• 대한치과보철학회지
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• 제31권3호
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• pp.317-349
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• 1993

This study investigated the effect of filler particle size and weight% on mechanical properties of dental core porcelain. In alumina, variation in particle size and weight% and in zirconia, variation in weight%, all specimens were tested three-point bending strength, transmittance, thermal expansion coefficient, porosity and shrinkage and observed with SEM and analysed with X-ray diffractometer. In order to develop shrink-free porcelain, after firing alumina only, glass wasinfiltrated. And aluminum was added to alumina with the expanding character of aluminum oxidize into alumina, and was followed by second firing of glass infiltration procedure. Then mechanical properties were observed. The results of this study were obtained as follows. 1. The bending strength of zirconia was higher than that of alumina, and $5{\mu}m$ alumina had highest strength in variation of particle size of alumina. Except for $5{\mu}m$ alumina, increased with weight%, bending strength increased up to 80% and decreased at 90%. In case of glass infiltration, bending strength was slight higher than 80% and 90% of $5{\mu}m$ alumina. 2. Transmittance increased with increase of shrinkage, decrease of porosity, and with increase of filler size and had no direct correlation with weight%. 3. Thermal expansion coefficient of alumina group was $7.42\sim8.64\times10^{-6}/^{\circ}C$ and that of zirconia group was $9.83\sim12.11\times10^{-6}/^{\circ}C$ and the latter was higher than the former. 4. In x-ray diffraction analysis, alumina group and zirconia group increased $Al_2O_3$ peak and $t-ZrO_2$ peak with increase of weight%. The second phase(cristobalite peak) was observed in zirconia 40% group. 5. Porosity of zirconia was lower than that of alumina and $5{\mu}m$ alumina group had many pores with SEM. In case of low filler content, fracture occurred in glass and high filler content, in glass and filler. In case of aluminum addition to alumina, small oxidised aluminum was observed. 6. Zirconia group had high shrinkage than alumina group, and mixed group of alumina group had high shrinkage. In case of glass infiltration, shrinkage decreased and aluminum addition to alumina group was almost shrink-free.

• 한국세라믹학회지
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• 제35권12호
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• pp.1308-1315
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• 1998

Effects of particle size of alumina on densification behavior during liquid-phase sintering of alumina-talc system were investigated with emphasis on particle rearrangement process. In the case of using coarse alu-mina powder densiication of specimens was rapidly accelerated after formation of liquid phase due to easy particle rearrangement process with addition of talc and increase of sintering temperature. On the contrary when fine alumina powder was used premature densification of alumina matrix region formed before for-mation of liquid phase rigid skeleton structure and then it seemed to inhibit rearrangement process during crease of sintering temperature. As results the densification of specimens using coarse alumina powder was higher than that of the case of using fine one.

• 한국세라믹학회지
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• 제37권7호
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• pp.617-624
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• 2000

Abnormal grain growth in alumina was investigated during sinter-HIP process for better understanding of pressure effect on microstructural development. Abnormal grain growth of monolithic alumina was observed near surface region rather than interior region of specimen. Finite element analysis was used to estimate the pressure distribution developed in the specimen. Pressure distribution analysis was in good agreement with grain size distributjion in the specimen. The results of finite element analysis provided that abnormal grain growth monolithic alumina was resulted from the inhomogeneous pressure distribution in the specimen. MgO addition in alumina was effective for the suppression of abnormal grain growth in alumina under inhomogeneous pressure distribution during sinter-HIP process.

