• 제목/요약/키워드: Ar-$H_2$

검색결과 960건 처리시간 0.027초

$\textrm{Ta}(\textrm{OC}_{2}\textrm{H}_{5})_{5}$$\textrm{NH}_3$를 이용한 산화탄탈륨 막의 원자층 증착 및 특성 (Atomic Layer Deposition and Characterization of Tantalum Oxide Films Using Ta(OC2H5)5 and $\textrm{NH}_3$)

  • 송현정;심규찬;이춘수;강상원
    • 한국재료학회지
    • /
    • 제8권10호
    • /
    • pp.945-949
    • /
    • 1998
  • Ta(OC2H5)5와 NH3를 이용하여 Cycle-CVD법으로 산화탄탈륨 막을 증착하였다. Cycle-CVD법에서는 Ta(OC2H5)5와 NH3사이에 불활성 기체를 주입한다. 하나의 cycle은 Ta(OC2H5)5주입, Ar주입, NH3 주입, Ar 주입의 네 단계로 이루어진다. Cycle-CVD법으로 산화탄탈륨 막을 증착할 때, 온도 $250-280^{\circ}C$에서 박막의 증착 기구는 원자층 증착(Atomic Layer Deposition:ALD)이었다. $265^{\circ}C$에서 Ta(OC2H5)5:Ar:NH3:Ar:NH3:Ar의 한 cycle에서 각 단계의 주입 시간을 1-60초:5초:5초:5초로 Ta(OC2H5)5 주입 시간을 변화시키면서 산화탄탈륨 막을 Cycle-CVD법으로 증착하였다. Ta(OC2H5)5주입시간이 증가하여도 cycle 당 두께가 $1.5\AA$/cycle로 일정하였다. $265^{\circ}C$에서 증착된 박막의 누설 전류는 2MV/cm에서 2x10-2A/$\textrm{cm}^2$이었고 열처리후의 산화탄탈륨 막의 누설 전류값은 $10-4A\textrm{cm}^2$ 이하고 감소하였다. 증착한 산화탄탈륨 막의 성분을 Auger 전자 분광법으로 분석하였다. 2$65^{\circ}C$에서 증착한 막의 성분은 탄탈륨 33at%, 산소 50at%, 탄소 5at%, 질소 12at% 이었으며 90$0^{\circ}C$, O2300torr에서 10분 동안 열처리한 박막은 탄탈륨 33at%, 산소 60wt%, 탄소 4at%, 질소 3at%이었다. 박막의 열처리 온도가 높을수록 불순물인 탄소와 질소의 박막 내 잔류량이 감소하였다. 열처리 후의 박막은 O/Ta 화학정량비가 증가하였으며 Ta의 4f7/5와 4f 5/2의 결합 강도가 열처리 전 박막보다 증가하였다. 열처리 후 누설 전류가 감소하는 것은 불순물 감소와 화학정량비 개선 및 Ta-O 결합 강도의증가에 의한 것으로 생각된다.

  • PDF

Corrosion of Carbon Steel with and without Aluminized Coating in (O, S, H)-containing Gases at 500-800℃

  • Lee, Dong Bok;Abro, Waheed Ali;Lee, Kun Sang;Abro, Muhammad Ali
    • 한국표면공학회지
    • /
    • 제50권2호
    • /
    • pp.85-90
    • /
    • 2017
  • The carbon steel formed the thick, somewhat porous, loosely adherent iron oxide scale when oxidized at $500-800^{\circ}C$ for 15 h in air. It formed the thicker, more porous, nonadherent scale consisting of FeS plus iron oxides in $Ar/1%SO_2$-mixed gas. It formed the much thicker, more porous, nonadherent scale consisting of FeS plus iron oxides in Ar/0.1% $H_2S$-mixed gas. However, the aluminized carbon steel formed the thin, protective $Al_2O_3$ surface scale even in $Ar/1%SO_2$-, and $Ar/0.1%H_2S$-mixed gas. Aluminizing drastically improved the corrosion resistance in (O, S, H)-containing gas.

Synthesis of ArOTiCl3 complexes and their application for ethylene polymerization and copolymerization

  • Wang, Jianwei;Ren, Yingchun;Xu, Sheng;Mi, Puke
    • Advances in materials Research
    • /
    • 제6권3호
    • /
    • pp.303-316
    • /
    • 2017
  • In this article, novel olefin polymerization catalyst with lower cost and simple synthetic process were developed, $ArOTiCl_3$ complexes [$(2-OMeC_6H_4O)TiCl_3(C1)$, $(2,4-Me_2C_6H_3O)TiCl_3(C2)$, $TiCl_3(1,4-OC_6H_4O)TiCl_3(C3)$, $TiCl_3(1,4-OC_6H_2O-Me_2-2,5)$ $TiCl_3(C4)$] and corresponding $(ArO)_2TiCl_2$ complexes [$TiCl_2(OC_6H_4-OMe-2)_2(C5)$ and $TiCl_2(OC_6H_3-Me_2-2,6)_2(C6)$] have been synthesized by the reaction of $TiCl_4$ with phenol, all these complexes were well characterized with $^1H$ NMR, $^{13}C$ NMR, MASS and EA. When combined with methylaluminoxane (MAO), the $ArOTiCl_3/MAO$ system shows high activity for ethylene copolymerization with 1-octene and copolymer was obtained with broaden molecular weight distribution (MWD). The $^{13}C$ NMR result of polymer indicates that the 1-octene incorporation in polymer reached up to 8.29 mol%. The effects of polymerization temperature, concentration of polymerization monomer and polymerization time on the catalytic activity have been investigated.

