• 제목/요약/키워드: Aligner

검색결과 83건 처리시간 0.028초

Micro-computed tomography evaluation of general trends in aligner thickness and gap width after thermoforming procedures involving six commercial clear aligners: An in vitro study

  • Palone, Mario;Longo, Mattia;Arveda, Niki;Nacucchi, Michele;De Pascalis, Fabio;Spedicato, Giorgio Alfredo;Siciliani, Giuseppe;Lombardo, Luca
    • 대한치과교정학회지
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    • 제51권2호
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    • pp.135-141
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    • 2021
  • Objective: To assess the effects of thermoforming on aligner thickness and gap width in six aligner systems with the same nominal thickness. Methods: Six passive upper aligners of different brands were adapted to a single printed cast. Each sample was evaluated with high-resolution micro-computed tomography. To investigate aligner thickness and gap width, two-dimensional (2D) analysis was conducted assessing the effects of the following variables: tooth type (central incisor, canine, and first molar), 2D reference points, and aligner type. Data were analyzed and compared using analysis of variance and Tukey's post-hoc tests (p < 0.05). Results: Tooth type, dental region, and aligner type affected both the gap width and aligner thickness. The aligner thickness remained moderately stable across the arch only in the F22. Conclusions: All thermoformed samples displayed smaller aligner thickness and gap width at anterior teeth and both gingival and coronal centers than at posterior teeth and occlusal surfaces.

NiTi 호선을 이용한 초기 배열 후 디지털 방식 투명교정장치의 적용 (Digital fabrication and application of clear aligner after alignment with NiTi archwires)

  • 임성훈
    • 대한치과의사협회지
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    • 제54권7호
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    • pp.551-562
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    • 2016
  • 경미한 I급 부정교합의 경우, 회전 및 경사 조절은 먼저 NiTi 호선을 사용하여 달성한 후, 순설 이동 및 약간의 수직 조절은 투명교정장치로 이루는 방법을 선택할 수 있다. 이때 tooth capture가 잘 안 되는 부위에서는 slingshot 또는 수직 고무줄을 사용하여 보완할 수 있다.

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세라핀 투명교정창지를 이용한 포괄적 교정치료 증례 보고 (Case report: Comprehensive orthodontic treatment with Serafin clear aligner system)

  • 김도훈;장원건
    • 대한심미치과학회지
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    • 제30권1호
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    • pp.13-23
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    • 2021
  • 현재 치아 교정 분야에서 투명교정의 중요성이 점점 더 부각되고 치아 교정 시장에서의 점유율도 점점 높아지고 있다. 현재 세계 1등 기업이 전 세계 시장의 대부분을 차지하고 있고 수많은 후발 주자들이 제품 개발에 많은 공을 들이고 있다. 국내에서도 많은 회사에서 투명 교정 시스템을 개발하고 있고 그 중에 세라핀 투명 교정 시스템은 세계 1등 기업의 제품과 마찬가지로 단순한 부분 교정이 아닌 포괄적 교정 치료를 지향하고 있다. 본 증례 보고에서 세라핀 투명 교정 시스템을 이용한 두 증례를 보고하고자 한다.

Aligner 알고리즘 및 제어 (Algorithm and control of aligners)

  • 박종현
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1993년도 한국자동제어학술회의논문집(국내학술편); Seoul National University, Seoul; 20-22 Oct. 1993
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    • pp.981-986
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    • 1993
  • A fast algorithm based upon geometry to measure the wafer center and the position of a wafer fiducial mark is developed and implemented on a single-axis aligner. Design issues for a controller when a National Semiconductor's LM629 is used as a PID controller of an aligner are discussed. Performance of an aligner with the algorithm and a LM629 was measured in experiments. The result shows that it takes about 4.1 seconds on average to align a hot wafer supported by metal pins on the chuck.

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웨이퍼 본딩 공정을 위한 3채널 비전 얼라이너 개발 (Development of The 3-channel Vision Aligner for Wafer Bonding Process)

  • 김종원;고진석
    • 반도체디스플레이기술학회지
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    • 제16권1호
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    • pp.29-33
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    • 2017
  • This paper presents a development of vision aligner with three channels for the wafer and plate bonding machine in manufacturing of LED. The developed vision aligner consists of three cameras and performs wafer alignment of rotation and translation, flipped wafer detection, and UV Tape detection on the target wafer and plate. Normally the process step of wafer bonding is not defined by standards in semiconductor's manufacturing which steps are used depends on the wafer types so, a lot of processing steps has many unexpected problems by the workers and environment of manufacturing such as the above mentioned. For the mass production, the machine operation related to production time and worker's safety so the operation process should be operated at one time with considering of unexpected problem. The developed system solved the 4 kinds of unexpected problems and it will apply on the massproduction environment.

