• 제목/요약/키워드: Al matrix Composite

검색결과 341건 처리시간 0.023초

SiC 휘스커 강화 Al2O3 복합재료의 고인화 (Toughening of SiC Whisker Reinforced Al2O3 Composite)

  • 김연직;송준희
    • 한국재료학회지
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    • 제14권9호
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    • pp.649-654
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    • 2004
  • In this paper, the fracture toughness and mechanisms of failure in a random SiC-whisker/$Al_{2}O_3$ ceramic composite were investigated using in situ observations during mode I(opening) loading. $SiC_{w}/Al_{2}O_3$ composite was obtained by hot press sintering of $Al_{2}O_3$ powder and SiC whisker as the matrix and reinforcement, respectively. The whisker and powder were mixed using a turbo mill. The composite was produced at SiC whisker volume fraction of $0.3\%$. Compared with monolithic $Al_{2}O_3$, fracture toughness enhancement was observed in $SiC_{w}/Al_{2}O_3$ composite. This improved fracture toughness was attributed to SiC whisker bridging and crack deflection. $SiC_{w}/Al_{2}O_3$ composite exhibited typically brittle fracture behavior, but a fracture process zone was observed in this composite. This means that the load versus load-line displacement curve of $SiC_{w}/Al_{2}O_3$ composite from a fracture test may involve a small non-linear region near the peak load.

핫프레스법에 의한 TiNi/Al6061 형상기억복합재료의 제조 및 기계적 특성에 관한 연구 (Fabrication and Characterization of TiNi Shape Memory Alloy Fiber Reinforced 6061 Aluminum Matrix Composite by Using Hot Press)

  • 박동성;이준희;이규창;박영철
    • 대한기계학회논문집A
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    • 제26권7호
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    • pp.1223-1231
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    • 2002
  • Al alloy matrix composite with TiNi shape memory fiber as reinforcement has been fabricated by hot pressing to investigate microstructures and mechanical properties. The analysis of SEM and EDS showed that the composites have shown good interface bonding. The stress-strain behavior of the composites was evaluated at temperatures between 363K and room temperature as a function of prestrain, and it showed that the yield stress at 363K was higher than that of the room temperature. Especially, the yield stress of this composite increases with increasing the amount of prestrain, and it also depends on the volume fraction of fiber and heat treatment. The smartness of the composite is given due to the shape memory effect of the TiNi fiber which generates compressive residual stress in the matrix material when heated after being prestrained. Microstructural observation has revealed that interfacial reactions occur between the matrix and fiber, creating two intermetallic layers.

용탕가압침투법으로 제조한 ${Al_{18}}{B_4}{O_{33}}$/AS52 Mg기 복합재료의 계면 특성에 미치는 시효의 영향 (Effect of Aging on the Interfacial Characteristics of ${Al_{18}}{B_4}{O_{33}}$/AS52 Mg Matrix Composite by Squeeze infiltration)

  • 박용하;박용호;조경목;박익민
    • 한국주조공학회지
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    • 제28권6호
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    • pp.268-272
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    • 2008
  • Interfacial characteristics of aluminum borate whisker reinforced AS52 matrix composite was investigated. Peak hardness of AS52 composite was obtained aging at $170^{\circ}C$ for 15h and the aging process was accelerated by the presence of the aluminium borate whisker. The MgO layer, which was the interfacial reaction product between the reinforcement and the Mg matrix, was produced with 20 nm thickness in as-cast condition. As the aging time increased, the thickness of the interfacial reaction layer increased to 50 nm in peak aged condition. The nano-indentation test results indicated that the strength of interface was improved by the aging but over-aging degraded the reinforcement and decreased the interfacial strength which resulted in the decrease of overall composite strength.

