v.5 no.2 s.15
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• pp.33-36
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• 2006

Many issues arose to use the Pb-free solder as adhesive materials in MEMS ICs and packaging. Then this study for easy and simple sealing method using adhesive materials was carried out to maintain hermetic characteristic in MEMS Package. In this study, Hermetic characteristic using negative PR (XP SU-8 3050 NO-2) as adhesive at the interface of Si test coupon/glass substrate and Si test coupon/LTCC substrate was examined. For experiment, the dispenser pressure was 4 MPa and the $200\;{\mu}m{\Phi}$ syringe nozzle was used. 3.0 mm/sec as speed of dispensing and 0.13 mm as the gap between Si test coupon and nozzle was selected to machine condition. 1 min at $65^{\circ}C$ and 15 min at $95^{\circ}C$ as Soft bake, $200\;mj/cm^2$ expose in 365 nm wavelength as UV expose, 1 min at $65^{\circ}C$ and 6 min at $95^{\circ}C$ as Post expose bake, 60 min at $150^{\circ}C$ as hard bake were selected to activation condition of negative PR. Hermetic sealing was achieved at the Si test coupon/ glass substrate and Si test coupon/LTCC substrate. The leak rate of Si test coupon/glass substrate was $5.9{\times}10^{-8}mbar-l/sec$, and there was no effect by adhesive method. The leak rate of Si test coupon/LTCC substrate was $4.9{\times}10^{-8}mbar-l/sec$, and there was no effect by dispensing cycle. Better leak rate value could be achieved to use modified substrate which prevent PR flow, to increase UV expose energy and to use system that controls gap automatically with vision.

• Journal of the Korean Vacuum Society
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• v.7 no.4
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• pp.285-292
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• 1998

The vacuum vessel of the KSTAR tokamak has a so large poloidal cross- section that workers can enter into the inside the vessel. To produce a clean plasma with low impurity concentrations it is planned that the whole vessel including plasma facing components will be baked out at $350^{\circ}C$ and the base pressure of the vessel will be kept in the range of ultra high vacuum. Large thermal stresses are expected during bake-outs to a three-dimensionally complex structure of the vessel, consequent ununiformity of the temperature distribution and support systems to resist forces acting on the vessel. In this report variations of the thermal stress according to temperature gradients on the vessel and constraint conditions of supporting structures are studied and some possible counterplans are discussed.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.864-867
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• 2002

LG Electronics developed a perfect flat color display tube which was named "FLATRON" . This tube provides ergonomic performances with perfectly flat face and innovative manufacturing process. Foil transfer is a new technology for manufacturing screen layer for Flatron. Its main features include several properties of film, releasing agent, adhesive, aluminum layer, holes after bake-out and foil transfer process. It will be used innovative and cost oriented process for FLATRON for in CRT mass production..

• Proceedings of the SAREK Conference
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• 2005.06a
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• pp.180-180
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• 2005