• 제목/요약/키워드: Al-Si-Cu

검색결과 497건 처리시간 0.029초

마이크로파 여기 프라즈마법으로 제조한 강자성 터널링 접합의 국소전도특성 (Local Current Distribution in a Ferromagnetic Tunnel Junction Fabricated Using Microwave Excited Plasma Method)

  • 윤대식;김철기;김종오
    • 한국자기학회지
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    • 제13권2호
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    • pp.47-52
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    • 2003
  • DC 마그네트론 스파터법과 RLSA(Radial Line Slot Antenna)을 이용한 마이크로파 여기 프라즈마를 이용하여 Ta/Cu/Ta/NiFe/Cu/Mn$_{75}$Ir$_{25}$/ $Co_{70}$Fe$_{30}$/Al-oxide 구조의 접합을 제조한 후, contact-mode AM(Atomic Force Microscope)을 이용하여 Al 산화막의 국소전도 특성의 평가를 수행하였다. AFM 동시전류측정으로부터, 얻어지는 표면상과 전류상은 대응하지 않는다. 국소 전류-전압(I-V)의 측정 결과, 전류상은 절연층의 barrier height의 분포를 나타내고 있다는 것을 알았다.다.다.

Classification of metals inducing filed aided lateral crystallization (FALC) of amorphous silicon

  • Jae-Bok Lee;Se-Youl Kwon;Duck-Kyun Choi
    • 한국결정성장학회지
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    • 제11권4호
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    • pp.160-165
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    • 2001
  • The effects of various metals on Field Aided Lateral Crystallization (FALC) behaviors of amorphous silicon (a-Si) were investigated. Under an influence of electric field, metals such s Cu, Ni and Co were found to fasten the lateral crystallization toward a metal-free region, exhibiting a typical FALC behavior while the lateral crystallization of a-Si was not obvious for Pd. However, Au, Al and Cr did not induce the lateral crystallization of a-Si in metal-free region. Such phenomenological differences in various metals were studied in terms of dominant diffusing species (DDS) in the reaction between metal and Si. It was judged that the applied electric field enhanced the crystallization velocity by accelerating the diffusion of metal atoms since the occurrence of lateral crystallization would be strongly dependent on the diffusion of metal atoms than that of Si atoms. Therefore, it was concluded that he only metal-dominant diffusing species in the reaction between metal and Si results in the crystallization of a-Si in metal-free region.

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Metal/$Al_2O_3-SiO_2$ System Interface Investigations

  • Korobova, N.;Soh, Deawha
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2004년도 SMICS 2004 International Symposium on Maritime and Communication Sciences
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    • pp.70-73
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    • 2004
  • The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

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Fracture and Residual Stresses in $Metal/Al_2O_3-SiO_2$ System

  • 소대화
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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    • pp.308-312
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    • 2003
  • The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics ($Al_2O_3-SiO_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a $Cu/Al_2O_3-SiO_2$ ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

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창원 다호리 유적 6호분 출토 유리구슬의 과학적 분석 (A Scientific Analysis on the Glass Beads Excavated from the Daho-ri site NO. 6, Changwoen)

  • 윤은영;강형태
    • 박물관보존과학
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    • 제13권
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    • pp.45-49
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    • 2012
  • 창원 다호리 유적 6호분에서 출토된 유리구슬편 14점에 대하여 과학적인 분석을 실시하였다. 유리편은 대부분 감청색의 투명한 유리로 원형의 기포들이 일정한 방향으로 나열되어 있다. SEM/EDS 분석결과 유리편은 모두 포타쉬유리군(K2O-SiO2)이며 CaO 및 Al2O3의 함량은 모두 5%이하인 LCA(Low CaO, Low Al2O3)계 유리로 확인되었다. 또한 포타쉬원료는 식물제를 정제하거나 광물(초석, KNO3)을 사용한 것으로 판단되며 감청색을 내는 발색제로 작용하는 성분은 CuO의 영향이 큰 것으로 판단된다.

