• 마이크로전자및패키징학회지
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• 제17권2호
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• pp.55-61
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• 2010

탄탈륨실리사이드 히터가 내장된 소자를 Ag 페이스트와 Au SBB(Stud Bump Bonding)를 이용하여 Au가 코팅 된 기판에 각각 접합 하였다. 전단 테스트와 전류를 흐르면서 열 성능을 측정하였다. Au 스터드 범프 본딩의 최적 플립칩 접합조건은 전단 후 파괴면 관찰하여 설정하였으며, 기판 온도를 $350^{\circ}C$, 소자 온도를 $250^{\circ}C$에서 하중을 300 g/bump 로 하여 접합하는 경우가 최적 조건이였다. 히터에 5 W 인가시 소자의 온도는 Ag 페이스트를 이용한 접합의 경우 최대 온도는 약 $50^{\circ}C$이었으며, Au 금속층을 갖고 있는 실리콘 기판에 Au 스터드 본딩으로 접합된 인 경우 약 $64^{\circ}C$를 나타내었다. 기판과의 접촉면적이 와이어본딩과 Au 스터드 범프 본딩 가 약 300배가 차이가 나는 경우 약 $14^{\circ}C$ 차이를 나타내었고, 전사모사를 통하여 접합면의 접촉저항이 중요한 이유임을 알 수 있었다.

• 한국분말재료학회지
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• 제24권5호
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• pp.395-399
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• 2017

Solder paste is widely used as a conductive adhesive in the electronics industry. In this paper, nano and microsized mixed lead-free solder powder (Sn-Ag-Cu) is used to manufacture solder paste. The purpose of this paper is to improve the storage stability using different types of solvents that are used in fabricating the solder paste. If a solvent of sole acetate is used, the nano sized solder powder and organic acid react and form a Sn-Ag-Cu malonate. These formed malonates create fatty acid soaps. The fatty acid soaps absorb the solvents and while the viscosity of the solder paste rises, the storage stability and reliability decrease. When ethylene glycol, a dihydric alcohol, is used the fatty acid soaps and ethylene glycol react, preventing the further creation of the fatty acid soaps. The prevention of gelation results in an improvement in the solder paste storage ability.

• 한국인쇄학회지
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• 제30권3호
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• pp.45-56
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• 2012

Printing technology is accepted by appropriate technology that smart phones, tablet PC, display(LCD, OLED, etc.) precision recently in the electronics industry, the market grows, this process in the ongoing efforts to improve competitiveness through the development of innovative technologies. So printed electronics appeared by new concept. This technology development is applied on electronic components and circuits for the simplification of the production process and reduce processing costs. Low-temperature process making possible for widening, slimmer, lighter, and more flexible, plastic substrates, such as(flexible) easily by forming a thin film on a substrate has been studied. In the past, the formation of the electrode used a screen printing method. But the screen printing method is formation of fine patterns, high-speed printing, mass production is difficult. The roll-to-roll printing method as an alternative to screen printing to produce electronic devices by printing techniques that were used traditionally in the latest technology and processing techniques applied to precision control are very economical to implement fine-line printing equipment has been evaluated as. In order to function as electronic devices, especially the dozens of existing micro-level of non-dot print fine line printing is required, the line should not break at all, because according to the specifications required to fit the ink transfer conditions should be established. In this study of roll-to-roll printing conductive paste suitable for gravure offset printing by developing Ag paste for forming fine patterns to study the basic physical properties with the aim of this study were to.

• 한국전기전자재료학회논문지
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• 제26권12호
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• pp.858-862
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• 2013

The front electrode should be used to make solar cell panel so as to collect electron. The front electrode is used by paste type, printed on the Si-solar cell wafer and sintered at about $800^{\circ}C$. The paste is composed Ag powder and glass frit which make the ohmic contact between Ag electrode and n-type semiconductor layer. From the previous study, the Ag electrodes which used two commercial glass frit of Bi-system were so different on the interface resistance. The main composition of them was Bi-Zn-B-Si-O and few additives added in one of them. In this study, glass frit was made with the ratio of $Bi_2O_3$ and ZnO on the main composition, and then paste using glass frit was prepared respectively. And, also, the paste using the glass frit added oxide additives were prepared. The change of interface resistance was not large with the ratio of $Bi_2O_3$ and ZnO. In the case of G6 glass frit, 78 wt% $Bi_2O_3$ addition, the interface resistance was $190{\Omega}$ and most low. In the glass frit added oxide, the case of Ca increased over 10 times than it of G6 glass frit on the interface resistance. It was thaught that after sintering, Ca added glass frit was not flowed to the interface between Ag electrode and wafer but was in the Ag electrode.

• 한국인쇄학회지
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• 제26권1호
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• pp.39-50
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• 2008

We have manufactured Ag pastes for gravure printing by adding different solvent contents. Then the gravure printability and properties of conductive patterns gravure-printed by the different rheology characteristics of pastes were investigated. The dispersity of pastes was increased and the viscosity and shear rate dependence of viscosity for pastes were decreased by increasing the solvent content. Also storage modulus G', loss modulus G" and angular frequency value when G" starts to be bigger than G' of pastes were increased by decreasing the solvent content. These mean a flow drop of paste. As a result of gravure printing using two plates which have different line counts(175line and 350line), conductive patterns printed using 175line were spreaded more but Ag packing, thickness and conductivity of the conductive patterns were better than those printed using 350line. And the spread values of conductive patterns were increased with solvent contents but the best properties for Ag packing, surface roughness and conductivity of the conductive pattern were obtained by paste (3) which has 550cps of viscosity at $100s^{-1}$ and tan ${\delta}$ > 1 at 10rad/s. As a result of gravure printing using 350 line plate and paste (3), the conductive pattern has $1.2{\mu}m$ of film thickness and $1.9{\times}10^{-5}{\Omega}{\cdot}cm$ of conductivity.

