• 열처리공학회지
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• 제7권4호
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• pp.307-317
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• 1994

The surf ace microstructure modification by $N^+$ ion implantation into 7050Al alloy and its low cycle fatigue behavior were investigated. Ion implantation method is to physically implant accelerated ions to the surface of a substrate. High dose of nitrogen($5{\times}10^{17}ions/cm^2$) were implanted into 7050Al alloy using current density of accellerating voltage of 100KeV. The implanted layers were characterized by Electron Probe-Micro Analysis(EPMA), Auger Elecron Spectroscopy(AES), X-Ray Diffraction(XRD), X-Ray Photoelectron Spectroscopy(XPS), and Transmission Electron Microscopy(TEM). The experimental results were compared with computer simulation data. It was shown that AlN was formed to 4500 ${\AA}$ deep. The low cycle fatigue life of the $N^4$ion modified material was prolonged by about three times the unimplanted one. The improved low cycle fatigue life was attributed to the formation of AlN and the damaged region on the surface by $N^+$ ion implantation.

• 한국재료학회지
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• 제2권1호
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• pp.27-34
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• 1992

Tantalum silicide films are prepared from a composite $TaSi_{28}$ target source and subjected to rapid thermal annealing($500-1100^{\circ}C$, 20sec) in Ar ambient. The formation and the properties of tantalum silicides have been investigated by using 4-point probe, x-ray diffraction, scanning electron microscope(SEM), Auger electron spectroscope(AES), and ${\alpha}$-step. It has been found that the sample annealed above $700^{\circ}C$ forms a polycrystalline $TaSi_2$ phase, and grains grow in granular form regardless of the kind of substrates. The mechanism of the formation of tantalum silicide is the nucleation and growth by Ta-Si short range reaction. The tantalum silicide film has the relatively low resistivity($70-72.5{\mu}{\Omega}-cm$) and smooth surface roughness.

• 한국재료학회지
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• 제7권10호
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• pp.832-837
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• 1997

본 연구에서는 반도체 소자의 수율을 현저히 저하시키는 반도체 습식 세정 시 건조 후 웨이퍼 표면에 형성된 water mark의생성 원인을 고찰하였다. 이를 위해 초순수수의 물방울을 다른 접촉각의 시편 위에 고의로 잔류시킨 후 질소 및 산소 분위기에서 건조시켰다. 건조 분위기와 상관없이 HF 처리된 소수성의시편 뿐만 아니라 친수성의 시편에서도 water mark이 관찰되었다. 생성된 water mark의 크기는 분위기에 무관하게 접촉각이 증가함에 따라 감소하였다. 그러나 산소 분위기에서 HF처리된 시편은 건조 후 질소 분위기에서 생성된 water mark의 크기보다 2배이상 크게 형성되었다. 이들 산소 및 질소 분위기에서 HF 처리된 실리콘 시편 위에 생성된 water mark의 성분을 AES(Auger Electron Spectroscopy)로 분석한 결과 water mark는 실리콘과 산소의 화합물 형태로 존재함을 확인하였다. AAS(Atomic Absorption Spectroscopy)분석 결과 건조 분위기에 상관 없이 HF처리된 실리콘 시편 위에 물방울을 30분 잔류시 물방울 내의 실리콘 농도가 증가하였다. 또한 물방울내 ozone을 첨가하여 실리콘 표면을 산화 시켰을 때 물방울과 표면의 접촉각 감소와 water mark의크기의 증가를 초래하였다.