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탄소 나노 튜브-팁 제작을 위한 다자유도 나노 정렬 시스템 개발 (Development of Multi-DOF Nano Aligner System for CNT-Tip)

  • 강경수;이준석;최재성;곽윤근;김수현
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2004년도 춘계학술대회
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    • pp.923-928
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    • 2004
  • AFM tip has been used for surface profiling with a fine resolution, but there is a barrier to improve its performance because of the low aspect ratio. Many researchers have solved this problem with attaching carbon nanotube (CNT) to Si-tip. In this paper, we proposed the aligner system that composed of dual type stage system, and these stages could attach a carbon nanotube to tungsten-tip in vacuum condition. We used tungsten tip instead of Si-tip because of its conductivity. The aligner system proposed in this paper has 10 degree-of-freedom that 3 in the first stage and 7 in the second stage. With picomotors and piezotube, the first stage has the resolution about several tens of nm and the second stage has a resolution about a nm. We experimented on characterization of Nano Aligner System and operated picomotors in SEM environment.

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치열교정환자의 투명 교정장치에 대한 지식 및 자가관리행태 (Knowledge and self care behaviors of orthodontic patients using clear aligner)

  • 황다혜;윤현경;황태윤
    • 한국치위생학회지
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    • 제14권4호
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    • pp.539-545
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    • 2014
  • Objectives : The purpose of the study is to investigate the knowledge and self care behaviors of orthodontic patients using clear aligner. Methods : A total of 181 orthodontic patients using clear aligner in Daegu filled out the self-reported questionnaire from September 6 to October 18, 2010. and 162 subjects completed orthodontic treatment. Results : There existed a significant difference in knowledge and self care behaviors between gender and wearing duration of clear aligner(p<0.01). Treatment duration influenced significantly on the score of self care behaviors(p<0.01) and the high score of self care behavior showed in short duration of treatment. Conclusions : Self care behaviors were closely correlated with treatment duration. An information for the clear aligner will be helpful to improve the knowledge and self care behaviors.

Orthodontic treatment for maxillary anterior pathologic tooth migration by periodontitis using clear aligner

  • Lee, Jun-Woo;Lee, Sang-Joon;Lee, Chang-Kyu;Kim, Byung-Ock
    • Journal of Periodontal and Implant Science
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    • 제41권1호
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    • pp.44-50
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    • 2011
  • Purpose: Pathologic tooth migration (PTM) is a tooth displacement which is derived from imbalance of tooth retention force and is dominantly found out in maxillary anterior area. PTM in maxillary anterior area was tried to corrected with periodontal treatment and a clear aligner in this study and the result was evaluated clinically and radiographically. Methods: For the treatment of a patient with chronic periodontal disease accompanied by maxillary anterior pathologic tooth migration, clear aligner was applied to move teeth after a series of case-related periodontal therapy. Clinically, probing depth, gingival recession, clinical attachment level and mobility were measured pre- and post-treatment, and radiographic examination was performed as well. Results: Clinically, we found the decrease of the probing depth, gingival recession, clinical attachment level and mobility. And we could also acknowledge the reduction of vertical and horizontal dimension on infrabony defect radiographically. However, it is still controversial if there was an actual bone filling. Conclusions: Clear aligner is an effective appliance to move teeth since it costs little in terms of expense and time. In addition, it wraps whole crowns, providing advantages to deal with crowding, spacing, and size of arch. In short, clear aligner could be a useful treatment option for PTM patient, since it provides decreased probing depth, gingival recession, clinical attachment level, mobility and esthetical restoration.

웨이퍼 정렬기의 SECS/GEM통신 구현 및 운용시험 (Implementation of SECS/GEM Communication Protocol for Wafer Aligner)

  • 조재근;박홍래;유준
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2003년도 하계종합학술대회 논문집 V
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    • pp.2553-2556
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    • 2003
  • In the semiconductor equipment industry, the SECS/GEM protocol has been recognized as the communication standard, but in our 300mm wafer aligner being developed, this capability has not been equipped yet. In this study, we present the realization of SECS-I, SECS-II and HSMS communication protocol between factory host computer and wafer aligner. Its validity is shown in actual test environment.

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