• 제목/요약/키워드: Al-Cu alloys

검색결과 264건 처리시간 0.028초

자동차 전장부품을 위한 Sn-0.5Cu-(X)Al(Si) 중온 솔더의 접합특성 연구 (A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules)

  • 유동열;고용호;방정환;이창우
    • Journal of Welding and Joining
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    • 제33권3호
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    • pp.19-24
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    • 2015
  • Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

Al-Cu-Mn주조합금의 SCC특성에 미치는 Cd첨가의 영향 (Effect of Cd Addition on the SCC Properties of Al-Cu-Mn Cast Alloys)

  • 이찬희;김경현;김인배
    • 한국재료학회지
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    • 제11권4호
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    • pp.266-271
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    • 2001
  • Al-Cu-Mn 주조합금의 응력부식균열 저항성에 미치는 Cd첨가의 영향을 C-ring test와 전기전도도 시험을 통하여 조사하였다. Cd첨가량이 증가함에 따라 전기전도도가 증가하였고 SCC 저항성도 증가하였다. SCC 시험결과 균열이 입계를 따라 전파되는 입계파괴가 일어났으며, 파면은 취성파괴양상을 나타내었고, 입계를 따라 조대 석출물과 무석출대가 나타난 것으로 보아서 이 합금의 SCC 기구는 anodic dissolution model이라고 판단된다. Cd을 첨가하지 않은 경우 최대경도값은 127Hv였으나, Cd을 첨가한 경우 최대경도값은 138∼146Hv로 증가하였다.

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Cu 첨가에 따른 Al-Y-Ni의 나노결정화 거동 (Nanocrystallization Behavior of Al-Y-Ni with Cu Additions)

  • 홍순직;천병선;강세선;이임렬
    • 한국분말재료학회지
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    • 제9권1호
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    • pp.19-24
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    • 2002
  • This paper reports the results of an investigation into the effect of Cu additions upon the nano-crystallization behaviour of an Al-Y-Ni alloy. 1 at.% Cu was added to a base alloy of Al/sub 88/Y₄Ni/sub 8/ either by substitution for Al to form Al/sub 87/Y₄Ni/sub 8/Cu₁, or by substitution for Ni to form Al/sub 88/Y₄Ni/sub 7/Cu₁. Consistent with previous findings in the literature, the substitution of Cu for Al was found to increase the thermal stability of the amorphous phase whereas the substitution of Cu for Ni was found to decrease its thermal stability. Comparing the microstructures of these alloys after heat treatment to produce equivalent volume fractions of Al nanocrystals showed average grain sizes of 14 nm, 12 nm and 9 nm for the alloys Al/sub 88/Y₄Ni/sub 8/, Al/sub 87/Y₄Ni/sub 8/Cu₁respectively. The effect of Cu in refining the size of the nanocrystals was attributed to enhanced nucleation increasing the number density of the nanocrystals, rather than diffusion limited or interface limited growth.

동일 알루미늄 합금의 탄식속도에 미치는 규소의 영향 (The effects of Si-content on the corrosion rate of Cu-al alloys)

  • 함동하;강탁;강춘식
    • 한국표면공학회지
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    • 제14권1호
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    • pp.5-9
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    • 1981
  • The effects of silicon content on the corrosion rates of Cu-7wt% Al alloys have been investigated by the use of electrochemical methods. The corrosion current densities of the alloys are decreased with the addition of Si up to 2wt%, and the slightly increased at 2.5%Si. This increased corrosion rates are attributed to the precipitation of more anodic gamma-2 phase. The X-ray diffraction tests reveal the dealuminumification of these alloys and mixtures of CuCl and Al2O3 formed on the surface of the specimens, which are considered to passivate the alloys at noble potentials.

