• Title/Summary/Keyword: Ashesion

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A Study on the Life Enhancement of TiN Coated Drill (TiN 박막을 코팅한 드릴의 수명향상에 관한 연구)

  • 김홍우;김문일
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.16 no.12
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    • pp.2340-2348
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    • 1992
  • Recently, various film coated insert tools have been used in order to improve tool life by several different vapor deposition or chemical vapor deposition. Especially, TiN coated drills have been broadly studied because of improving drill performance in terms of drill life, work quality and its brilliant color. Nevertheless, because of the poor adhesion between TiN film and drill, it was difficult to attain the better drill performance. Therefore, to improve adhesion of TiN films, we sputtered titanium as interlayer prior to TiN deposition on drill by PECVD(Plasma Enhanced Chemical Vapor Deposition). The results indicate that Ti/TiN coated drills achieve about 2.6 times life improvement, while TiN coated drills only 2 times. Wear characteristics of tested drills were examined using SEM, and the results were correlated with drill life and roughness of drilled holes.

Studies on the Adhesion of W to TiN(l) (TiN 에 대한 W의 부착특성에 관한 연구(l))

  • Lee, Jong-Mu;Gwon, Nan-Yeong;Son, Jae-Hyeon;Kim, Hyeong-Jun
    • Korean Journal of Materials Research
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    • v.3 no.5
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    • pp.466-475
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    • 1993
  • Adhesion of W to TiN which is used as a glue layer in the blanket tungsten process has been investigated using the pulling and scratch methods and analysed using surface roughness measurements by SEM and the reflectivity measurement, the stress measurement and the SIMS depth profiling Significant differences between the adhesion of the CVD tungsten film to the s-TiN and that to the a-TiN were found. It appeared that the fomer were better than the latter, which is due to the facts that the s-TiN film has a rougher surface and a lower stress level and a higher oxygen content than the a-TiN film. Also the ashesion strength was degreaded with increasing the TIN film thickness because of the increase of the TiN film stress.

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