• The Transactions of the Korean Institute of Electrical Engineers P
• /
• v.52 no.1
• /
• pp.9-13
• /
• 2003

Energy Distribution Function in pure $CH_4$, $CF_4$ and mixtures of $CF_4$ and Ar, have been analyzed over a range of the reduced electric field strength between 0.1 and 350[Td] by the two-term approximation of the Boltzmann equation (BEq.) method and the Monte Carlo simulation (MCS). The results of the Boltzmann equation and the Monte Carlo simulation have been compared with the data presented by several workers. The deduced transport coefficients for electrons agree reasonably well with the experimental and simulation data obtained by Nakamura and Hayashi. The energy distribution function of electrons in $CF_4-Ar$ mixtures shows the Maxwellian distribution for energy. That is, $f(\varepsilon)$ has the symmetrical shape whose axis of symmetry is a most probably energy. The measured results and the calculated results have been compared each other.

• The Transactions of the Korean Institute of Electrical Engineers P
• /
• v.60 no.3
• /
• pp.105-109
• /
• 2011

Drift Velocity of Electrons in pure $CF_4$, $CH_4$ and mixtures of $CF_4$ and Ar. Have been analyzed over a range of the reduced electric field strength between 0.1 and 350[Td] by the two-term approximation of the Boltzmann equation (BEq.) method and the Monte Carlo simulation (MCS). The results of the Boltzmann equation and the Monte Carlo simulation have been compared with the data presented by several workers. The deduced transport coefficients for electrons agree reasonably well with the experimental and simulation data obtained by Nakamura and Hayashi. The energy distribution function of electrons in $CF_4$-Ar mixtures shows the Maxwellian distribution for energy. That is, f(${\varepsilon}$) has the symmetrical shape whose axis of symmetry is a most probably energy. The measured results and the calculated results have been compared each other.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.16 no.5
• /
• pp.378-384
• /
• 2003

Etching species in CF$_4$/Ar plasma and the behavior of etching rate of Bi$_4$-$_{x}$L$_{x}$rTi$_3$O$_2$ (BLT) films were investigated in inductively coupled plasma (ICP) reactor in terms of etch parameters. The etching rate as functions of CF$_4$ contents showed the maximum 803 $\AA$/min at 20% CF$_4$ addition in CF$_4$/Ar plasma. The increase of RF power and DC bias voltage caused to an increase of etch rate. The variation of relative volume densities for F and he atoms were measured with the optical emission spectroscopy (OES). The chemical states of BLT were investigated with using X-ray photoelectron spectroscopy (XPS). XPS narrow scan analysis shows that La-fluorides remained on the etched surface. The presence of maximum etch rate at CF$_4$(20%)/Ar(80%) may be explained by the concurrence of two etching mechanisms such as physical sputtering and chemical reaction. The roles of he ion bombardment include destruction of metal (Bi, La, Ti)-O bonds as well as assistant for chemical reaction of metals with fluorine atoms.oms.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.08a
• /
• pp.91-91
• /
• 2010

본 논문은 펄스 직류전원 (Pulse DC) 플라즈마 소스와 반응성 가스인 $CF_4$와 불활성 가스인 Ar를 혼합하여 산업에서 널리 사용되는 유기고분자인 Polymethylmethacrylate (PMMA), Polyethylene terephthalate (PET), 그리고 Polycarbonate (PC) 샘플을 건식 식각한 결과에 대한 것이다. 각각의 샘플은 감광제 도포 후에 자외선을 조사하는 포토레지스트 방법으로 마스크를 만들었다. 펄스 직류전원 플라즈마 시스템을 사용하면 다양한 변수를 줄 수 있다는 장점이 있다. 공정 변수는 Pulse DC Voltage는 300 - 500 V, Pulse DC reverse time $0.5{\sim}2.0\;{\mu}s$, Pulse DC Frequency 100~250 kHz 이었다. 변수 각각의 값이 높아질수록 고분자의 식각률이 높아졌다. 특히, PMMA의 식각률이 가장 높았으며 PET, PC 순이었다. 샘플 중 PC의 식각률이 가장 낮은 이유는 고분자 결합 중에 이중결합의 벤젠 고리 모양을 포함하고 있어 분자 결합력이 비교적 높기 때문으로 사료된다. 기계적 펌프만을 사용한 공정 전 압력은 30 mTorr이었다. 쓰로틀 밸브를 완전 개방한 상태에서 식각 공정 중 진공 압력은 $CF_4$ 가스유량이 늘어날수록 증가하였다. 식각률 역시 $CF_4$ 가스유량(총 가스 유량은 10 sccm)이 많을수록 증가함을 보여주었다 (PMMA: 10 sccm $CF_4$에서 330 nm/min, 3.5 sccm $CF_4$/6.5 sccm Ar에서 260 nm/min., PET: 10 sccm $CF_4$에서 260 nm/min, 3.5 sccm $CF_4$/6.5 sccm Ar에서 210 nm., PC: 10 sccm $CF_4$에서 230 nm, 3.5 sccm $CF_4c$/6.5 sccm Ar에서 160 nm). 이는 펄스 직류전원 플라즈마 식각에서 $CF_4$와 Ar의 가스 혼합비를 조절함으로서 고분자 소재의 식각률을 적절히 변화시킬 수 있다는 것을 의미한다. 표면 거칠기는 실험 후 표면단차 측정기와 전자 현미경 등을 이용하여 식각한 샘플의 표면을 측정하여 알 수 있었다. 실험전 기준 샘플 표면 거칠기는 PMMA는 1.53nm, PET는 3.1nm, PC는 1.54nm 이었다. 식각된 샘플들의 표면 거칠기는 PMMA는 3.59~10.59 nm, PET은 5.13~11.32 nm, PC는 1.52~3.14 nm 범위였다. 광학 발광 분석기 (Optical emission spectroscopy)를 이용하여 식각 공정 중 플라즈마 발광특성을 분석한 결과, 탄소 원자 픽 (424.662 nm)과 아르곤 원자 픽 (751.465 nm, 763.510 nm)의 픽의 존재를 확인하였다. 이 때 탄소 픽은 $CF_4$ 가스에서 발생하였을 것으로 추측한다. 본 발표를 통해 펄스 직류전원 $CF_4$/Ar의 고분자 식각 결과에 대해 보고할 것이다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2000.04b
• /
• pp.52-55
• /
• 2000