• 한국인쇄학회지
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• 제29권2호
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• pp.45-58
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• 2011

Gravure off-set printing recently is used in electronics display market. This method has advantages of mass production and high printing speed. It is also fine pattern can be implemented. We have manufactured low-curable conductive Ag pastes for gravure off-set printing. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape and size, epoxy resin, solvent and homogenized on a standard three-roll mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had a good characteristics. With the manufactured paste in this study, touch panel had is manufactured and it had $4{\times}10-5{\Omega}.cm$.

• Journal of Welding and Joining
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• 제18권3호
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• pp.89-96
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• 2000

As solder becomes small and fine, the reliability and solderability of solder joint are the critical issue in present electronic packaging industry. Besides the use of lead(Pb) containing solders for the interconnections of microelectronic subsystem assembly and packaging has enviromental problem. In this study, using Sn/Pb and Sn/Ag eutectic solder paste, in order to obtain decrease of solder joint strength with increasing aging time, initial solder joint strength and aging strength after 1000 hour aging at $100^{\circ}C$ were measured by peel test. And in order to obtain the growth of intermetallic compound(IMC) layer thickness, IMC layer thickness was measured by scanning electron microscope(SEM). As a result, solder joint strength was decreased with increasing aging time. The mean IMC layer thickness was increased linearly with the square root of aging time. The diffusion coefficient(D) of IMC layer was found to $1.29{\times}10^{-13}{\;}cm^2/s$ at using Sn/Pb solder paste, 7.56{\times}10^{-14}{\textrm}{cm}^2/s$ at using Sn/Ag solder paste.

• 대한전자공학회논문지SD
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• 제45권5호
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• pp.12-18
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• 2008

본 연구는 PC(polycarbonate) 기판 위에 소스(source)/드레인(drain) 전극으로 Ag 페이스트를 스크린 인쇄하여 OTFT(organic thin film transistor)를 제작하였다. 또한 이렇게 제작된 OTFT를 적용하여 OTFT-OLED(organic light emitting diode) 어레이를 제작하였으며 OTFT의 소스 및 드레인 전극과 더불어 데이터 배선전극을 Ag 페이스트를 이용하여 형성하였다. Ag 페이스트는 스크린 마스크의 mesh에 따라 325 mesh용과 500 mesh용을 사용하였으며, 325 mesh용 페이스트는 선폭 60 ${\mu}m$, 500 mesh용 페이스트는 선폭 40 ${\mu}m$까지 인쇄가 가능하였다. 그리고 면저항은 각각 $60m{\Omega}/\square,\;133.1m{\Omega}/\square$이었다. 제작된 OTFT의 성능은 이동도가 자각 0.35 $cm^2/V{\cdot}sec$와 0.12 $cm^2/V{\cdot}sec$, 문턱전압 -4.7 V와 0.9 V이었으며, 전류 점멸비는 ${\sim}10^5$이었다. OTFT-OLED 어레이는 인쇄성이 우수한 500 mesh용 Ag 페이스트를 사용하였으며 OTFT의 채널길이를 50 ${\mu}m$로 설계하여 제작하였다. OTFT-OLED 어레이의 화소는 2개의 OTFT, 1개의 캐패시터 그리고 1개의 OLED로 구성하였고, 크기는 $2mm{\times}2mm$이며, 해상도는 $16{\times}16$ 이다. 제작된 어레이는 일부 불량 화소를 포함하고 있지만 능동형 모드로 동작함을 확인할 수 있었다.

• 마이크로전자및패키징학회지
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• 제10권4호
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• pp.47-52
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• 2003

PDP전극용 Ag전극 페이스트의 프릿으로 기존의 Pb-based 프릿을 대신 할 수 있는 Bi-based 조성의 새로운 유리조성의 가능성을 검토하였다. PDP디스플레이 응용을 위해 프릿의 저융점화 및 열팽창계수 제어를 행하였고, 이를 전극 페이스트 제조에 적용하여 스크린 프린팅된 전극을 평가하였다. $Bi_2O_3$를 50-60wt%이상 첨가된 $Bi_2O_3-B_2O_3-Al_2O_3$계 조성의 프릿은 연화점이 400∼$480^{\circ}C$, 열팽창계수가 7.31∼$10.02\times 10^{-6}/^{\circ}C$이며, 전극의 단자저항은 4.1∼4.8$\Omega$ 이었다. 본 연구에서 새로이 개발된 Bi계 프릿조성은 Pb계 조성의 프릿에 상당하는 물성을 얻을 수 있었으며, 이를 전극용 페이스트에 적용한 결과, 전극 프린팅에서 퍼짐성과 균일성이 우수하였다. PDP전극용 무연, 무 알카리 프릿으로 Bi계 조성의 적용가능성을 확인할 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.463-464
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• 2006

광산업 및 디스플레이 산업의 발전에 따라 관련 제품의 핵심 부품 및 소재 개발이 매우 중요하게 대두되고 있다. 전계방출 소자 및 back light가 되는 나노 발광체의 핵심소재중 하나인 CNT paste는 국내외에서 연구가 진행중이다. 본 연구에서는 메탄올속에서 초음파를 이용하여 분산시킨 CNT 분말, 유기 바인더, 용매, glass frit, Ag powder 등을 사용하여 paste를 만들고, TGA(Thermogravimetric Analyzer)와 SEM(Scanning Electron Microscopy) 분석에 의해 제조 공정의 최적화를 실시하였다.