• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.390-390
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• 2009

마그네트론 스퍼터링법을 이용하여 n-i-p 구조의 플렉서블 실리콘 박막태양전지용 ZnO/Ag 후면전극을 stainless steel 기판위에 제조하고 증착온도와 Ag 박막의 두께 변화에 따른 광학적 특성변화를 조사하였다. ZnO/Ag 구조의 후면전극은 RF와 DC 마그네트론 스퍼터링으로 Ag 금속 및 ZnO:Al($Al_2O_3$ 2.5%) 세라믹 타겟을 이용하여 각각 제조하였으며 증착온도는 상온 ${\sim}500^{\circ}C$로, Ag 박막두께는 100 ~ 500 nm로 변화시켰다. 증착조건 변화에 따라 제조된 후면전극의 표면거칠기 및 형상변화를 Atomic Force Mircroscope (AFM)와 Scanning electron miroscopy (SEM)으로 분석하였으며 이에 따른 반사도 변화를 UV-visible-nIR spectrometry 측정을 통하여 조사하였다. 증착온도가 증가함에 따라 Ag 박막의 표면 거칠기는 점차로 증가하였으며 증착된 후면전극의 반사도도 함께 증가함을 알 수 있었다. Ag 박막의 두께 변화에 따른 반사도 변화와 n-i-p 구조의 플렉서블 실리콘 박막태양전지에 미치는 영향을 조사하였다.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.869-875
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• 1996

In this article the effects of process parameters of inductively coupled plasma etching with $SF_6$ /$N_2$/Ar mixture gas and mask materials on the etched profile of W were investigated. While the etched profile was improved by $N_2$-addition, low working presure, and reduced $SF_6$ flow rate, the etching selectity (W against SAL resist) was decreased. Due to the difficulty of W etching with single layer resist, sputter deposited $Al_2O_3$ film was used as a hardmask. Reduction of required EB resist thickness through $Al_2O_3$ mask application could reduce proximity effect during e-beam patterning, but the etch anisotropy was degraded by decreased sidewall passiviation effect.

• Journal of the Korean institute of surface engineering
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• v.36 no.1
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• pp.22-26
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• 2003

This short communication reports on the experiment which demonstrates that superhard nanostructured films with hardness of about 40 GPa and greater can be composed not only of two or more nanocrystalline and/or amorphous phases of different materials, as it is in the case of nanocomposite coatings, but also that can be formed by a mixture of small (<10 nm) nanocrystalline grains of the same material with different crystallographic orientation and/or lattice structures. This finding opens new possibilities to develop advanced nanostructured materials with enhanced physical and functional properties.

• Corrosion Science and Technology
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• v.9 no.2
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• pp.81-86
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• 2010

The mechanisms of selective oxidation of intercritically annealed CMnAl TRIP steels in a Continuous Galvanizing Line (GCL) were studied by cross-sectional observation of the surface and sub-surface regions by means of High Resolution Transmission Electron Microscopy (HR-TEM). The selective oxidation and nitriding of an intercritically annealed CMnAl TRIP steel in a controlled dew point 10%$H_2+N_2$ atmosphere resulted in the formation of c-xMnO.$MnO_2$ (1${\leq}$x<3) and c-xMnO.$Al_2O_3$ ($x{\geq}1$) particles on the steel surface. Single crystal c-xMnO.$SiO_2$ ($2{\leq}x{\leq}4$) oxide particles were also observed on the surface. A thin film of crystalline c-xMnO.$SiO_2$ (2${\leq}$x<3) and c-xMnO.$Al_2O_3$ ($x{\geq}1$) was present between these particles. In the sub-surface region, internal oxidation, nitriding and intermetallic compound formation were observed. In the first region, large crystalline c-xMnO.$SiO_2$ ($1{\geq}x{\geq}2$) and c-xMnO.$Al_2O_3$ ($x{\geq}1$) oxides particles were present. In the second region, c-AlN particles were observed, and in a third region, small $MnAl_x$ (x>1) intermetallic compound particles were observed.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.42.2-42.2
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• 2010