Al-Si/SiCp 복합조직에 미치는 Rheo-compocasting의 제조조건 및 Mg첨가의 영향 (Influence of Rheo-compocasting Conditions and Mg Additions on the Microstructures in Al-Si/SiCp Composite)

  • 김석원;이의권;전우용
    • 한국주조공학회지
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    • 제13권6호
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    • pp.524-531
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    • 1993
  • Dispersion behaviors of SiC particles and microstructures in Al-2%Si/SiCp composite prepared by Rheo-compocasting were studied with change of fabrication conditions(slurry temperature, agitation time) and additions of Mg($0{\sim}3wt.%$). Also, the microhardness change of matrix, interface and total in composites were examined with additions of Mg($0{\sim}3wt.%$). The dispersion of particles in the composites became relatively homogeneous with increase of Mg additions, agitation time and decrease of slurry temperature. Rate of occupied area by particle in matrix was increased as increase of Mg additions due to improvement of wettability between SiC particle and matrix. A favorable composites were obtained by melting under Ar atmospheric SiCp injection and bottom pouring system. According to the analysis of X-ray diffraction, $Mg_2Si$, $Al_4C_3$, $SiO_2$ and MgO, etc, intermetallic compounds were formed by chemical interreaction at interface of matrix and particles. The microhardness of interface is higher than that of matrix due to more strengthening of above intermetallic compounds. It was considered that the total hardness of the composites is improved by dispersing of SiCp and addition of Mg.

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$Al_2O_3/SiC$ Hybrid-Composite에서 SiC에 질화물 코팅의 영향 (The Effect of Nitride Coating on SiC Platelet in $Al_2O_3/SiC$ Hybrid-Composite)

  • 이수영;임경호;전병세
    • 한국세라믹학회지
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    • 제34권4호
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    • pp.406-412
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    • 1997
  • Al2O3/SiC hybrid-composite has been fabricated by the conventional powder process. The addition of $\alpha$-Al2O3 as seed particles in the transformation of ${\gamma}$-Al2O3 to $\alpha$-Al2O3 provided a homogeneity of the microstructure. The grain growth of Al2O3 are significantly surpressed by the addition of nano-size SiC particles. Dislocation were produced due to the difference of thermal expansion coefficient between Al2O3 and SiC and piled up on SiC particles in Al2O3 matrix, resulting in transgranular fracture. The high fracture strength of the composite was contributed to the grain refinement and the transgranular fracture mode. The addition of SiC platelets to Al2O3/SiC nano-composite decreased the fracture strength, but increased the fracture toughness. Coated SiC platelets with nitrides such as BN and Si3N4 enhanced fracture toughness much more than non-coated SiC platelets by enhancing crack deflection.

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다공질 Ni 및 Ni-Cr으로 강화한 AC4C 복합재료의 제조 및 특성연구 (A Study for Characteristic and Manufacturing of Porous Ni/AC4C and Ni-Cr/AC4C Composites)

  • 김용현;김억수;여인동;이광학
    • 한국주조공학회지
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    • 제20권1호
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    • pp.21-28
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    • 2000
  • Ni and Ni-Cr porous metals which are estimated to be easy to fabricate by squeeze casting are used as strengtheners for composite materials. As a matrix material, Al-7%wtSi-0.3 wt%Mg(AC4C) has been used. In case of Ni/AC4C and Ni-Cr/AC4C composite, $750^{\circ}C$ melt temperature and minimum 25 MPa squeezing pressure are needed to produce sound composite materials. The observation of interfacial reaction zone at various heat treatment condition showed that solutionizing temperature of above 520^{\circ}C$, the interfacial reaction zone increased proportionally with increasing heat treatment tim and reaction products formed by interfacial reaction are mainly composed of $Al_3Ni$ and $Al_3Ni_2$ phases. The tensile strength of Ni/AC4C and Ni-Cr/AC4C composite is lower than the matrix metal and this can be explained by the brittle intermetallic compounds formed at the interface of Ni and Ni-Cr reinforcements. But the properies of hardness, wear resistance and thermal expansion are better than the matrix due to the strengthening effect of Ni-Cr porous metals.

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전자패키징용 고열전도도-저열팽창계수 SiCp/Al 금속복합재료의 제조공정 및 특성평가 (Fabrication Process and Characterization of High Thermal Conductivity-Low CTE SiCp/Al Metal Matrix Composites for Electronic Packaging Applications)

  • 이효수;홍순형
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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    • pp.190-194
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    • 2000
  • The fabrication process and thermal properties of 50∼76vo1% SiCp/Al metal matrix composites (MMCs) were investigated. The 50∼76vo1% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 85∼170W/mK and coefficient of thermal expansion (CTE) were ranged 10∼6ppm/K. Specially, the thermal conductivity and CTE of 71vo1%SiCp/Al MMCs were ranged l15∼156W/mK and 6∼7ppm/K, respectively, which showed a improved thermal properties than the conventional electronic packaging materials such as ceramics and metals.

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