(Glycine+Urea) 혼합연료를 이요한 자발착화 연소반응법에 의한 우수한 소결성의 초미분체 LaAlO$_3$ 분말 합성 (Synthesis of Ultrafine LaAlO$_3$ Powders with Good Sinterability by Self-Sustaining Combustion Method Using (Glycine+Urea) Fuel)

  • 남희동;최우성;이병하;박성
    • 한국세라믹학회지
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    • 제36권2호
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    • pp.203-209
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    • 1999
  • Si 기판위에 Ba2YCu3O7-$\delta$ 고온초전도체를 응용하기 위해 요구되는 buffer층으로 유망한 재료인 LaAlO3 단일상 분말을 고상반응법과 자발착한 연소반응법으로 제조하였다. 제조된 LaAlO3 분말의 입자형태와 결정상태는 scanning electron microscope (SEM)과 X-ray diffractometer (XRD)를 이용하여 분석하였다. 분말의 비표면적과 소결특성은 각각 Brunauer-Emmett-Teller(BET) 방법과 dilatometer를 측정하였다. 고상반응법으로 LaAlO3 분말을 제조할 때에는 하소온도를 150$0^{\circ}C$까지 높게 하여도 단일상을 얻는 것이 어려웠으나 자발착한 연소반응법에 의한 분말제조는 $650^{\circ}C$의 저온에서 하소하여도 쉽게 얻을 수 있었다. Dilatometer 측정을 통하여 분석해 보면, 고상반응법에 의한 분말보다 자발착한 연소반응법에 의한 분말로 제조된 소결체가 고상반응법에 의한 소결체에 비해 1.4배나 큰 소멸밀도(98.87%)를 가졌다. 이렇게 소결밀도에서 큰 차이가 나는 것은 자발착한 연소방법에 의한 분말의 평균 입자크기가 nano crystal size이고 비표면적 값(56.54 $m^2$/g)이 매우 크기 때문이다. 두가지 방법으로 제조된 분말을 이용, LaAlO3 layer를 스크린 프린팅과 소결법으로 Si 기판상에 제조하였으며 자발착한 연소합성법으로 제조된 분말은 110$0^{\circ}C$에서 우수한 소결특성을 나타내었다.

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마찰재에 함유된 금속섬유와 마찰 특성의 연관관계 (The Effect of Metal Fibers on the Tribology of Automotive Friction Materials)

  • 고길주;조민형;장호
    • Tribology and Lubricants
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    • 제17권4호
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    • pp.267-275
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    • 2001
  • Friction and wear properties of brake friction materials containing different metal fibers (Al, Cu or Steel fibers) were investigated. Based on a simple experimental formulation, friction materials with the same amount of metal fibers were tested using a pad-on-disk type friction tester. Two different materials (gray cast iron and aluminum metal matrix composite (MMC)) were used for disks rubbing against the friction materials. Results front ambient temperature tests revealed that the friction material containing Cu fibers sliding against gray cast iron disk showed a distinct negative $\mu$-v (friction coefficient vs. sliding velocity) relation implying possible stick-slip generation at low speeds. The negative $\mu$- v relation was not observed when the Cu-containing friction materials were rubbed against the Al-MMC counter surface. Elevated temperature tests showed that the friction level and the intensity of friction force oscillation were strongly affected by the thermal conductivity and melting temperature of metallic ingredients of the friction couple. Friction materials slid against cast iron disks exhibited higher friction coefficients than Al-MMC (metal matrix composite) disks during high temperature tests. On the other hand, high temperature test results suggested that copper fibers in the friction material improved fade resistance and that steel fibers were not compatible with Al-MMC disks showing severe material transfer and erratic friction behavior during sliding at elevated temperatures.

DRUM impactor를 이용한 대기 입자상 물질 중 원소성분의 입경분포 특성 : 제주도 고산지역의 2002년 봄철 (3.29-5.30) 측정 연구 (Size Distributions of Trace Elements in Airborn Particulates Collected using Drum impactor at Gosan, Jeju Island : Measurements in Springtime 2002)

