• 제목/요약/키워드: Analysis of electronic circuits

검색결과 152건 처리시간 0.024초

실습능력 향상을 위한 전자 설계교육에 대한 연구 (A Study on the Improving Practical Education for Electronic Design Ability)

  • 이원석;안태원
    • 전자공학회논문지
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    • 제51권9호
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    • pp.223-228
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    • 2014
  • 본 논문에서는 학과 교과과정의 이론을 바탕으로 하여, 개선된 트레이닝 키트를 기반으로 한 전자 설계 실습능력 향상교육에 대하여 다룬다. 학생들은 개선된 전자 설계 프로젝트 실습교육을 통하여 회로의 이해력 및 분석력을 키우고, 전자부품의 조립 및 측정 등으로 실무와 밀접한 프로세스를 익히게 된다. 본 논문에서 제시하는 실습교육 방안은 회로의 분석력과 이해력 증대 및 회로 제작의 성취감과 자신감을 증대시킬 수 있을 것으로 생각되며, 학생들의 창의적 전자 설계 프로젝트 실습교육에 효과적으로 활용될 수 있을 것으로 기대된다.

사출성형기 유압시스템의 특성 검토를 위한 해석 모델 개발 (Development of Analysis Model for Characteristics Study of Fluid Power Systems in Injection Molding Machine)

  • 장주섭
    • 유공압시스템학회논문집
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    • 제8권4호
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    • pp.1-8
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    • 2011
  • Injection molding machine is the assembly of many kinds of mechanical and fluid power part and electro-electronic control system. From in these, fluid power is a part where becomes the first core of this machine. Fluid power systems of injection molding machine are modelled and analyzed using a commercial program AMESim. The analysis model which is detailed about the parts applied a publishing catalog data. Sub system models which is divided according to functional operation are made and its analysis results shows how design parameters work on operational characteristics like displacement, pressure, flow rates at each node and so on. Total fluid power circuit model is also made and analyzed. The results made by analysis will be used design of fluid power circuit of injection molding machine.

이색 사출성형기 개발을 위한 유압시스템의 특성 검토 (Characteristics Analysis of the Fluid Power System for a Double-color Injection Molding Machine Development)

  • 장주섭
    • 유공압시스템학회논문집
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    • 제8권4호
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    • pp.24-31
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    • 2011
  • Double-color Injection molding machine is the assembly of many kinds of mechanical, fluid power part and electric electronic control system. From in these, fluid power is a part where becomes the first core of this machine. Fluid power systems of double-color injection molding machine are modelled and analyzed using a commercial program AMESim. Partial system models which is divided according to functional operation are made and its analysis results shows how design parameters work on operational characteristics like pressure, flow rates, displacement at each node and so on. Analysis modeling and compared the data which gets from experiment and the analysis result which has a reliability got data. The results made by analysis will be used design of fluid power circuit for developing a double-color injection molding machine.

Prediction of Change in Equivalent Circuit Parameters of Transformer Winding Due to Axial Deformation using Sweep Frequency Response Analysis

  • Sathya, M. Arul;Usa, S.
    • Journal of Electrical Engineering and Technology
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    • 제10권3호
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    • pp.983-989
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    • 2015
  • Power transformer is one of the major and key apparatus in electric power system. Monitoring and diagnosis of transformer fault is necessary for improving the life period of transformer. The failures caused by short circuits are one of the causes of transformer outages. The short circuit currents induce excessive forces in the transformer windings which result in winding deformation affecting the mechanical and electrical characteristics of the winding. In the present work, a transformer producing only the radial flux under short circuit is considered. The corresponding axial displacement profile of the windings is computed using Finite Element Method based transient structural analysis and thus obtained displacements are compared with the experimental result. The change in inter disc capacitance and mutual inductance of the deformed windings due to different short circuit currents are computed using Finite Element Method based field analyses and the corresponding Sweep Frequency Responses are computed using the modified electrical equivalent circuit. From the change in the first resonant frequency, the winding movement can be quantified which will be useful for estimating the mechanical withstand capability of the winding for different short circuit currents in the design stage itself.

단일 및 결합형 구조의 마이크로 스트립 전송선로에서 고속 펄스 신호의 왜곡 특성 분석 (An Analysis of the Distortions of High Speed Pulse Signal on the Microstrip Lines of the Single and Coupled Structures)

  • 김기래
    • 한국전기전자재료학회논문지
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    • 제15권6호
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    • pp.529-534
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    • 2002
  • Recently, As the higher frequency in clock of digital system being demanded and the density of circuits gets high for purpose of making light and minimizing system, the study for solution of digital signal distortion being interested. In this paper, the distortion of square pulse caused by dispersion as it propagates along a single microstrip line and crosstalk between lines on the Multi-Transmission Lines (MTL) is investigated. The dispersion and crosstalk of pulse signals is analyzed regarding to the structure of transmission line such as relative permittivity, substrate height, strip width of the microstrip line and pulse width of signal pulse.