Ignition Delay Times in $C_2H_2-O_2$-Ar Mixture behind a Reflected Shock Wave

  • 류지철;서희;강준길;오규형
    • Bulletin of the Korean Chemical Society
    • /
    • 제18권10호
    • /
    • pp.1071-1075
    • /
    • 1997
  • Detonation characteristics of acetylene were studied behind reflected shock waves in the temperature range 800-1350 K by monitoring OH emission and pressure profiles. For a comprehensive measurement of ignition delay time, the mixture composition was varied in a wide range of Ar mole % was varied from 0.625 to 2.5 in stoichiometric ratio of C2H2-O2-Ar. A computer simulation study was also performed to elucidate the important elementary steps determining ignition behavior. The 33-reaction mechanism provides a good agreement in delay time between the observed and the calculated ones.

Effect of Ambient Gases on the Characteristics of ITO Thin Films for OLEDs

  • Lee, Yu-Lim;Lee, Kyu-Mann
    • Transactions on Electrical and Electronic Materials
    • /
    • 제10권6호
    • /
    • pp.203-207
    • /
    • 2009
  • We have investigated the effect of ambient gases on the structural, electrical, and optical characteristics of ITO thin films intended for use as anode contacts in OLED (organic light emitting diodes) devices. These ITO thin films are deposited by radio frequency (RF) magnetron sputtering under different ambient gases (Ar, Ar+$O_2$, and Ar+$H_2$) at $300{^{\circ}C}$. In order to investigate the influences of the oxygen and hydrogen, the flow rate of oxygen and hydrogen in argon mixing gas has been changed from 0.5 sccm to 5 sccm and from 0.01 sccm to 0.25 sccm, respectively. The intensity of the (400) peak in the ITO thin films increased with increasing $O_2$, flow rate whilst the (400) peak was nearly invisible in an atmosphere of Ar+$H_2$. The electrical resistivity of the ITO thin films increased with increasing $O_2$ flow rate, whereas the electrical resistivity decreased sharply under an Ar+$H_2$ atmosphere and was nearly similar regardless of the $H_2$ flow rate. The change of electrical resistivity with changes in the ambient gas composition was mainly interpreted in terms of the charge carrier mobility rather than the charge carrier concentration. All the films showed an average transmittance of over 80% in the visible range. The OLED device was fabricated with different ITO substrates made with the configuration of ITO/$\alpha$-NPD/DPVB/$Alq_3$/LiF/Al in order to elucidate the performance of the ITO substrate. Current density and luminance of OLED devices with ITO thin films deposited in Ar+$H_2$ ambient gas is the highest among all the ITO thin films.

평판 유도 결합형 $CH_4/H_2/Ar$ 플라즈마를 이용한 GaN 건식 식각에서 공정변수가 저항성 접촉 형성에 미치는 영향 (The Effects of Etch Process Parameters on the Ohmic Contact Formation in the Plasma Etching of GaN using Planar Inductively Coupled $CH_4/H_2/Ar$ Plasma)

  • 김문영;태흥식;이호준;이용현;이정희;백영식
    • 대한전기학회논문지:전기물성ㆍ응용부문C
    • /
    • 제49권8호
    • /
    • pp.438-444
    • /
    • 2000
  • We report the effects of etch process parameters on the ohmic contact formation in the plasma etching of GaN. Planar inductively coupled plasma system with $CH_4/H_2/Ar$gas chemistry has been used as etch reactor. The contact resistance and the specific contact resistance have been investigated using transfer length method as a function of RF bias power and %Ar gas concentration in total flow rate. AES(Auger electron spectroscopy) analysis revealed that the etched GaN has nonstoichiometric Ga rich surface and was contaminated by carbon and oxygen. Especially large amount of carbon was detected at the sample etched for high bias power (or voltage) condition, where severe degradation of contact resistance was occurred. We achieved the low ohmic contact of $2.4{\times}10^{-3} {\Omega}cm^2$ specific contact resistance at the input power 400 W, RF bias power 150 W, and working pressure 10mTorr with 10 sccm $CH_4$, 15 sccm H2, 5 sccm Ar gas composition.