Transparent conducting oxides (TCOs) are of significant importance for their applications in various devices, such as light-emitting diodes, thin-film solar cells, organic light-emitting diodes, liquid crystal displays, and so on. In order for TCOs to contribute to the performance improvement of these devices, TCOs should have high transmittance and good electrical properties simultaneously. Sn-doped $In_2O_3$ (ITO) is the most commonly used TCO. However, indium is toxic and scarce in nature. Thus, ZnO has attracted a lot of attention because of the possibility for replacing ITO. In particular, group III impurity-doped ZnO showed the optoelectronic properties comparable to those of ITO electrodes. Al-doped ZnO exhibited the best performance among various doped ZnO films because of the high substitutional doping efficiency. However, in order for the Al-doped ZnO to replace ITO in electronic devices, their electrical and optical properties should further significantly be improved. In this connection, different ways such as a variation of deposition conditions, different deposition techniques, and post-deposition annealing processes have been investigated so far. Among the deposition methods, RF magnetron sputtering has been extensively used because of the easiness in controlling deposition parameters and its fast deposition rate. In addition, when combined with post-deposition annealing in a reducing ambient, the optoelectronic properties of Al-doped ZnO films were found to be further improved. In this presentation, we deposited Al-doped ZnO (ZnO:$Al_2O_3$ = 98:2 wt%) thin films on the glass and sapphire substrates using RF magnetron sputtering as a function of substrate temperature. In addition, the ZnO samples were annealed in different conditions, e.g., rapid thermal annealing (RTA) at $900^{\circ}C$ in $N_2$ ambient for 1 min, tube-furnace annealing at $500^{\circ}C$ in $N_2:H_2$=9:1 gas flow for 1 hour, or RTA combined with tube-furnace annealing. It is found that the mobilities and carrier concentrations of the samples are dependent on growth temperature followed by one of three subsequent post-deposition annealing conditions.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.93-93
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• 2009

실리콘 태양전지의 효율 향상을 위한 노력의 일환으로 결정질 실리콘 웨이퍼 표면passivation 물질 중 Atomic Layer Deposition (ALD)을 이용하여 증착한 $Al_2O_3$ 박막에 대한 관심이 증가하고 있다. 본 연구에서는 $Al_2O_3$ 박막의 증착 전 실리콘 웨이퍼의 산화막 두께에 따른 passivation 효과에 대해서 연구하였다. 실리콘 산화막은 $HNO_3$ 용액을 사용하여 화학적으로 생성시켰으며 $HNO_3$ 용액과의 반응 시간을 조절하여 실리콘 산화막의 두께를 조절하였다. 실리콘 산화막 생성 후 ALD로 $Al_2O_3$ 박막을 증착하였으며 증착 후 $N_2$ 분위기에서 annealing 하였다. Annealing 후 passivation 효과는 Quasi-Steady-State Photo Conductance를 사용하여 minority carrier의 lifetime을 측정하였다. Capacitance-Voltage measurement, Transmission Electron Microscopy, Ellipsometry를 사용하여 실리콘 산화막의 두께에 따른 $Al_2O_3$ 박막의 passivation 효과를 분석하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.506-507
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• 2011

경사코팅 기술(Oblique Angle Deposition; OAD)은 입사 증기가 기판에 수직으로 입사하지 않고 90도 보다 작은 각도로 비스듬히 입사하도록 조절하여 코팅하는 물리증착 기술의 하나로 피막의 조직을 다양하게 제어할 수 있는 방법으로 알려져 있다. 초기의 경사 코팅 기술은 경사각을 가진 정지된 기판 상에 코팅하였으나 최근에는 기판의 각도와 회전을 동시에 조절하여 이루어지는 소위 스침각 증착(Glancing Angle Deposition; GLAD) 기술이 개발되어 다양한 형태의 구조를 제어하는 연구가 활발히 진행되고 있다. 특히, 컴퓨터를 이용하여 입사각과 방위각을 정밀 제어함에 의해 나노 스케일의 Zigzag 및 나선형, 기둥형 조직 등 복잡한 형태의 박막을 제조하는 것이 가능하게 되었다. 현재, GLAD 기술과 다양한 형태의 나노 조직을 이용하여 각종 센서는 물론 태양전지와 같은 에너지 소자, 필터와 같은 광학코팅 등에 응용하기 위한 연구가 세계적으로 폭넓게 진행되고 있다. 본 연구에서는 조직의 치밀도 향상을 통한 특성 향상을 위해 Al 및 TiN 박막을 제조함에 있어서 경사코팅 기술을 응용하여 단층 및 다층 피막(각도를 반대로 하여 여러 층을 제조)을 제조하고 그 특성을 비교하였다. Al 박막은 UBM (Un-Balanced Magnetron) 스퍼터링 소스를 이용하여 타겟 표면과 기판 표면이 이루는 각도 즉, 입사빔과 기판이 이루는 각도를 각각 0, 30, 45, 60 및 90도의 각도에서 강판 및 실리콘 웨이퍼 상에 시편을 제조하되 단층 및 다층으로 시편을 제조하고 치밀도 및 내식성과 반사율 및 조도 등의 특성을 비교하였다. 그 결과 경사각으로 코팅한 시편에서 조도 및 반사율이 향상됨은 물론 치밀도 및 내식성이 향상됨을 확인하였다. 특히, 염수분무에 의한 내식성 시험에서 경사 코팅된 시편의 경우 내식성이 현저히 향상되었는데, 이는 경사 코팅 방법이 박막의 치밀도를 향상시켜 나타난 현상으로 판단된다. TiN 박막은 Cathodic Arc 방식을 이용하되 Al 박막과 동일한 방법으로 코팅을 하고 내식성 및 경도 등의 특성을 비교하였다. TiN 박막은 경사각이 커지면서 경도가 낮아지며 특히 다층막의 경우 경도 감소가 현저함을 알 수 있었다. 다만, 45도에서는 다른 경사각에 비해 약간의 경도 상승이 측정되었다. 경사각 코팅에서의 경도 감소는 피막의 경사에 의해 탐침이 미끄러지거나 또는 우선 방위에 의한 경도 증가 효과가 나타나지 않아 생기는 현상으로 판단되었다. Ferroxyl 시험을 이용한 기공도 시험에서는 경사각 코팅의 경우가 기공이 다소 감소함을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.154-154
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• 2012