Quantitative Evaluation Method for Etch Sidewall Profile of Through-Silicon Vias (TSVs)

  • Son, Seung-Nam;Hong, Sang Jeen
    • ETRI Journal
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    • 제36권4호
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    • pp.617-624
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    • 2014
  • Through-silicon via (TSV) technology provides much of the benefits seen in advanced packaging, such as three-dimensional integrated circuits and 3D packaging, with shorter interconnection paths for homo- and heterogeneous device integration. In TSV, a destructive cross-sectional analysis of an image from a scanning electron microscope is the most frequently used method for quality control purposes. We propose a quantitative evaluation method for TSV etch profiles whereby we consider sidewall angle, curvature profile, undercut, and scallop. A weighted sum of the four evaluated parameters, nominally total score (TS), is suggested for the numerical evaluation of an individual TSV profile. Uniformity, defined by the ratio of the standard deviation and average of the parameters that comprise TS, is suggested for the evaluation of wafer-to-wafer variation in volume manufacturing.

″High frequency and high speed microelectronics based on the $A_{3}B_{5}$- semiconductor compounds in the republics of the former USSR. Present state and prospects for future″

  • Mokerov, V.G.;Matveev, Yu.A.;Temnov, A.M.;Kitaev, M.A.
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1998년도 춘계학술대회 논문집
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    • pp.457-460
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    • 1998
  • Present paper is devoted to the brief analysis of the present state and the prospects for the future of technology of the high frequency devices and high speed integrated circuits based on the $A_{3}B_{5}$ semiconductor compounds, including the $A_{3}B_{5}$-heterostructures, in the republics of the former USSR. tunneling quantum well-structures were widely used.

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주파수 의존성에 따른 고분자 LED의 유전 분산 거동에 관한 연구 (AC dielectric response of poly(p-phenylenevinylene) light emitting devices)

  • 이철의;김세헌;장재원;김상우
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 추계학술대회 논문집
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    • pp.149-152
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    • 2000
  • AC impedance measurements on poly-p-phenylenevinylene (PPV) LEDs in the frequency range between 10 Hz and 10$\^$6/ Hz were carried out. The complex-plane impedance spectra indicate that PPV devices can be represented by equivalent circuits that corresponds to the bulk and interfacial regions at high and low frequencies, respectively. As a result of complex impedance analysis through the separation of bulk and interfacial region impedances, increase of forward bias in Al/PPV/ITO devices gave rise to relative decrease of the interfacial region impedance. Above the electric field of 10$\^$6/ V/cm the PPV device showed a space charge limited current (SCLC) conduction. The dependence of the transport mechanism and dielectric properties on the applied bias voltage is discussed.

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지능형 포탄의 저 감속 회수장치를 이용한 포탄의 감속방법 (Deceleration Method of Munition to used Soft Recovery System for Smart Munition)

  • 김명구;조종두;이승수;유일용
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2007년도 춘계학술대회논문집
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    • pp.191-196
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    • 2007
  • With the development of micro electronic circuits and optical equipment, the demand for developing smart munitions with the ability to autonomously search for and attack targets has increased. Since the electronic components within smart munitions are affected by high temperatures, pressure, and impulsive forces upon the combustion of gunpowder, stability and reliability need to be secured for them. Securing those stability and reliability requires soft recovery system which can decelerate smart munitions. A theoretical analysis of flow is performed for the secure recovery of bullets on the basis of Navier-Stokes equation for compressible fluids. The inner pressure on a pressure tube, the speeds of bullets, and the deceleration of munitions are calculated theoretically. Theoretical results are compared with the data from the experiment with soft recovery system set up at the laboratory.

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Reverse Engineering을 이용한 $Al_{x}Ga_{1-x}As/In_{y}Ga_{1-y}$As P-HEMTs의 구조적 분석 (Structural analysis of $Al_{x}Ga_{1-x}As/In_{y}Ga_{1-y}$As P-HEMTs reverse engineering)

  • 김병헌;황광철;안형근;한득영
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.255-258
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    • 2001
  • In this paper, DC and small signal characteristics with different physical parameters are expected for p-HEMTs (Pseudomorphic High Electron Mobility Transistors) with different temperatures ranging from 300K to 623K which are widely used for a low noise and/or ultra high frequency device. A device of 0.2$\times$200 ${\mu}{\textrm}{m}$$^2$dimension having very low noise has been chosen to extract the experimental data. Theoretical prediction has been obtained using a simulaor(HELENA) which needs experimental input data extracted from reverse engineering process. From the results, relation between structural parameters and temperature dependency of electrical characteristics are qualitatively explained to use in the design of descrete and integrated circuits to guarantee the optimal operation of the system.

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