• 제목/요약/키워드: AlAs layer-by-layer deposition

검색결과 296건 처리시간 0.026초

$Si_3N_4$ 기판 위에 PECVD 법으로 형성한 Tungsten Nitride 박막의 특성 (Characteristic of PECVD-$WN_x$ Thin Films Deposited on $Si_3N_4$ Substrate)

  • 배성찬;박병남;손승현;이종현;최시영
    • 전자공학회논문지D
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    • 제36D권7호
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    • pp.17-25
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    • 1999
  • PECVD 법을 이용하여 Tungsten Nitride($WN_x$) 박막을 $WSi_3N_4$ 기판위에 형성하였다. $WN_x$ 박막은 기관온도, 가스의 유량, rf power 등의 공정변수를 변화시키면서 형성되었고, 서로 다른 질소원으로 $NH_3$$N_2$를 각각 사용하여 박막의 특성을 조사하였다. $WN_x$ 막 내의 질소함량은 $NH_3$$N_2$의 유량에 따라 0~45% 정도로 변화하였으며, $NH_3$를 사용하였을 때, 최고 160nm/min의 높은 성장률을 나타내었다. $WSi_3N_4$ 기판 위에서는 TiN이나 Si 위에서보다 높은 성장률을 나타내었다. $WN_x$ 박막의 순도를 AES로 측정해 본 결과 $NH_3$를 사용했을 때 고순도의 박막을 얻을 수 있었다. XRD 분석으로 순수한 다결정의 W가 비정질의 $WN_x$로 변화되는 것을 알 수 있었으며, 이것은 $WN_x$가 식각 공정시 미세 패턴 형성이 W보다 유리할 것이라는 것을 보여준다. TiN, NiCr, Al 등의 다양한 기판 위에 형성해 본 결과 Al 위에서 최대 $1.6 {\mu}m$의 두꺼운 막이 형성되었다.

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TPM-BiP 청색 형광 재료의 전계발광특성 (Characterization of Blue Organic Light Emitting Diodes using TPM-BiP)

  • 장지근;신상배;안종명;장호정;이학민;공명선;김민영;김준우
    • 반도체디스플레이기술학회지
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    • 제6권2호
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    • pp.11-14
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    • 2007
  • For the fabrication of blue color organic light emitting diodes(OLED) with a high performance, 2-TNATA [4,4',4"-tris (2-naphthylphenyl-phenylamino)-triphenylamine] as hole injection material and NPB [N,N'-bis (1-naphthyl) -N,N'-diphenyl-1,1'-biphenyl-4,4'-diamine] as hole transport material were deposited on the ITO (indium tin oxide)/glass substrate by the vacuum thermal evaporation. After then, blue color emission layer was deposited using TPM-BiP[(4'-Benzoylferphenyl-4-yl)phenyl-methanone-Diethyl(biphenyl-4-ymethyl)phosphonate] and GDI602 as a light emitting organic material. Finally, the two kinds of OLEDs with the structure of $ITO/2-TNATA/NPB/TPM-BiP/Alq_3/LiF/Al and ITO/2-TNATA/NPB/GDI602/Alq_3/LiF/Al$ were prepared by in-situ deposition. The maximum current density and luminance were found to be about $588\;mA/cm^2\;and\;5239\;cd/m^2$ at 12V for the OLED sample with the structure of $ITO/2-TNATA/NPB/TPM-BiP/Alq_3/LiF/Al$. Color coordinate of blue OLED was x=0.18, y=0.18 (at llV) and the maximum current efficiency was 2.82 cd/A (at 6V) with the peak emission wavelength of 440 nm.

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Effects of HA and TiN Coating on the Electrochemical Characteristics of Ti-6Al-4 V Alloys for Bone Plates