• 대한치과보철학회지
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• 제38권5호
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• pp.595-605
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• 2000

Dental ceramics have good aesthetics, biocompatibility, low thermal conductivity, abrasion resistance, and color stability. However poor resistance to fracture and shrinkage during firing process have been limiting factors in their use, particularly in multiunit ceramic restorations. A new method for making all-ceramic crowns that have high strength and low processing shrinkage has been developed and is referred to as the Vita In-Ceram method. This study was performed to investigate the effect of $CeO_2$ addition in borosilicate glasses on the strength of alumina-glass composites. Porous alumina compacts were prepared by slip casting and sintered at $1,100^{\circ}C$ for 2 hours. Dense composites were made by infiltration of molten glass into partially sintered alumina at $1,140^{\circ}C$ for 4 hours. Specimens were polished sequentially from #800 to #2000 diamond disk. and the final surface finishing on the tensile side was received an additional polishing sequence through $1{\mu}m$ diamond paste. Biaxial flexure test was conducted by using ball-on-three-ball method at a crosshead speed of 0.5mm/min. To examine the microstructural aspect of crack propagation in the alumina-glass composites, Vickers-produced indentation crack was made on the tensile surface at a load of 98.0 N and dwell time of 15 sec, and the radial crack patterns were examined by an optical microscope and a scanning electron microscope. The results obtained were summarized as follows; 1. The porosity rates of partially sintered alumina decreased with the rising of firing temperature. 2. The maximum biaxial flexure strength of 423.5MPa in alumina-glass composites was obtained with an addition of 3 mol% $CeO_2$ in glass composition and strength values showed the aspect of decrease with the increase of $CeO_2$ content. 3 The biaxial flexure strength values of alumina-glass composites were decreased with rising the firing temperature. 4. Observation of the fracture surfaces of alumina-glass composites indicated that the enhancement of strength in alumina-glass composites was due to the frictional or geometrical inter-locking of rough fracture surfaces and ligamentary bridging by intact islands of materials left behind the fracture front.

• The Korean Journal of Ceramics
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• 제1권2호
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• pp.96-100
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• 1995

Recently, alumina/glass composites have been applied as a substrate material for hybrid IC and LSI multi-chip packaging. In this study, the characterization of sodium borosilicate glasses containing NaF and $AlF_3$ and the preparation of the resulted glass/alumina composites have been examined and the effect of the addition of fluorides on the thermal. and dielectric properties of the sintered composites have been studied. The sintering temperature of specimens was lowered by about 100-$150^{\circ}C$ by the addition of fluorine compared with the specimens without fluorine. The specimens containing fluorine showed slightly lower dielectric constants than those of the specimens without fluorine.

• 한국전기전자재료학회논문지
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• 제31권7호
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• pp.496-501
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• 2018

In this study, we prepared 40, 45, 50, 55, 60, 65, and 70 wt% content composites filled in epoxy matrix for two micro silica and three micro alumina types for use as a GIS heavy electric machine. As a filler type of epoxy composite, micro silica composites showed excellent AC breakdown strength properties compared to micro alumina composites in the case of electrical properties of micro silica and alumina. The electrical breakdown properties of micro silica composites increased with increasing filler content, whereas those of micro alumina decreased with increasing filler content. In the case of mechanical properties, the micro silica composite showed improved tensile strength and flexural strength compared with the micro alumina composite. In addition, mechanical properties such as tensile strength and flexural strength of micro silica and alumina composites decreased with increasing filler content. This is probably because O-H groups are present on the surface of silica in the case of micro silica but are not present on the surface of alumina in the case of micro alumina.

• 한국분말재료학회지
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• 제30권3호
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• pp.249-254
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• 2023

The influence of MgO addition on the densification and microstructure of alumina (Al₂O₃) was studied. Compacted alumina specimens were manufactured using ball-milling and one-directional pressing followed by sintering at temperatures below 1700℃. Relative density, shrinkage, hardness, and microstructure were investigated using analytical tools such as FE-SEM, EDS, and XRD. When the MgO was added up to 5.0 wt% and sintered at 1500℃ and 1600℃, the relative density exhibited an average value of 97% or more at both temperatures. The maximum density of 99.2% was with the addition of 0.5 wt% MgO at 1500℃. Meanwhile, the specimens showed significantly lower density values when sintered at 1400℃ than at 1500℃ and 1600℃ owing to the relatively low sintering temperature. The hardness and shrinkage data also showed a similar trend in the change in density, implying that the addition of approximately 0.5 wt% MgO can promote the densification of Al₂O₃. Studying the microstructure confirmed the uniformity of the sintered alumina. These results can be used as basic compositional data for the development of MgO-containing alumina as high-dielectric insulators.