Flexible complementary inverters based on thin-film transistors (TFTs) are important because they have low power consumption and high voltage gain compared to single type circuits. We have manufactured flexible complementary inverters using pentacene and amorphous indium gallium zinc oxide (IGZO) for the p-channel and n-channel, respectively. The circuits were fabricated on polyimide (PI) substrate. Firstly, a thin poly-4-vinyl phenol (PVP) layer was spin coated on PI substrate to make a smooth surface with rms surface roughness of 0.3 nm, which was required to grow high quality IGZO layers. Then, Ni gate electrode was deposited on the PVP layer by e-beam evaporator. 400-nm-thick PVP and 20-nm-thick ALD Al2O3 dielectric was deposited in sequence as a double gate dielectric layer for high flexibility and low leakage current. Then, IGZO and pentacene semiconductor layers were deposited by rf sputter and thermal evaporator, respectively, using shadow masks. Finally, Al and Au source/drain electrodes of 70 nm were respectively deposited on each semiconductor layer using shadow masks by thermal evaporator. The characteristics of TFTs and inverters were evaluated at different bending radii. The applied strain led to change in voltage transfer characteristics of complementary inverters as well as source-drain saturation current, field effect mobility and threshold voltage of TFTs. The switching threshold voltage of fabricated inverters was decreased with increasing bending radius, which is related to change in parameters of TFTs. Throughout the bending experiments, relationship between circuit performance and TFT characteristics under mechanical deformation could be elucidated.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.166-166
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• 2010

Recently, TFTs based on amorphous oxide semiconductors (AOSs) such as ZnO, InZnO, ZnSnO, GaZnO, TiOx, InGaZnO(IGZO), SnGaZnO, etc. have been attracting a grate deal of attention as potential alternatives to existing TFT technology to meet emerging technological demands where Si-based or organic electronics cannot provide a solution. Since, in 2003, Masuda et al. and Nomura et al. have reported on transparent TFTs using ZnO and IGZO as active layers, respectively, much efforts have been devoted to develop oxide TFTs using aforementioned amorphous oxide semiconductors as their active layers. In this thesis, I report on the performance of thin-film transistors using amorphous indium gallium zinc oxides for an active channel layer at room temperature. $SiO_2$ was employed as the gate dielectric oxide. The amorphous indium gallium zinc oxides were deposited by RF magnetron sputtering. The carrier concentration of amorphous indium gallium zinc oxide was controlled by oxygen pressure in the sputtering ambient. Devices are realized that display a threshold voltage of 1.5V and an on/off ration of > $10^9$ operated as an n-type enhancement mode with saturation mobility with $9.06\;cm^2/V{\cdot}s$. The devices show optical transmittance above 80% in the visible range. In conclusion, the fabrication and characterization of thin-film transistors using amorphous indium gallium zinc oxides for an active channel layer were reported. The operation of the devices was an n-type enhancement mode with good saturation characteristics.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.893-896
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• 2003

Plasma polymerized para-xylene (PPpX) thin films deposited by plasma enhanced chemical vapor deposition (PECVD) were used to passivate the organic light emitting diodes (OLEDs). For OLEDs, indium tin oxide (ITO), N,N'-diphenyl-N,N'-bis(3-methylphenyl)-1,1'-diphenyl-4,4'-diamine (TPD), tris(8-hydroxyquinoline) aluminum $(Alq_{3})$ and aluminum (Al) were used as the anode, the hole transport layer (HTL), the emitting layer (EML) and the cathode, respectively. The OLED device with the PPpX passivation film (passivated device) showed similar electrical and optical characteristics to those of the OLED device without the PPpX passivation film (control device), indicating that the PECVD process did not degrade the performance of the OLEDs notably. The lifetime of the passivated device was two times longer than that of the control device. Passivation of OLEDs with PPpX films also suppressed the growth of dark spots. The density and size of dark spots of the passivated device were much smaller than those of the control device.