• Journal of Soil and Groundwater Environment
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• v.15 no.1
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• pp.1-8
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• 2010

Cometabolic air sparging (CAS) is a new and innovative technology that uses air sparging principles but attempts to optimize in situ contaminant degradation by adding a growth substrate to saturated zone. CAS relies on the degradation of the primary growth substrate and cometabolic substrate transformation in the saturated zone and in the vadose zone for volatilized contaminants. In this study, we have investigated to determine MTBE degradation pattern and microbial activity variation if using propane as a primary substrate at the condition of considering air injection rate and air injection pattern. Laboratory-scale two-dimentional aquifer physical model studies were used and the experimental results were represented that the optimal conditions were as air injection rate of 1,000 mL/min and pulsed air injection pattern (15 min on/off). Over 1,000 mL/min air injection rate and continuous air injection pattern was no affected to increase DO concentration. On the other hand, Injection of propane and propane-utilizing bacteria degraded MTBE partially. And also, injection of propane- and MTBE-utilizing bacteria effectively degraded MTBE and TBA production was observed.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.9
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• pp.1070-1076
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• 2007

In this paper, we study the characteristics of dual band microstrip antenna with the wedge-shaped radiation patch added the slot using air substrate. Wedge-shaped patch antenna with air substrate is avoided the large probe reactance associated with a thick substrate owing to the use of short probe and good impedance matching over a wide frequency range can be obtained. Slot on the antenna radiator varies the reactance component according to the employed frequency and affect the resonance freaqency of the antenna, therefore the antenna can resonate at the dual band(cellular and PCS band). The slot length and position have an effect on the bandwidth and input impedance of the antenna are optimized by simulation. From the experiment results for the fabricated antenna, -10 dB of $S_{11}$ is content with the allocated bandwidth of Cellular and PCS system and - 15 dB of cross polarization level. From the results of this paper, it has been confirmed that the proposed antenna can be used as the base station antenna fur Cellular and PCS band.

• Journal of electromagnetic engineering and science
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• v.18 no.3
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• pp.160-168
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• 2018

A wide spectrum of potential applications using substrate integrated waveguide (SIW) technologies in conjunction with air hole regions is introduced, and an efficient optimization methodology to cope with the multiple air hole effect in SIW applications is proposed. The methodology adopts a genetic algorithm to obtain optimum air hole dimensions for the specific propagation constant that can be accurately calculated using the recursive and closed form equations presented. The optimization results are evaluated by designing an SIW bandpass filter, and they show excellent performance. The optimization methodology using the proposed equations is effective in performance enhancement for the purposes of low loss and broadband SIW applications.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.12-18
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• 2024

A Electrostatic chuck is a device that fixes the substrate, using the force between charges applied between two parallel plates to attract substrates such as wafers or OLED panels. Unlike mechanical suction methods, which rely on physical fixation, this method utilizes the force of electrostatics for fixation, making it important to verify the adhesion force. As the size of the substrate increases, deformations due to gravity or chucking force also increase, and the adhesion force decreases rapidly as the distance between the chuck and the substrate increases. The outlook for displays is shifting from small to large OLEDs, necessitating consideration of substrate deformations. In this paper, to confirm the deformation of the substrate through various patterns, a simplified 2D model using Ansys' electromagnetic field analysis program, Maxwell, and the static structural analysis program, Mechanical, was utilized to observe changes in adhesion force according to the variation in the air gap between the substrate and the chuck. Additionally, the chucking force was analyzed for the size of the substrate, and the deformation of the substrate was confirmed when gravity and chucking force act simultaneously.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.5
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• pp.616-621
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• 2010

New type of the base material of the light-emitting diode requires copper wafer in view of heat and electrical conductance. Therefore, polishing process of the substrate level is needed to get a nanometer level of surface roughness as compared with pattern structure of nano-size in the semiconductor industry. In this paper, a series of lapping and polishing technique is shown for the rough and deflected copper substrate of thickness 3mm. Lapping by sand papers tried air cooling method. And two steps of polishing used the diamond abrasives and the $Al_2O_3$ slurry of size 100mm considering the residual scratch. White-light interferometer proved successfully a mirror-like surface roughness of Ra 6nm on the area of $0.56mm{\times}0.42mm$.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.12
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• pp.28-32
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• 2015

