• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1447-1450
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• 2006

The high speed and sensitivity array test system has been developed and utilized for massproduction of advanced LTPS displays including SOG and OLED. It realizes fast enough TACT enabling 100% inspection with better than 1fF sensitivity. The result of actual measurement shows its superior TACT and sensitivity, and also shows MURA detection of OLED panel.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2009년도 추계학술대회 논문집
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• pp.225-228
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• 2009

The simulated indoor pass-by noise measurement system is the tool to measure and evaluate the pass-by noise at the test laboratory, without doing measurement at the field. This measurement system can realize the precision measurement under the specific condition and overcome the limitations of the field measurement, i.e. weather conditions, repeatability, .. This measurement system is done in time domain process using the array techniques, which synchronizes the time signals. The reliability of the obtained result depends on the array shapes, which can generate the moving source effect. In this paper, the validations are checked focusing the time domain synchronization of the signals with the optimum microphone array shape.

• 대한산업공학회지
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• 제31권1호
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• pp.68-78
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• 2005

A new emotion-based image retrieval method is proposed in this paper. The research was motivated by Soen's evaluation of human emotion on color patterns. Thirteen pairs of adjective words expressing emotion pairs such as like-dislike, beautiful-ugly, natural-unnatural, dynamic-static, warm-cold, gay-sober, cheerful-dismal, unstablestable, light-dark, strong-weak, gaudy-plain, hard-soft, heavy-light are modeled by 19-dimensional color array and $4{\times}3$ gray matrix in off-line. Once the query is presented in text format, emotion model-based query formulation produces the associated color array and gray matrix. Then, images related to the query are retrieved from the database based on the multiplication of color array and gray matrix, each of which is extracted from query and database image. Experiments over 450 images showed an average retrieval rate of 0.61 for the use of color array alone and an average retrieval rate of 0.47 for the use of gray matrix alone.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2007년도 SMT/PCB 기술세미나
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• pp.115-127
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• 2007

[ ${\blacktriangleright$ ] Various Factors to affect TC Reliability of 4 array RES has been Investigated through Simulation Tool and Daisy Chain Board Test ${\blacktriangleright$ Solder Joint Crack Mechanism of 4 array RES has been Examined Also, It has been Examined Thoroughly What Influence Each Factors gibes to TC Reliability and Why Those Factors gives an Influence to it ${\blacktriangleright$ BGA Type RES is Suggested to Improve TC Reliability (Patented) ${\blacktriangleright$ Through this Study, Best Design Parameter has been Optimized to Increase TC Reliability of 4 Array RES

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 추계총회 및 학술대회 논문집
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• pp.71-71
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• 2012

Memory 반도체 Test공정에서 사용되는 Probe Card의 Probing Area가 넓어지면서 종래에 사용되던 Cantilever제품의 사용이 불가능하게 되고, MEMS공정을 사용한 새로운 형태의 Advanced제품이 시장에 출현을 하였다. MEMS형의 제품은 다수의 Micro Spring을 MLC(Multi Layer Ceramic)위에 MEMS 공정을 사용하여 생성하는 방식으로서 MLC는 좁은 지역에 다수의 Pin을 생성 할 수 있는 공간을 만들어 주며, 또 다른 이유는 전기적 특성인 임피던스를 맞추고 다수의 Pin의 압력에 의하여 생기는 하중을 Ceramic기판으로 지탱하기 위한 목적도 있다. 이에 MLC와 같은 전기적 특성을 임피던스를 맞춘 RF-CPCB를 사용하여 작은 면적에 다수의 Pin접합이 가능한 방법을 마련한 후, 이 RF-PCB를 부착하여 Pin의 하중을 받는 Wafer와 유사한 열팽창을 갖는 Substrate를 사용하여 MLC를 대체하여 다양한 온도 조건에서 사용이 가능하며, 복잡하고 공정비가 많이 드는 MEMS 공정에 의한 일괄 Micro Spring 생성 공정을 전주 도금 또는 2D방식의 도금 Pin으로 대체하였으며, Probe Card의 중요한 물리적 특성인 Pin들의 정렬도를 마련하기 위해 Photo Process를 사용한 Wafer로 만든 Wafer Pin Array Frame을 사용하여 2D 제작 Pin을 일괄 또는 부분 접합이 가능한 방법으로 Probe Array Head를 제작하여 이들을 부착하여 Probe Array Head를 이전의 MEMS공정 방법에 비해 쉽고 빠르게 만들어 probe Card를 제작 할 수 있게 되었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.1107-1108
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• 2011

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 추계학술대회 논문집 전기물성,응용부문
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• pp.297-299
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• 2003

In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining for the fabrication of microholes on Borofloat33 glass. Copper electrode array is fabricated by the bonding of silicon upper substrate and lower substrate and copper electroplate. The silicon upper electrode having microholes fabricated by ICP-RIE is the mold of copper electroplate. The lower substrate is used as the seed layer for copper electroplate after Au - Au thermocompression bonding with the upper substrate.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2000년도 추계학술대회논문집 - 한국공작기계학회
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• pp.279-284
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• 2000

The object of this paper is to evaluate the chip breakability using the experimental equation of surface roughness, which is developed in turning by an orthogonal array method. L$\sub$9/(3$^4$) orthogonal array method, one of fractional factorial design has been used to study effects of main cutting parameters such as cutting speed, feed rate and depth of cut, on the surface roughness. The evaluation of chip breakability is used the chip breaking index(C$\sub$B/), non-dimensional parameter. And the analysis of variance (ANOYA)-test has been used to check the significance of cutting parameters. Using the result of ANOYA-test, the experimental equation of chip breakability, which consists of significant cutting parameters, has been developed. The coefficient of determination of this equation is 0.866.

• 한국자동차공학회논문집
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• 제3권2호
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• pp.62-76
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• 1995

The safety analysis becomes very essential in the crash environment with the growth of automobile industry. Recently, an airbag system is required to protect the occupant. The effects of an airbag can be evaluated exactly from the barrier or sled test which is quite expensive. The airbag system in a passenger car is analyzed with the occupant analysis program. The modeling of the passenger car including an airbag is established and the results are verified by comparisons with real crash tests. However, the solution of an airbag design can not be obtained easily with the conventional method such as an optimization due to the nonlinearity and complexity of the problem. An iterative design algorithm using the orthogonal array is proposed to overcome the difficulties. The design trend of an airbag is recommended to minimize the injury of an occupant with the proposed design algorithm and the results are discussed.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2004년도 제22회 춘계학술대회논문집
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• pp.601-604
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• 2004

Precise position and attitude control of pico-satellite requires huge number of impulses of the order of 10$^{-6}$ Ns. MEMS solid rocket array is a promising propulsion system but the higher degree of miniaturization causes unreliable operation mainly due to quenching. In order to breakthrough this situation, a novel design of solid micro-rocket is proposed, which generates tiny impulses repetitively from a single rocket not from array. This unique micro-rocket is based on the utilization of quenching, which causes propellant reaction to sustain only in a small area. A test chip of a micro solid propellant tank and micro heater array is fabricated and ignition test is conducted. Obtained results show the feasibility of this concept and future direction of this quenching-based propulsion is discussed.