• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• Journal of Welding and Joining
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• v.19 no.1
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• pp.33-39
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• 2001

The welding quality by Gas Tungsten Arc Welding shows very high level, but the welding speed is lower than that of gas metal arc welding. Also, the welding quality by automatic GTAW is variable as the arc characteristics is changed by the consumption of electrode tip. The purpose of this study is to investigate the relation between the properties of tungsten electrode tip and the various arc characteristics at high current region. In this study, the high welding current 200A was applied to the repeated arc start test and long term arcing test using the $\phi$3.2 tungsten electrodes with cone angle 30$^{\circ}$, 45$^{\circ}$, 60$^{\circ}$sharp tip, and 60$^{\circ}$surface polished (S.P.) sharp tip. It was confirmed that the maximum arc pressure by the initial electrode condition was highest in 45$^{\circ}$sharp tip, and the next in 60$^{\circ}$sharp tip, the last was in 30$^{\circ}$sharp tip and 60$^{\circ}$S.P.. But, the maximum arc pressure after the repeated arc start test and long term arcing test was decreased considerably. But, the maximum arc pressure was highest also in 45$^{\circ}$ sharp tip after the tests, the next was in 30$^{\circ}$sharp tip, and the last was in 60$^{\circ}$sharp tip and 60$^{\circ}$S.P.. The arc start characteristics was the most excellent in 60$^{\circ}$S.P., By long term arcing test, the lanthania included in tungsten electrode was extinguished at tip surface preferentially, therefore the arc characteristics of electrode tip got worse.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• Tunnel and Underground Space
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• v.8 no.4
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• pp.332-341
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• 1998

Conventional polishing of stone panel edges has been done by hand. While this has changed somewhat with the advent of automatic machines, it is still very much a hand finishing technology. For the development of edge shape milling tool, the primary test on characteristics of edge shape milling tool was carried out. This paper presents the results of tests focused upon the milling capability that was varied by the variables of operation parameters. Author tried to confirm the effect of six operation parameters of equipment such as rotation speed, advance speed, applied load, water flow rate and rotational direction. The result from test was described in term of shape milling capability that was defined as cutting volume of rock by unit weight of tool wear. The variance of the results could indicate the optimum level of each operating parameters. The test was also carried out to determine the abrasion resistance varied according to the abrasive flow rate. The abrasion resistance was increased with the abrasive flow rate, but over some rate it was not changed.

• Proceedings of the KACD Conference
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• 2001.11a
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• pp.577-577
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• 2001

The lastest concepts in bonding are "total etch", in which both enamel and dentin are etched with an acid to remove the smear layers, and "wet dentin" in which the dentin is not blown dry but left moist before application of the bonding primer. Ideally, the application of a bonding agent to tooth structure should be insensitive to minor contamination from oral fluids. Clinically contaminations such as saliva, gingival fluid, blood and handpiece lubricant are often encountered by dentists during preparation of a restoration. The aim of this study was to evaluate the effect of contamination by hem-ostatic agents on shear bond strength of compomer restorations. One hundred and ten extracted human maxillary and mandibular molar teeth were collected. The teeth were cleaned from soft tissue remnant and debris and stored in physiologic solution until they were used. Small flat area on dentin of the buccal surface were wet ground serially with 400, 800 and 1200 abrasive paper on automatic polishing machine. The teeth were randomly divided into 11 groups. Each group was conditioned as follows: Group 1 : Dentin surface was not etched and not contaminated by hemostatic agents. Group2 : Dentin surface was not etched but was contaminated by Astringedent (Ultradent product Inc., Utah, U.S.A.). Group3 : Dentin surface was not etched but was contaminated by Bosmin (Jeil Phann, Korea.). Group4 : Dentin surface was not etched but was contaminated by Epri-dent (Epr Industries, NJ, U.S.A.). Group5: Dentin surface was etched and not contaminated by hemostatic agents. Group 6 : Dentin surface was etched and contaminated by Astringedent. Group7 : Dentin surface was etched and contaminated by Bosmin. Group8 : Dentin surface was etched and contaminated by Epri-dent. Group9 : Dentin surface was contaminated by Astringedent. The contaminated surface was rinsed by water and dried by compressed air. Group10 : Dentin surface was contaminated by Bosmin. The contaminated surface was rinsed by water aud dried by compresfed air. Group 11 : Dentin surface was contaminated by Epri-dent. The contaminated surface was rinsed by water and dried by compresfed air. After surface conditioning, F2000 was applicated on the conditoned dentin surface. The teeth were thermocycled in distilled water at $5^{\circ}C\;and\;55^{\circ}C$ for 1000 cycles. The samples were placed on the binder with the bonded compomer-dentin interface parallel to the lmife-edge shearing rod of the Universal testing machine(Zwick 020, Germany) running at a cross head speed of 1.0mmimin. There were no significant differences in shear bond strength between groups 1 and group 3 and 4, but group 2 showed significant decrease in shear bond strength compared with group 1. There were no significant differences in shear bond strength between group 5 and group 7 and 8, but group 6 showed significant decrease in shear bond strength compared with group 5. There were no significant differences in shear bond strength between group 5 and group 9, 10 and 11.