In this work, we reported fabrication of sealing the glass substrate using laser treatment at low temperature for electrochemical luminescence (ECL) cell. The laser treatment at temperature is using laser diode. The glass substrate sealing by laser treatment tested at 3-10W, 2-5 mm/s for build and tested. The sealing laser treatment method will allow associate coordination between the two glass substrate was enclosed. The effect of laser treatment to sealing the glass substrate was found to have cracks and air gap at best thickness of about 550-600 im for condition 3 W, 3 mm/s. The surface of sealing was roughness which was not influent to electrodes It can reduce the cracks, crevices and air gaps as well, improves the performance viscosity in butter bus bar electrodes. Therefore, it is more effective viscosity between two FTO glasses substrate.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.11 no.7
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• pp.3393-3412
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• 2017

As a main challenge in network virtualization, virtual network embedding problem is increasingly important and heuristic algorithms are of great interest. Aiming at the problems of poor correlation in node embedding and link embedding, long distance between adjacent virtual nodes and imbalance resource consumption of network components during embedding, we herein propose a two-stage virtual network embedding algorithm NA-PVNM. In node embedding stage, resource requirement and breadth first search algorithm are introduced to sort virtual nodes, and a node fitness function is developed to find the best substrate node. In link embedding stage, a path fitness function is developed to find the best path in which available bandwidth, CPU and path length are considered. Simulation results showed that the proposed algorithm could shorten link embedding distance, increase the acceptance ratio and revenue to cost ratio compared to previously reported algorithms. We also analyzed the impact of position constraint and substrate network attribute on algorithm performance, as well as the utilization of the substrate network resources during embedding via simulation. The results showed that, under the constraint of substrate resource distribution and virtual network requests, the critical factor of improving success ratio is to reduce resource consumption during embedding.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.10 no.2
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• pp.522-541
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• 2016

Network virtualization provides an effective way to overcome the Internet ossification problem. As one of the main challenges in network virtualization, virtual network embedding refers to mapping multiple virtual networks onto a shared substrate network. However, existing heuristic embedding algorithms evaluate the embedding potential of the nodes simply by the product of different resource attributes, which would result in an unbalanced embedding. Furthermore, ignoring the hops of substrate paths that the virtual links would be mapped onto may restrict the ability of the substrate network to accept additional virtual network requests, and lead to low utilization rate of resource. In this paper, we introduce and extend five node attributes that quantify the embedding potential of the nodes from both the local and global views, and adopt the technique for order preference by similarity ideal solution (TOPSIS) to rank the nodes, aiming at balancing different node attributes to increase the utilization rate of resource. Moreover, we propose a novel two-stage virtual network embedding algorithm, which maps the virtual nodes onto the substrate nodes according to the node ranks, and adopts a shortest path-based algorithm to map the virtual links. Simulation results show that the new algorithm significantly increases the long-term average revenue, the long-term revenue to cost ratio and the acceptance ratio.

• Journal of the Semiconductor & Display Technology
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• v.19 no.4
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• pp.46-50
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• 2020

In this research, the attractive force of Coulomb type electrostatic chuck(ESC), which consisted of alumina dielectric, on glass substrate was studied by using the finite element analysis. The attractive force is caused by the high electrical resistance which occurs in contact region between glass substrate and dielectric layer. This research tries the simple geometrical modeling of ESC and glass substrate with air gap. The influences of the applied voltage, and air gap are investigated. When alumina dielectric with 1014 Ω·cm, 1.5 kV voltage, and 0.01 mm air gap were applied, electrostatic force in this work reached to 4 gf/㎠. This results show that the modeling of air gap is essential to derive the attractive force of the ESC.

• Journal of the Korean Ceramic Society
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• v.31 no.4
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• pp.381-388
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• 1994

A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.