  • Oh, Jae-Wook;Choe, Han-Cheol;Ko, Yeong-Mu
    • 한국표면공학회지
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    • 제37권5호
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    • pp.249-252
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    • 2004
  • Effects of HA and TiN coating on the electrochemical characteristics of Ti-6AI-4V alloys for bone plates were investigated using various test methods. Ti-6AI-4V alloys were fabricated by using a vacuum induction furnace and bone plates were made by laser cutting and polishing. HA was made of extracted tooth sintered and then tooth ash was used as HA coating target. The TiN and HA film coating on the surface were carried on using electron-beam physical vapor deposition (EB-PVD) method. The corrosion behaviors of the samples were examined through potentiodynamic method in 0.9% NaCI solutions at $36.5\pm$$1^{\circ}C$ and corrosion surface was observed using SEM and XPS. The surface roughness of TiN coated bone plates was lower than that of tooth ash coated plates. The structure of TiN coated layer showed the columnar structure and tooth ash coated layer showed equiaxed and anisotrophic structure. The corrosion potential of the TiN coated specimen is comparatively high. The active current density of TiN and tooth ash coated alloy showed the range of about $1.0xl0^{-5}$ $A\textrm{cm}^2$, whereas that of the non-coated alloy was$ 1.0xl0^{-4}$ $A\textrm{cm}^2$. The active current densities of HA and TiN coated bone plates were smaller than that of non-coated bone plates in 0.9% NaCl solution. The pitting potential of TiN and HA coated alloy is more drastically increased than that of the non-coated alloy. The pit number and pit size of TiN and HA coated alloy decreased in compared with those of non-coated alloy. For the coated samples, corrosion resistance increased in the order of TiN coated, tooth ash coated, and non-coated alloy.

Thermal Evaporation법으로 제조한 NiCr 박막의 증착 특성 (Deposition Properties of NiCr Thin Films Prepared by Thermal Evaporation)

  • 권용;박용주;최승평;정진;최광표;류현욱;박진성
    • 한국세라믹학회지
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    • 제41권6호
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    • pp.450-455
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    • 2004
  • NiCr 합금을 열증발원으로 사용한 thermal evaporation법으로 NiCr박막을 $Al_2$O$_3$/Si 기판 위에 증착시켰다. 이 때 동일한 량의 NiCr 합금을 1회에 모두 증착하는 방법과, l/2씩 2회 증착하는 방법으로 NiCr 박막을 각각 증착시켜, 박막의 미세구조에 따른 막의 특성변화를 고찰하였으며, 열처리 온도에 따른 NiCr 박막의 상 변화, 조성변화 및 미세구조 변화를 XRD, AES 및 FE-SEM으로 각각 분석하였다. 열처리 과정에서 박막내부에 존재하는 Cr 성분이 표면 쪽으로 확산하여 산화됨으로써 Cr산화층/Ni 층/Cr 산화층의 전형적인 다층구조를 형성함을 알 수 있었으며, 특히, $700^{\circ}C$ 이상에서는 Ni 층이 Cr산화층을 통하여 표면 쪽으로 확산됨으로써 표면에 원주형 결정립을 가지는 NiO 층을 형성하였다. 특히 Ni 층이 확산 전의 구조를 유지한 채 표면에 추가적인 NiO층이 형성되는데, 이는 형성된 Cr산화층의 확산이 상대적으로 Ni 층에 비하여 어려운데 기인한다.

혼성물리화학기상 증착법으로 여러가지 불순물층 위에 제조한 $MgB_2$ 박막에 대한 연구 (Study of $MgB_2$ Films Grown on Various Impurity Layers by using HPCVD Method)

  • 박세원;성원경;정순길;강원남
    • Progress in Superconductivity
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    • 제10권1호
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    • pp.35-39
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    • 2008
  • By using the hybrid physical-chemical vapor deposition (HPCVD) technique, we have fabricated $MgB_2$ thick films on $Al_{2}O_3$ substrates with various impurity layers of Ni, Ti, and SiC. We have found a significant enhancement of the critical current density ($J_c$) for $MgB_2$ films grown on impurity layered substrates, indicating that additional impurity layers were provided as possible pinning sites by chemical doping in $MgB_2$ films. All samples doped by Ni, Ti, and SiC were observed to have high superconducting transition temperatures of 39 - 41 K. The $J_c$ of $MgB_2$ films grown on SiC impurity layered substrates showed three times higher than that of undoped films at high magnetic fields above 1 T.