  • PDF

볼츠만방정식과 몬테칼로법에 의한 $SiH_4$-Ar 혼합가스의 전자수송계수에 관한 연구 (The Study of Electron Transport coefficients in $SiH_4$-Ar Mixtures by Using Boltzmann Equation Analysis and Monte-Carlo Simulation)

  • 하성철;전병훈
    • 한국전기전자재료학회논문지
    • /
    • 제14권2호
    • /
    • pp.169-174
    • /
    • 2001
  • The electron transport coefficients(the electron drift velocity, W, and the longitudinal and transverse diffusion coefficient, D$_{L}$ and D$_{T}$) in SiH$_4$-Ar mixtures containing 0.5% and 5.0% monosilane were calculated over the E/N range from 0.01 to 300 Td and over the gas pressure range 0.5, 1.0 and 1.5 Torr by the time-of-flight(TOF) method of the Boltzmann equation(BE.) and Monte-Carlo simulation(MCS). The electron energy distribution function in each SiH$_4$-Ar mixtures at E/N=10 Td and L=0.2 cm, which in equilibrium region in the mean electron enregy were compared.red.

  • PDF

$SiH_4-Ar$ 혼합기체의 평균 에너지에 관한 연구 (Analysis of the Mean Energy in $SiH_4-Ar$ Mixture Gases)

  • 김상남
    • 전기학회논문지P
    • /
    • 제55권2호
    • /
    • pp.57-61
    • /
    • 2006
  • This paper calculates and gives the analysis of mean energy in pure $SiH_4,\;Ar-SiH_4$ mixture gases ($SiH_4-0.5[%],\;5[%]$) over the range of $E/N =0.01{\sim}300[Td]$, p = 0.1, 1, 5.0 [Torr] by Monte Carlo the Backward prolongation method of the Boltzmann equation using computer simulation without using expensive equipment. The results have been obtained by using the electron collision cross sections by TOF, PT, SST sampling, compared with the experimental data determined by the other author. It also proved the reliability of the electron collision cross sections and shows the practical values of computer simulation. The calculations of electron swarm parameters require the knowledge of several collision cross-sections of electron beam. Thus, published momentum transfer, ionization, vibration, attachment, electronic excitation, and dissociation cross-sections of electrons for $SiH_4$ and Ar, were used. The differences of the transport coefficients of electrons in $SiH_4$, mixtures of $SiH_4$ and Ar, have been explained by the deduced energy distribution functions for electrons and the complete collision cross-sections for electrons. A two-term approximation of the Boltzmann equation analysis and Monte Carlo simulation have been used to study electron transport coefficients.

Reactive sputtering 법으로 증착된 AZO 박막의 전기적 및 구조적 특성 (Electrical and structural characteristics of AZO thin films deposited by reactive sputtering)

  • 허주희;이유림;이규만
    • 반도체디스플레이기술학회지
    • /
    • 제8권1호
    • /
    • pp.33-38
    • /
    • 2009
  • We have investigated the effect of the ambient gases on the characteristics of AZO thin films for the OLED (organic light emitting diodes) devices. These AZO thin films are deposited by rf-magnetron sputtering under different ambient gases (Ar, Ar+$O_2$, and Ar+$H_2$) at 300. In order to investigate the influences of the oxygen and hydrogen, the flow rate of oxygen and hydrogen in argon mixing gas has been changed from 0.2sccm to 1sccm and from 0.5sccm to 5sccm, respectively. The AZO thin films were preferred oriented to (002) direction regardless of ambient gases. The electrical resistivity of AZO film increased with increasing flow rate of $O_2$ under Ar+$O_2$ while under Ar+$H_2$ atmosphere the electrical resistivity showed minimum value near 1sccm of $H_2$. All the films showed the average transmittance over 80% in the visible range. The OLED device was fabricated with different AZO substrates made by configuration of AZO/$\acute{a}$-NPD/DPVB/$Alq_3$/LiF/Al to elucidate the performance of AZO substrate.

  • PDF

냉음극을 이용한 plasma전자 beam의 전기적 입력특성 I (A Study on Electric Characteristics of Plasma Electon Beam Produced by Cold Cathode.)

  • 전춘생;박용관
    • 전기의세계
    • /
    • 제27권3호
    • /
    • pp.36-42
    • /
    • 1978
  • It has been investigates that electric characteristics of plasma electron beam in N$_{2}$, H$_{2}$ and Ar gas jars under various gas pressures during electron beams are formed. The results are as follows: 1)Electron beam is formed in the region of positive resistance on the characteristic curve. This phenomenon is identical in N$_{2}$, H$_{2}$ and Ar gases. 2)But in Ar gas, electron beam is formed at relatively lower gas pressure than in H$_{2}$ and N$_{2}$. 3)In pure gas either N$_{2}$, H$_{2}$ and N$_{2}$ the lower the gas pressure, the higher the voltage drop for the same electron beam current. 4)The region in which electron beam is formed is limited at a given pressure. 5)Beyond the limit mentioned above, it becomes glow discharge state and the current increases radically. 6)At a given gas pressure, electron beam voltage, that is, electrical power input increases with gap length.

  • PDF