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Corrosion behaviors of plasma electrolytic oxidation (PEO) treated high-silicon aluminum alloys

  • Park, Deok-Yong;Chang, Chong-Hyun;Oh, Yong-Jun;Myung, Nosang V.;Yoo, Bongyoung
    • 한국표면공학회지
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    • 제55권3호
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    • pp.143-155
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    • 2022
  • Ceramic oxide layers successfully were formed on the surface of cast Al alloys with high Si contents using plasma electrolytic oxidation (PEO) process in electrolytes containing Na2SiO3, NaOH, and additives. The microstructure of the oxide layers was systematically analyzed using scanning electron microscopy (SEM), cross-sectional transmission electron microscopy (TEM), X-ray diffraction patterns (XRD), and energy X-ray dispersive spectroscopy (EDS). XRD analysis indicated that the PEO untreated high-silicon Al alloys (i.e., 17.1 and 11.7 wt.% Si) consist of Al, Si and Al2Cu phases whereas Al2Cu phase selectively disappeared after PEO treatment. PEO process yielded an amorphous oxide layer with few second phases including γ-Al2O3 and Fe-rich phases. The corrosion behaviors of high-silicon Al alloys treated by PEO process were investigated using electrochemical impedance spectroscopy (EIS) and other electrochemical techniques (i.e., open circuit potential and polarization curve). Electroanalytical studies indicated that high-silicon Al alloys treated by PEO process have greater corrosion resistance than high-silicon alloys untreated by PEO process.

Characterization and Formation Mechanism of Zr-Cu and Zr-Cu-Al Metallic Glass Thin Film by Sputtering Process

  • Lee, Chang-Hun;Sun, Ju-Hyun;Moon, Kyoung-Il;Shin, Seung-Yong
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.271-272
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    • 2012
  • Bulk Metallic Glasses (BMGs or amorphous alloy) exhibit high strength and good corrosion resistance. Applications of thin films and micro parts of BMGs have been used a lot since its inception in the research of BMGs. However, Application and fabrication of BMGs are limited to make structural materials. Thin films of BMGs which is sputtered on the surface of structural materials by sputtering process is used to improve limits about application of BMGs. In order to investigate the difference of properties between designed alloys and thin films, we identified that thin films deposited on the surface that have the characteristic of the amorphous films and the composition of designed alloys. Zr-Cu (Cu=30, 35, 38, 40, 50 at.%) and Zr-Cu-Al (Al=10 at.% fixed, Cu=26, 30, 34, 38 at.%) alloys were fabricated with Zr (99.7% purity), Cu (99.997% purity), and Al (99.99% purity) as melting 5 times by arc melting method before rods 2mm in diameter was manufactured. In order to analyze GFA (Glass Forming Ability), rods were observed by Optical Microscopy and SEM and $T_g$, $T_x$, ($T_x$ is crystallization temperature and $T_g$ is the glass transition temperature) and Tm were measured by DTA and DSC. Powder was manufactured by Gas Atomizer and target was sintered using powder in large supercooled liquid region ($=T_x-T_g$) by SPS(Spark Plasma Sintering). Amorphous foil was prepared by RSP process with 5 gram alloy button. The composition of the foil and sputtered thin film was analyzed by EDS and EPMA. In the result of DSC curve, binary alloys ($Zr_{62}Cu_{38}$, $Zr_{60}Cu_{40}$, $Zr_{50}Cu_{50}$) and ternary alloys ($Zr_{64}Al_{10}Cu_{26}$, $Zr_{56}Al_{10}Cu_{34}$, $Zr_{52}Al_{10}Cu_{38}$) have $T_g$ except for $Zr_{70}Cu_{30}$ and $Zr_{60}Al_{10}Cu_{30}$. The compositions with $T_g$ made into powders. Figure shows XRD data of thin film showed similar hollow peak.

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Cu-Al-Mn계 형상기억합금에서 조성이 형상기억특성 및 냉간가공성에 미치는 영향 (Effect of Composition in Cu-Al-Mn Shape Memory Alloys on the Shape Memory Properties and Cold Workability)

  • 박종배;박현균
    • 열처리공학회지
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    • 제27권2호
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    • pp.59-64
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    • 2014
  • Cu-Al-Mn shape memory alloys of a variety of composition were characterized in terms of shape memory properties and cold workability. Cold workability tested by cold rolling indicated that the alloys solution treated in the ${\alpha}+{\beta}$ region have a higher ductility than those solution treated in the ${\beta}$ region. Also it is known that cold workability increased with the decrease in Al content in the ${\beta}$ region. This seems to be resulted from the fact that Mn addition causes to expand ${\beta}$ region toward lower Al content and lower order-disorder transition temperature, consequently, ${\beta}$ of excellent workability being frozen even at room temperature. Experimental results regarding shape memory showed that the properties were better with a higher Al contents at a given Mn content, which is closely related with martensitic transformation. It is also shown that super elasticity limit was enhanced with decrease in the yield strength of alloys because a lower yield strength seems to initiates slip at the lower applied stress.