  • 한진석;문광주;류성윤;안준영;공부주;홍유덕;김영준
    • 한국대기환경학회지
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    • 제20권4호
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    • pp.555-569
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    • 2004
  • Size -segregated measurements of aerosol composition using 8-stage DRUM impactor are used to determine the transport of natural and anthropogenic aerosols at Gosan site from 29 March to 30 May in 2002. Separation of ambient aerosols by DRUM impactor offers many Advantages over other standard filtration techniques. Some of the most important advantages are the ability to segregate into details by particle tire, to better preserve chemical integrity since the air stream doesn't pars through the deposit, to collect samples as a function of time, and to have a wide variety of impaction surfaces available to match analytical needs. Although the transport of Yellow sand is a well-known phenomenon in springtime, the result of measurement shows that not only soil dust but also anthropogenic aerosols, including sulfur, enriched trace metals such as Pb, Ni, Zn. Cu, Cr, As, Se, Br, are transported to Gosan in springtime. This study combines the size- and time-resolved aerosol composition measurements with isentropic, backward air-mass trajectories in order to identify some potential source regions of anthropogenic aerosols. As a result, during the NYS period, the average concentration of PM$_{10}$ was 46$\mu\textrm{g}$/㎥, Si, Al. S, Fe, Cl, K, Ca were higher than 1,000 ng/㎥ and Ti was about 100 ng/㎥. The concentrations of Zn, Mn, Cu. Pb, Br, Rb, V, Cr, Ni. At, Se ranged between 1 and 70 ng/㎥. More than 50% typical soil elements, tuck as Al, Si, Fe, Cd. Ti, Cr, Cu, Br. were distributed in a coarse particle range(5.0-12${\mu}{\textrm}{m}$). In other hand, anthropogenic pollutants, luck as S, N, Vi, were mainly distributed in a fine particle range (0.09-0.56${\mu}{\textrm}{m}$). During the YS period, PM$_{10}$ increased about 8 times than NYS period, and main soil elements, such as Al, Si, S, K, V, Mn, Fe also doubled in coarse particle range (1.15-12${\mu}{\textrm}{m}$). But Zn, As, Pb, Cu and Se, which distributed in the time aerosols (0.09-0.56${\mu}{\textrm}{m}$), were on the same level with or decreased than NYS period. Finally. except the YS Period, coarse particles (2.5-12${\mu}{\textrm}{m}$) are inferred to be influenced by soil, coal combustion, waste incineration, ferrous and nonferrous sources through similar pathways with Yellow Sand. But fine particles have different sources, such as coal combustion, gasoline vehicle, biomass burning, oil or coal combustion, nonferrous and ferrous metal sources, which are transported from China, Korea peninsula and local sources.ces.

무연 도금 솔더의 특성 연구: Sn-Cu 및 Sn-Pb 범프의 비교 (Study on the Characteristics of Electroplated Solder: Comparison of Sn-Cu and Sn-Pb Bumps)

  • 정석원;정재필
    • 한국표면공학회지
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    • 제36권5호
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    • pp.386-392
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    • 2003
  • The electroplating process for a solder bump which can be applied for a flip chip was studied. Si-wafer was used for an experimental substrate, and the substrate were coated with UBM (Under Bump Metallization) of Al(400 nm)/Cu(300 nm)Ni(400 nm)/Au(20 nm) subsequently. The compositions of the bump were Sn-Cu and eutectic Sn-Pb, and characteristics of two bumps were compared. Experimental results showed that the electroplated thickness of the solders were increased with time, and the increasing rates were TEX>$0.45 <\mu\textrm{m}$/min for the Sn-Cu and $ 0.35\mu\textrm{m}$/min for the Sn-Pb. In the case of Sn-Cu, electroplating rate increased from 0.25 to $2.7\mu\textrm{m}$/min with increasing current density from 1 to 8.5 $A/dm^2$. In the case of Sn-Pb the rate increased until the current density became $4 A/dm^2$, and after that current density the rate maintains constant value of $0.62\mu\textrm{m}$/min. The electro plated bumps were air reflowed to form spherical bumps, and their bonded shear strengths were evaluated. The shear strength reached at the reflow time of 10 sec, and the strength was of 113 gf for Sn-Cu and 120 gf for Sn-Pb.

저항가열원에 의한 물질의 증발특성(I) (Evaporation characteristics of materials from resistive heating sources(I))

  • 정재인;임병문;문종호;홍재화;강정수;이영백
    • 한국표면공학회지
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    • 제24권1호
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    • pp.25-30
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    • 1991
  • The evaporation characteristics of Ag, Al, Au, Cr. Cu, In, Mg, Mn, Pb, Pd, Si, SiO, Sn, Ti and Zn with the various resistive heating sources have been studied. The employed sources are refractory metal (Mo, Ta and W) boats, W-wire, ceramic (usually Al2O3)-coated and -barriered refractory metal boats, and special boats such as baffled boats and intermetallic boats (nitride compound and graphite). We investigated the melting mode, evaporation rate at a specific power, and lifetime of the sources. A special boat holder is also discussed which is needed to cool the sources at a large heat capacity.

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