In this study, (Ba,Sr)$TiO_3$(BST) thin films were etched with a magnetically enhanced inductively coupled plasma(MEICP) as a function Ar/$CF_4$ gas mixing ratio. Experiment was done by varying the etching parameters such as rf power, dc bias voltage and chamber pressure. The maximum etch rate of the BST films was 1700 ${\AA}/min$ under $CF_4/(CF_4+Ar)$ of 0.1, 600 W/350 V and 5 mTorr. The selectivity of BST to Pt and PR was 0.6, 0.7, respectively. X -ray photoelectron spectroscopy(XPS) studies shows that there are surface reaction between Ba, Sr, Ti and C, F radicals during the etching. To analyze the composition of surface residue remaining after the etching, films etched with different $CF_4$/Ar gas mixing ratio were investigated using XPS.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.1504-1507
• /
• 2009

In this paper, the etching behavior of ZnO in $CF_4$ plasma mixed Ar was investigated. Previously, the etch rate in $CF_4$/Ar plasma was reported that it is slower than that in Cl containing plasma. But, plasma included Cl atom can produce the by-product such as $ZnCl_2$. In order to solve this film contamination, no Cl containing etching gas is required. We controlled the etching parameter such as source power, substrate bias power, and $CF_4$/Ar gas ratio to acquire the fast etch rate using a ICP etcher. We accomplished the etching rate of 144.85 nm/min with the substrate bias power of 200W. As the energetic fluorine atoms were bonded with Zinc atoms, the fluoride zinc crystal ($ZnF_2$) was observed by X-ray photoelectron spectroscopy (XPS).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1998.06a
• /
• pp.279-283
• /
• 1998

The electron swarm parameters in the$CF_4$(O.l%, 5%)+Ar mixtures are measured by time of flight method over the E/N(Td) range from 10 to 300LTdl. A two-term approximation of the Boltzmann equation analysis and Monte Carlo simulation have been also used to study electron transport coefficients. We have calculated W, NDL, NDT, $\alpha$ and the limiting breakdown electric field to gas mixtures ratio in pure $CF_4$ gas and$CF_4+Ar$ mixtures. The measured results and the calculated results have been compared each other paper.

• Proceedings of the KIEE Conference
• /
• 1999.07d
• /
• pp.1550-1552
• /
• 1999

In this study, (Ba,Sr)$TiO_3$ thin films were etched with a magnetically enhanced inductively coupled plasma (MEICP) as a function $CF_4$/Ar gas mixing ratio. Experimental was done by varying the etching parameters such as rf power, dc bias and chamber pressure. The maximum etch rate of the BST films was $1700{\AA}$/min under $CF_4/(CF_4+Ar)$ of 0.1, 600W/350V and 5 mTorr. The selectivity of BST to Pt and PR was 0.6, 0.7, respectively. X-ray photoelectron spectroscopy (XPS) studies shows that there are surface reaction between Ba, Sr, Ti and C, F radicals during the (Ba,Sr)$TiO_3$ etching. To analysis the composition of surface residue remaining after the etching, films etched with different $CF_4$/Ar gas mixing ratio were investigated using XPS.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.07b
• /
• pp.1179-1182
• /
• 2004

This paper describes the information for quantitative simulation of weakly ionized plasma. In previous paper, we calculated the electron transport coefficients in $CF_4+Ar$ gas mixture by using two-term approximation of Boltzmann equation. but there is difference between the result of the two-term and the multi-term approximation of the Boltzmann equation in $CF_4$ gas. Therefore, in this paper, we calculated the electron drift velocity (W) in $CF_4+Ar$ gas mixture for range of E/N values from $0.01\sim500[Td}$ at the temperature was 300[K] and pressure was 1[Torr] by multi-term approximation of the Boltzmann equation by Robson and Ness. The results of two-term and multi-term approximation of the Boltzmann equation has been compared with each other for a range of E/N.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.11b
• /
• pp.217-220
• /
• 2001

The possibility of cerium dioxide $(CeO_2)$ thin films as insulators of metal erroelectric insulator semiconductor (MFIS) structures have been studied. The etching $CeO_2$ thin films have been perfonned in an inductively coupled $Cl_{2}/CF_{4}/Ar$ plasma. The high etch rate of the $CeO_2$ thin film was $250\AA /m$ at a 10 % addition of $Cl_2$ into the $Ar(80)/CF_{4}(20)$. The surface reaction of the etched $CeO_2$ thin films was investigated using X-ray photoelectron spectroscopy (XPS) analysis. There are Ce-Cl and Ce-F bonding by chemical reaction between Cl, F and Ce. These products can be removed by the physical bombardment of incident Ar ions.