석출경화된 Al-Pb-Cu계 베어링 합금의 마모거동 (The Wear Properties of the Precipitation Hardened Al-Pb-Cu Bearing Alloys)

  • 홍택기;허무영;임대순;안성욱
    • Tribology and Lubricants
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    • 제9권2호
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    • pp.56-62
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    • 1993
  • Al-Pb-Cu and Al-Si-Pb-Cu bearing alloys were produced by forced-stirring method and water-cooled copper mold casting to investigate the effect of the precipitation hardening on the wear properties. Sliding of produced alloy pin against a steel disc were performed under various applied loads. Lowering the wear rate and material transfer phenomena were explained by the strengthening of $\theta'$ precipitates on AI matrix. The transmission electron microscope observation reveals the role of the precipitates in the alloys with Cu. The movement of dislocations was hindered by precipitates which resulted in the reduction of plastic deformation at the worn surfaces.

주형점결재(鑄型粘結材)에 의한 Al-Cu합금(合金)의 응고조직(凝固組織)에 관(關)한 연구(硏究) (Effects of Mold Binders on Solidification Structures of Al-Cu Alloys)

  • 최창옥;이계완
    • 한국주조공학회지
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    • 제6권1호
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    • pp.36-46
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    • 1986
  • The effects of various kind of molds on cast structures were studied in Al-4.5% Cu and Al-8% Cu alloys. Five kinds of sand molds which were mixed with different binders and a metal mold were used. Density, dendrite arm spacing and dendrite arm length of the cast alloys were greatly affected by quantities and materials of mold binders. The macrostructures examined were entirely equiaxed grains with little influences of types of molds. It is possibly due to the separation of growing crystals from the mold wall at the inital stage of solidification.

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Effects of Mg and Cu Additions on Superplastic Behavior in MA Aluminum Alloys

  • Han, Chang-Suk;Jin, Sung-Yooun;Bang, Hyo-In
    • 한국재료학회지
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    • 제28권8호
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    • pp.435-439
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    • 2018
  • MA Al alloys are examined to determine the effects of alloying of Mg and Cu and rolling on tensile deformation behavior at 748 K over a wide strain rate range($10^{-4}-10^3/s$). A powder metallurgy aluminum alloy produced from mechanically alloyed pure Al powder exhibits only a small elongation-to-failure(${\varepsilon}_f$ < ~50%) in high temperature(748 K) tensile deformation at high strain rates(${\acute{\varepsilon}}=1-10^2/s$). ${\varepsilon}_f$ in MA Al-0.5~4.0Mg alloys increases slightly with Mg content(${\varepsilon}_f={\sim}140%$ at 4 mass%). Combined addition of Mg and Cu(MA Al-1.5%Mg-4.0%Cu) is very effective for the occurrence of superplasticity(${\varepsilon}_f$ > 500%). Warm-rolling(at 393-492 K) tends to raise ${\varepsilon}_f$. Lowering the rolling-temperature is effective for increasing the ductility. The effect is rather weak in MA pure Al and MA Al-Mg alloys, but much larger in the MA Al-1.5%Mg-4.0%Cu alloy. Additions of Mg and Cu and warm-rolling of the alloy cause a remarkable reduction in the logarithm of the peak flow stress at low strain rates (${\acute{\varepsilon}}$< ~1/s) and sharpening of microstructure and smoothening of grain boundaries. Additions of Mg and Cu make the strain rate sensitivity(the m value) larger at high strain rates, and the warm-rolling may make the grain boundary sliding easier with less cavitation. Grain boundary facets are observed on the fracture surface when ${\varepsilon}_f$ is large, indicating the operation of grain boundary sliding to a large extent during superplastic deformation.