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Charge Pumping Method를 이용한 Silicon-Al2O3-Nitride-Oxide-Silicon Flash Memory Cell Transistor의 트랩과 소자 (Analysis Trap and Device Characteristic of Silicon-Al2O3-Nitride-Oxide-Silicon Memory Cell Transistors using Charge Pumping Method)

  • 박성수;최원호;한인식;나민기;이가원
    • 대한전자공학회논문지SD
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    • 제45권7호
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    • pp.37-43
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    • 2008
  • 본 논문에서는 전하 펌프 방법 (Charge Pumping Method, CPM)를 이용하여 서로 다른 질화막 층을 가지는 N-Channel SANOS (Silicon-$Al_2O_3$-Nitride-Oxide-Silicon) Flash Memory Cell 트랜지스터의 트랩 특성을 규명하였다. SANOS Flash Memory에서 계면 및 질화막 트랩의 중요성은 널리 알려져 있지만 소자에 직접 적용 가능하면서 정화하고 용이한 트랩 분석 방법은 미흡하다고 할 수 있다. 기존에 알려진 분석 방법 중 전하 펌프 방법은 측정 및 분석이 간단하면서 트랜지스터에 직접 적용이 가능하여 MOSFET에 널리 사용되어왔으며 최근에는 MONOS/SONOS 구조에도 적용되고 있지만 아직까지는 Silicon 기판과 tunneling oxide와의 계면에 존재하는 트랩 및 tunneling oxide가 얇은 구조에서의 질화막 벌크 트랩 추출 결과만이 보고되어 있다. 이에 본 연구에서는 Trapping Layer (질화막)가 다른 SONOS 트랜지스터에 전하 펌프 방법을 적용하여 Si 기판/Tunneling Oxide 계면 트랩 및 질화막 트랩을 분리하여 평가하였으며 추출된 결과의 정확성 및 유용성을 확인하고자 트랜지스터의 전기적 특성 및 메모리 특성과의 상관 관계를 분석하고 Simulation을 통해 확인하였다. 분석 결과 계면 트랩의 경우 트랩 밀도가 높고 trap의 capture cross section이 큰 소자의 경우 전자이동도, subthreshold slop, leakage current 등의 트랜지스터의 일반적인 특성 열화가 나타났다. 계면 트랩은 특히 Memory 특성 중 Program/Erase (P/E) speed에 영향을 미치는 것으로 나타났는데 이는 계면결함이 많은 소자의 경우 같은 P/E 조건에서 더 많은 전하가 계면결함에 포획됨으로써 trapping layer로의 carrier 이동이 억제되기 때문으로 판단되며 simulation을 통해서도 동일한 결과를 확인하였다. 하지만 data retention의 경우 계면 트랩보다 charge trapping layer인 질화막 트랩 특성에 의해 더 크게 영향을 받는 것으로 나타났다. 이는 P/E cycling 횟수에 따른 data retention 특성 열화 측정 결과에서도 일관되게 확인할 수 있었다.

The Role of Metal Catalyst on Water Permeation and Stability of BaCe0.8Y0.2O3-δ

  • Al, S.;Zhang, G.
    • Journal of Electrochemical Science and Technology
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    • 제9권3호
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    • pp.212-219
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    • 2018
  • Perovskite type ceramic membranes which exhibit dual ion conduction (proton and oxygen ion conduction) can permeate water and can aid solving operational problems such as temperature gradient and carbon deposition associated with a working solid oxide fuel cell. From this point of view, it is crucial to reveal water transport mechanism and especially the nature of the surface sites that is necessary for water incorporation and evolution. $BaCe_{0.8}Y_{0.2}O_{3-{\alpha}}$ (BCY20) was used as a model proton and oxygen ion conducting membrane in this work. Four different catalytically modified membrane configurations were used for the investigations and water flux was measured as a function of temperature. In addition, CO was introduced to the permeate side in order to test the stability of membrane against water and $CO/CO_2$ and post operation analysis of used membranes were carried out. The results revealed that water incorporation occurs on any exposed electrolyte surface. However, the magnitude of water permeation changes depending on which membrane surface is catalytically modified. The platinum increases the water flux on the feed side whilst it decreases the flux on the permeate side. Water flux measurements suggest that platinum can block water permeation on the permeate side by reducing the access to the lattice oxygen in the surface layer.