• Restorative Dentistry and Endodontics
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• v.27 no.2
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• pp.150-157
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• 2002

One of the latest concepts in bonding are "total etch", in which both enamel and dentin are etched with an acid to remove the smear layers, and "wet dentin" in which the dentin is not dry but left moist before application of the bonding primer Ideally the application of a bonding agent to tooth structure should be insensitive to minor contamination from oral fluids. Clinically, contaminations such as saliva, gingival fluid, blood and handpiece lubricant are often encountered by dentists during cavity preparation. The aim of this study was to evaluate the effect of contamination by hemostatic agents on shear bond strength of compomer restorations. One hundred and ten extracted human maxillary and mandibular molar teeth were collected. The teeth were removed soft tissue remnant and debris and stored in physiologic solution until they were used. Small flat area on dentin of the buccal surface were wet ground serially with 400, 800 and 1200 abrasive papers on automatic polishing machine. The teeth were randomly divided into 11 groups. Each group was conditioned as follows : Group 1: Dentin surface was not etched and not contaminated by hemostatic agents. Group 2: Dentin surface was not etched but was contaminated by Astringedent$^{\circledR}$(Ultradent product Inc., Utah, U.S.A.) Group 3: Dentin surface was not etched but was contaminated by Bosmin$^{\circledR}$(Jeil Pharm, Korea.). Group 4: Dentin surface was not etched but was contaminated by Epri-dent$^{\circledR}$(Epr Industries, NJ, U.S.A.). Group 5: Dentin surface was etched and not contaminated by hemostatic agents. Group 6: Dentin sorface was etched and contaminated by Astringedent$^{\circledR}$. Group 7 : Dentin surface was etched and contaminated by Bosmin$^{\circledR}$. Group 8: Dentin surface was etched and contaminated by Epri-dent$^{\circledR}$. Group 9: Dentin surface was contaminated by Astringedent$^{\circledR}$. The contaminated surface was rinsed by water and dried by compressed air. Group 10: Dentin surface was contaminated by Bosmin$^{\circledR}$. The contaminated surface was rinsed by water and dried by compressed air. Group 11 : Dentin surface was contaminated by Epri-dent$^{\circledR}$. The contaminated surface was rinsed by water and dried by compressed air. After surface conditioning, F2000$^{\circledR}$ was applicated on the conditoned dentin surface The teeth were thermocycled in distilled water at 5$^{\circ}C$ and 55$^{\circ}C$ for 1,000 cycles. The samples were placed on the binder with the bonded compomer-dentin interface parallel to the knife-edge shearing rod of the Universal Testing Machine(Zwick Z020, Zwick Co., Germany) running at a cross head speed or 1.0 mm/min. Group 2 showed significant decrease in shear bond strength compared with group 1 and group 6 showed significant decrease in shear bond strength compared with group 5. There were no significant differences in shear bond strength between group 5 and group 9, 10 and 11.