• 한국전기전자재료학회논문지
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• 제23권10호
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• pp.747-751
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• 2010

In the study, the characteristics of the etched Zinc oxide (ZnO) thin films surface, the etch rate of ZnO thin film in $Cl_2/BCl_3/Ar$ plasma was investigated. The maximum ZnO etch rate of 53 nm/min was obtained for $Cl_2/BCl_3/Ar$=3:16:4 sccm gas mixture. According to the x-ray diffraction (XRD) and atomic force microscopy (AFM), the etched ZnO thin film was investigated to the chemical reaction of the ZnO surface in $Cl_2/BCl_3/Ar$ plasma. The field emission auger electron spectroscopy (FE-AES) analysis showed an elemental analysis from the etched surfaces. According to the etching time, the ZnO thin film of etched was obtained to The AES depth-profile analysis. We used to atomic force microscopy to determine the roughness of the surface. So, the root mean square of ZnO thin film was 17.02 in $Cl_2/BCl_3/Ar$ plasma. Based on these data, the ion-assisted chemical reaction was proposed as the main etch mechanism for the plasmas.

• 한국전기전자재료학회논문지
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• 제25권2호
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• pp.121-124
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• 2012

The characteristics of Ga-doped zinc oxide (GZO) thin films deposited at different deposition temperatures (TS~250 to $550^{\circ}C$) on 4H-SiC have been investigated. Structural and electrical properties of GZO thin film on n-type 4H-SiC(0001) were investigated by using x-ray diffraction(XRD), atomic force microscopy(AFM), Hall effect measurement, barrier height from I-V curve and Auger electron spectroscopy(AES). XRD $2\theta$ scan shows GZO thin film has preferential orientation with c-axis perpendicular to SiC substrate surface. The lowest resistivity ($\sim1.9{\times}10^{-4}{\Omega}cm$) was observed for the GZO thin film deposited at $400^{\circ}C$. As deposition temperature increases, barrier height between GZO and SiC was increased. Whereas, resistivity of GZO thin films as well as barrier height between GZO and SiC were increased after annealing process in air atmosphere. It has been found that the c-axis oriented crystalline quality as well as the relative amount of activated Ga3+ ions and oxygen vacancy may affect the electrical properties of GZO films on SiC.

• Journal of Electrical Engineering and Technology
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• 제8권5호
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• pp.1157-1162
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• 2013

We proposed AlGaN/GaN high-electron-mobility transistors (HEMTs) using thermal oxidation for NiOx passivation. Auger electron spectroscopy, secondary ion mass spectroscopy, and pulsed I-V were used to study oxidation features. The oxidation process diffused Ni and O into the AlGaN barrier and formed NiOx on the surface. The breakdown voltage of the proposed device was 1520 V while that of the conventional device was 300 V. The gate leakage current of the proposed device was 3.5 ${\mu}A/mm$ and that of the conventional device was 1116.7 ${\mu}A/mm$. The conventional device exhibited similar current in the gate-and-drain-pulsed I-V and its drain-pulsed counterpart. The gate-and-drain-pulsed current of the proposed device was about 56 % of the drain-pulsed current. This indicated that the oxidation process may form deep states having a low emission current, which then suppresses the leakage current. Our results suggest that the proposed process is suitable for achieving high breakdown voltages in the GaN-based devices.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.163-166
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• 2009

다중접합 초 고효율 태양전지 제조를 위해 SiC 매트릭스를 이용한 실리콘 양자점 초격자 박막을 제조하고 특성을 분석하였다. $SiC/Si_{1-x}C_x$(x ~ 0.31)로 실리콘 양자점 초격자 박막을 Si과 C target을 이용한 co-sputtering법으로 초격자 박막을 제조하고, $1000^{\circ}C$에서 20분간 열처리를 하였다. high resolution transmission electron microscopy 사진으로 약1~7nm 크기인 양자점 생성과 분포 밀도를 확인할 수 있었으며, grazing incident X-ray diffraction (GIXRD)를 통해서 Si(111)과 $\beta$-SiC(111)이 생성되었음을 알 수 있었다. Auger electron spectroscopy (AES)측정에서 stoichiometric SiC층과 Si-rich SiC층의 Si 원자농도 (56%, 69%)와 C 원자 농도 (44%, 31%)를 알 수 있었으며, Fourier transform infra-red spectroscopy (FTIR)측정에서 SiC 픽의 위치가 767에서 $800cm^{-1}$으로 이동하는 것을 알 수 있었다.