• 한국세라믹학회지
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• 제36권10호
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• pp.1040-1047
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• 1999

After alumina sol was prepared by Yoldas process supported membranes were fabricated by adding ce and Re solution and SiO2 sol into alumina sol. The particle size of alumina sol was 11 nm and it was monodispersed transparent and stable for long time. The pore size of un-doped membrane started to increase to about 7,5nm at 1000$^{\circ}C$ and it was grown to twice (about 15nm) at 1100$^{\circ}C$ However the pore size of doped alumina was uniform to 1100$^{\circ}C$. The effect of retardation of grain growth was superior in SiO2 addition to that of Ce and Ru Because SiO2 doped samples transformed to needed-like phase and densified at 1200$^{\circ}C$ their application in membranes was limited. Ce and Ru doped sample showed vermicular structure identical to the un-doped ones at 1200$^{\circ}C$ But the particle size was smaller than that of un-doped ones.

• 마이크로전자및패키징학회지
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• 제24권2호
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• pp.11-15
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• 2017

실리콘 칩을 적층하는 3D 멀티 플립칩 패키지의 경우 방열문제가 대두됨에 따라 접착 접합부의 열전도도 향상이 요구되고 있다. 본 연구에서는 플립칩 본딩용 비전도성 접착제(NCP)에 있어서 알루미나 필러의 첨가가 NCP의 물성 및 열전도도에 미치는 영향을 조사하였다. 알루미나 필러는 미세피치 플립칩 접속을 위해 평균입도 400 nm의 미세분말을 사용하였다. 알루미나 필러 함량이 0~60 wt%까지 증가함에 따라 60 wt% 첨가 시 0.654 W/mK에 도달하였다. 이는 동일 첨가량 실리카의 0.501 W/mK보다는 높은 열전도도이지만, 동일 함량의 조대한 알루미나 분말을 첨가한 경우에 비해서는 낮은 열전도도로, 미세 플립칩 본딩을 위해 입도가 미세한 분말을 첨가하는 것은 열전도도에 있어서는 불리한 효과로 작용함을 알 수 있었다. NCP의 점도는 40 wt% 이상에서 급격히 증가하는 현상을 나타내었는데, 이는 미세 입도에 따른 필러 간 상호작용의 증가에 기인하는 것으로, 미세피치 플립칩 본딩을 위해 열전도도가 우수한 미세 알루미나 분말을 사용하기 위해서는 낮은 점도를 유지하면서 필러 첨가량을 증가시킬 수 있는 분산방안이 필요한 것으로 판단되었다.

• 한국재료학회지
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• 제9권9호
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• pp.900-904
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• 1999

TiO$_2$분말을 $Al_2$O$_3$분말에 대하여 무게비로 1,3,5,7,9와 11wt%로 혼합하여 알루미나 세라믹스의 미세조직 및 기계적 물성변화를 관찰하였다. TiO$_2$분말의 첨가량이 증가할수록 부피비중은 3.26에서 2.90g/㎤으로 감소하였으며 기공율은 TiO$_2$분말의 첨가량이 7wt%까지는 감소하였으나 9wt%이상 첨가할 경우 증가하였다. 압축강도 측정 결과 파괴강도는 TiO$_2$분말의 첨가량이 7wt%까지는 증가하였으나 9wt%이상 첨가할 경우 감소하였다. 3점 곡강도를 측정한 결과 최대 파괴 응력 값은 TiO$_2$분말의 첨가량이 증가할수록 감소하였다.