• 제목/요약/키워드: Au-Coated Ag wire (ACA)

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반도체 패키징용 금-코팅된 은 와이어의 부식특성 (Corrosion Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging)

  • 홍원식;김미송;김상엽;전성민;문정탁;김영식
    • Corrosion Science and Technology
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    • 제20권5호
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    • pp.289-294
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    • 2021
  • In this study, after measuring polarization characteristics of 97.3 wt% Ag, Au-Coated 97.3 wt% Ag (ACA) and 100 wt% Au wires in 1 wt% H2SO4 and 1 wt% HCl electrolytes at 25 ℃, corrosion rate and corrosion characteristics were comparatively analyzed. Comparing corrosion potential (ECORR) values in sulfuric acid solution, ACA wire had more than six times higher ECORR value than Au wire. Thus, it seems possible to use a broad applied voltage range of bonding wire for semiconductor packaging which ACA wire could be substituted for the Au wire. However, since the ECORR value of ACA wire was three times lower than that of the Au wire in a hydrochloric acid solution, it was judged that the use range of the applied voltage and current of the bonding wire should be considered. In hydrochloric acid solution, 97.3 wt% Ag wire showed the highest corrosion rate, while ACA and Au showed similar corrosion rates. Additionally, in the case of sulfuric acid solution, all three types showed lower corrosion rates than those under the hydrochloric acid solution environment. The corrosion rate was higher in the order of 97.3 wt% Ag > ACA > 100 wt% Au wires.