• Tribology and Lubricants
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• 제35권6호
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• pp.350-355
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• 2019

Surface energy is an important factor in determining the performance of application components in terms of preventing adhesion failure between thin films. In this regard, numerous attempts have been made to acquire the desired surface energy through chemical treatment or by using micro/nanostructures. However, such approaches are expected to provide extreme values of surface energy, which may not be suitable in achieving the enhanced performance of applications. In this study, we propose a method to control surface energy by using bilayer metallic film heterostructures. We measure the water contact angle of incompatible (Ni/Ag) and compatible (Zn/Ag) metal pairs under several experimental factors, including thickness, time, and temperature. Furthermore, we conduct Auger electron spectroscopy measurements to investigate the atomic concentration with respect to depth after the change in the water contact angle. The experimental results reveal that three parameters, namely, compatibility, film thickness, and environmental temperature, are major factors in controlling the water contact angle. Thus, we experimentally demonstrate that controlling these three parameters can provide the approximate desired water contact angle. This result is expected to aid in the performance enhancement of a wide range of application components, where control of surface energy is required.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.279-279
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• 2013

차세대 태양전지로 주목받는 화합물 박막 태양전지(CIGS, CdTe, etc)는 광흡수계수가 매우 높아 얇은 두께의 광흡수층으로도 빛을 효과적으로 흡수할 수 있으므로 광흡수층의 역할이 매우 중요하며 이에 대한 정확한 정보와 이해는 필수적이다. 특히 GIGS 박막 태양전지의 정량 및 각 원소의 깊이 방향의 분포를 분석하는 것은 박막형 태양전지 개발에 크게 기여한다 [1,2]. 본 실험에서는 조성비를 알고 있는 균질한 CIGS박막을 표준시료로 사용하여 ICP-MS로 측정하여 평균농도를 구한 뒤 TOF-SIMS, D-SIMS, Auger Electron Spectroscopy (AES) 로 깊이 방향 분석 결과를 통해 상대감도(RSF)를 계산한 후 각 원소의 농도로 변환하여 정량분석 결과를 얻었다. 일반적으로 손쉽게 정량적인 정보를 얻는 AES에 비해 정량성이 떨어지는 TOF-SIMS와 D-SIMS는 스퍼터링시 사용되는 Cs 빔과 시료 내 금속과의 클러스터 이온(GaCs+와 InCs+)의 깊이 방향 조성을 이용하면 매트릭스 효과를 배제할 수 있어서 좀 더 정확한 정량 분석이 가능하므로 시료내 금속과 Cs 이 결합된 클러스터 이온의 깊이 방향 조성을 측정하여 각원소의 농도를 계산하였고 스퍼터링 에너지를 포함한 실험 변수에 따른 재현성 및 정량성의 차이를 비교분석하였다. 또한 CIGS층에 불순물로 들어 있는 미량원소들의 깊이 분포도도 함께 관찰하였다.

• 전기학회논문지
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• 제56권1호
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• pp.132-138
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• 2007

Carbon nanotubes (CNTs) arc grown on Ni catalysts employing an inductively-coupled plasma chemical vapor deposition (ICP-CVD) method. The structural and field-emissive properties of the CNTs grown are characterized in terms of the substrate-bias applied. Characterization using the various techniques, such as field-omission scanning electron microscopy (FESEM), high-resolution transmission electron microscopy (HRTEM), Auger spectroscopy (AES), and Raman spectroscopy, shows that the structural properties of the CNTs, including their physical dimensions and crystal qualities, as well as the nature of vertical growth, are strongly dependent upon the application of substrate bias during CNT growth. It is for the first time observed that the provailing growth mechanism of CNTs, which is either due to tip-driven growth or based-on-catalyst growth, may be influenced by substrate biasing. It is also seen that negatively substrate-biasing would promote the vertical-alignment of the CNTs grown, compared to positively substrate-biasing. However, the CNTs grown under the positively-biased condition display a higher electron-emission capability than those grown under the negatively-biased condition or without any bias applied.