• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.11b
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• pp.855-860
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• 2001

As being inconvenient to apply reinforced concrete structure to high-rise buildings. it is applied steel structured system. Therefore light-weight wall systems are applied as partition wall to reduce the self-load of the building. But. the required performances of a light-weight wall are not evaluated systematically. As a field survey result. partition walls of house-to-house and room-to-room were not showed their respected performances. so the dwellers are feel so worse the quality of the whole building. In steel-structured high-rise buildings especially. occupant's dissatisfaction concerned indoor noise was high because curtain wall systems having a high air-tight performance isolate the outdoor noise making masking effect. Also to suppress indoor air movement. stact effect must be concerned. Therefore wall systems which have high performances of sound insulation and air-tightness are required in high-rise buildings.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.4
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• pp.1879-1884
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• 2014

Recently, the micro bonding technology comes into the spotlight as the miniaturization of the electronic product. The micro bonding technique can classify by way of laser welding and ultrasonic bonding and etc. However, the research on the micro bonding is much lacks. In this paper, carried out the cooling analysis of the 60 [kHz] ultrasonic bonding equipment to know heat effect of the piezoelectric element when the ultrasonic bonding equipment was operated. The ultrasonic horn having the natural frequency with 60 [kHz] for the dissimilar material bonding of the glass and solder tried to be designed. The parameters and response was set through the basic experiment. The dissimilar material bonding strength analysis using the 60 [kHz] ultrasonic bonding equipment was done. We carried out the bonding for improving bonding strength to using the silver paste. air thightness of bonding surface was confirmed by analysis of bonding interfaces.