Barrier층을 갖는 Soda lime glass 기판위에 증착된 ITO박막의 Annealing 조건에 따른 영향 (Effects of Annealing Condition on Properties of ITO Thin Films Deposited on Soda Lime Glass having Barrier Layers)

  • 이정민;최병현;지미정;박정호;주병권
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.66-66
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    • 2008
  • Most of the properties of ITO films depend on their substrate nature, deposition techniques and ITO film composition. For the display panel application, it is normally deposited on the glass substrate which has high strain point (>575 degree) and must be deposited at a temperature higher than $250^{\circ}C$ and then annealed at a temperature higher than $300^{\circ}C$ in order to high optical transmittance in the visible region, low reactivity and chemical duration. But the high strain point glass (HSPG) used as FPDs is blocking popularization of large sizes FPDs because it is more expensive than a soda lime glass (SLG). If the SLG could be used as substrate for FPDs, then diffusion of Na ion from the substrate occurs into the ITO films during annealing or heat treatment on manufacturing process and it affects the properties. Therefore proper care should be followed to minimize Na ion diffusion. In this study, we investigate the electrical, optical and structural properties of ITO films deposited on the SLG and the Asahi glass(PD200) substrate by rf magnetron sputtering using a ceramic target ($In_2O_3:SnO_2$, 90:10wt.%). These films were annealed in $N_2$ and air atmosphere at $400^{\circ}C$ for 20min, 1hr, and 2hrs. ITO films deposited on the SLG show a high electrical resistivity and structural defect as compared with those deposited on the PD200 due to the Na ion from the SLG on diffuse to the ITO film by annealing. However these properties can be improved by introducing a barrier layer of $SiO_2$ or $Al_2O_3$ between ITO film and the SLG substrate. The characteristics of films were examined by the 4-point probe, FE-SEM, UV-VIS spectrometer, and X-ray diffraction. SIMS analysis confirmed that barrier layer inhibited Na ion diffusion from the SLG.

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열처리된 SiO$_{2}$/TiW 구조의 계면 특성 (The interfacial properties of th eanneled SiO$_{2}$/TiW structure)

  • 이재성;박형호;이정희;이용현
    • 전자공학회논문지A
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    • 제33A권3호
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    • pp.117-125
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    • 1996
  • The variation of the interfacial and the electrical properties of SiO$_{2}$TiW layers as a function of anneal temperature was extensively investigated. During the deposition of SiO$_{2}$ on TiW chemical bonds such as SiO$_{2}$, TiW, WO$_{3}$, WO$_{2}$ TiO$_{2}$ Ti$_{2}$O$_{5}$ has been created at the SiO$_{2}$/TiW interface. At the anneal temperature of 300$^{\circ}C$, WO$_{3}$ and TiO$_{2}$ bonds started to break due to the reduction phenomena of W and Ti and simultaneously the metallic W and Ti bonds started to create. Above 500$^{\circ}C$, a part of Si-O bonds was broken and consequently Ti/W silicide was formed. Form the current-voltage characteristics of Al/Sico$_{2}$(220$\AA$)/TiW antifuse structure, it was found that the breakdown voltage of antifuse device wzas decreased with increasing annealing temperature for SiO$_{2}$(220$\AA$)/TiW layer. When r, the insulating property of antifuse device of the deterioration of intermetallic SiO$_{2}$ film, caused by the influw of Ti and W.W.

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Rubrene/GDl 4234 Dual 도펀트를 이용한 적색 유기발광다이오드 (Red Organic LED with Dual Dopants of Rubrene and GDI 4234)

  • 장지근;강의정;김희원;신세진;공명선;임성규;오명환
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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    • pp.309-310
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    • 2005
  • In the fabrication of high performance red organic light emitting diode, 2-TNA TA [4,4',4" -tris (2-naphthylphenyl- phenylamino)-triphenylamine] as hole injection material and N PH [N,N'-bis (1-naphthyl) -N,N' -diphenyl-1, 1'-biphenyl-4,4'- diamine] as hole transport material were deposited on the ITO (indium tin oxide)/glass substrate by vacuum evaporation, And then, red color emission layer was deposited using Alq3 as a host material and Rubrene (5,6,11,12- tetraphenylnaphthacene) and GDI 4234 as dopants. Finally, small molecular weight OLED with the structure of ITO/2-TNATA/ NPB/Alq3+Rubrene+GDI4234/Alq3/LiF/Al was obtained by in-situ deposition of Alq3, LiF and Al as electron transport material, electron injection material and cathode. respectively. Green OLED fabricated in our experiments showed the color coordinate of CIE(0.65,0.35) and the maximum luminescence efficiency of 2.1 lm/W at 7 V with the peak emission wavelength of 632 nm.

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